PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-4: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - COMPONENTS WITH J LEADS ON TWO SIDES

Published date

23-11-2007

Publisher

European Committee for Standards - Electrical

FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 General information
  3.1 General component description
  3.2 Marking
  3.3 Packaging
  3.4 Process considerations
4 Small outlined J packages (SOJ)
  4.1 Component description
  4.2 Component dimensions
  4.3 Solder joint fillet design
  4.4 Land pattern dimensions
Annex ZA (normative) - Normative references to international
                       publications with their corresponding
                       European publications
Bibliography

Provides the component and land pattern dimensions for small outline integrated circuits with 'J' leads on two sides (SOJ components) used in the reflow soldering process.

Committee	SR 91
DevelopmentNote	To be read in conjunction with EN 61188-5-1. (12/2007)
DocumentType	Standard
PublisherName	European Committee for Standards - Electrical
Status	Current

Standards	Relationship
NF EN 61188-5-4 : 2016	Identical
IEC 61188-5-4:2007	Identical
NBN EN 61188-5-4 : 2008	Identical
NEN EN IEC 61188-5-4 : 2007	Identical
I.S. EN 61188-5-4:2007	Identical
PN EN 61188-5-4 : 2008	Identical
UNE-EN 61188-5-4:2007	Identical
BS EN 61188-5-4:2007	Identical
CEI EN 61188-5-4 : 2008	Identical
DIN EN 61188-5-4:2008-07	Identical

EN 60286-5:2004/A1:2009	PACKAGING OF COMPONENTS FOR AUTOMATIC HANDLING - PART 5: MATRIX TRAYS
IEC 60068-2-58:2015+AMD1:2017 CSV	Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
EN 61188-5-1:2002	Printed boards and printed board assemblies - Design and use - Part 5-1: Attachment (land/joint) considerations - Generic requirements
EN 61760-1:2006	SURFACE MOUNTING TECHNOLOGY - PART 1: STANDARD METHOD FOR THE SPECIFICATION OF SURFACE MOUNTING COMPONENTS (SMDS)
IEC 61760-1:2006	Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs)
EN 61191-2:2017	Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
IEC 60286-5:2003+AMD1:2009 CSV	Packaging of components for automatic handling - Part 5: Matrixtrays
EN 60286-3:2013/AC:2013	PACKAGING OF COMPONENTS FOR AUTOMATIC HANDLING - PART 3: PACKAGING OF SURFACE MOUNT COMPONENTS ON CONTINUOUS TAPES (IEC 60286-3:2013)
IEC 61191-1:2013	Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
IEC 61188-5-1:2002	Printed boards and printed board assemblies - Design and use - Part 5-1: Attachment (land/joint) considerations - Generic requirements
IEC 61191-2:2017	Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
EN 61191-1:2013	PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES (IEC 61191-1:2013)
IEC 60286-3:2013	Packaging of components for automatic handling - Part 3: Packaging of surface mount components on continuous tapes
EN 60286-4:2013	Packaging of components for automatic handling - Part 4: Stick magazines for electronic components encapsulated in packages of different forms
IEC 60286-4:2013	Packaging of components for automatic handling - Part 4: Stick magazines for electronic components encapsulated in packages of different forms