Printed boards and printed board assemblies - Design and use - Part 5-5: Attachment (land/joint) considerations - Components with gull-wing leads on four sides

Published date

23-11-2007

Publisher

European Committee for Standards - Electrical

FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 General information
  3.1 General component description
  3.2 Marking
  3.3 Carrier packaging format
  3.4 Process considerations
4 PQFP (square)
  4.1 Field of application
  4.2 Component descriptions
  4.3 Component dimensions
  4.4 Solder joint fillet design
  4.5 Land pattern dimensions
5 PQFP (rectangular)
  5.1 Field of application
  5.2 Component descriptions
  5.3 Component dimensions
  5.4 Solder joint fillet design
  5.5 Land pattern dimensions
6 PLQFP (square)
  6.1 Field of application
  6.2 Component descriptions
  6.3 Component dimensions
  6.4 Solder joint fillet design
  6.5 Land pattern dimensions
7 PLQFP (rectangular)
  7.1 Field of application
  7.2 Component descriptions
  7.3 Component dimensions
  7.4 Solder joint fillet design
  7.5 Land pattern dimensions
8 PTQFP (square)
  8.1 Field of application
  8.2 Component descriptions
  8.3 Component dimensions
  8.4 Solder joint fillet design
  8.5 Land pattern dimensions
Annex ZA (normative) - Normative references to international
                       publications with their corresponding
                       European publications
Bibliography

Provides information on land pattern geometries used for the surface attachment of electronic components with gull-wing leads on four sides. The intent of the information presented herein is to provide the appropriate size, shape and tolerances of surface mount land patterns to ensure sufficient area for the appropriate solder fillet, and also allow for inspection, testing and reworking of those solder joints.

Committee	CLC/SR 91
DevelopmentNote	To be read in conjunction with EN 61188-5-1. (11/2007)
DocumentType	Standard
PublisherName	European Committee for Standards - Electrical
Status	Current

Standards	Relationship
BS EN 61188-5-5:2007	Identical
IEC 61188-5-5:2007	Identical
I.S. EN 61188-5-5:2007	Identical
UNE-EN 61188-5-5:2007	Identical
NBN EN 61188-5-5 : 2008	Identical
DIN EN 61188-5-5:2008-07	Identical
CEI EN 61188-5-5 : 2008	Identical
NF EN 61188-5-5 : 2016	Identical
PN EN 61188-5-5 : 2008	Identical
NEN EN IEC 61188-5-5 : 2007	Identical

IEC 60068-2-58:2015+AMD1:2017 CSV	Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
EN 61188-5-1:2002	Printed boards and printed board assemblies - Design and use - Part 5-1: Attachment (land/joint) considerations - Generic requirements
IEC 60068-2-54:2006	Environmental testing - Part 2-54: Tests - Test Ta: Solderability testing of electronic components by the wetting balance method
IEC 61191-1:2013	Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
IEC 61188-5-1:2002	Printed boards and printed board assemblies - Design and use - Part 5-1: Attachment (land/joint) considerations - Generic requirements
EN 61191-1:2013	PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES (IEC 61191-1:2013)
EN 60068-2-54:2006	Environmental testing - Part 2-54: Tests - Test Ta: Solderability testing of electronic components by the wetting balance method