TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 11: MEASUREMENT OF MELTING TEMPERATURE OR MELTING TEMPERATURE RANGES OF SOLDER ALLOYS

Published date

28-06-2013

Publisher

European Committee for Standards - Electrical

FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 Summary of measuring methods
5 Test equipment
6 Calibration of the temperature
7 Procedure for the measuring method
Annex A (normative) - Test report on melting temperatures
        of solder alloys
Annex B (informative) - Examples of test result (Method A)
Annex C (informative) - Example of test result (Method B)
Annex ZA (normative) - Normative references to international
         Publications with their corresponding
         European publications
Bibliography

IEC 61189-11:2013 describes the measurement method of melting ranges of solder alloys that are mainly used for wiring of electrical equipment, for electrical and communication equipment, and for other apparatus, as well as for connecting components.

Committee	SR 91
DocumentType	Test Method
PublisherName	European Committee for Standards - Electrical
Status	Current

Standards	Relationship
IEC 61189-11:2013	Identical
NBN EN 61189-11 : 2013	Identical
NEN EN IEC 61189-11 : 2013	Identical
I.S. EN 61189-11:2013	Identical
PN EN 61189-11 : 2013	Identical
UNE-EN 61189-11:2013	Identical
SN EN 61189-11:2013	Identical
BS EN 61189-11:2013	Identical
CEI EN 61189-11 : 2014	Identical
DIN EN 61189-11:2014-02	Identical

EN 62878-1-1:2015	Device embedded substrate - Part 1-1: Generic specification - Test methods
BS EN 62878-1-1:2015	Device embedded substrate Generic specification. Test methods

EN ISO 11357-1:2016	Plastics - Differential scanning calorimetry (DSC) - Part 1: General principles (ISO 11357-1:2016)
IEC 61189-1:1997+AMD1:2001 CSV	Test methods for electrical materials, interconnection structures and assemblies - Part 1: General test methods and methodology
EN 61189-3:2008	Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)
EN ISO 9453:2014	Soft solder alloys - Chemical compositions and forms (ISO 9453:2014)
IEC 61189-3:2007	Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)
IEC 60194:2015	Printed board design, manufacture and assembly - Terms and definitions
ISO 9453:2014	Soft solder alloys Chemical compositions and forms
EN 61190-1-3:2007/A1:2010	ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-3: REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDER FOR ELECTRONIC SOLDERING APPLICATIONS
ISO 11357-1:2016	Plastics — Differential scanning calorimetry (DSC) — Part 1: General principles
EN 60194:2006	Printed board design, manufacture and assembly - Terms and definitions
IEC 61190-1-3:2007+AMD1:2010 CSV	Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications

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EN 61189-11 : 2013

TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 11: MEASUREMENT OF MELTING TEMPERATURE OR MELTING TEMPERATURE RANGES OF SOLDER ALLOYS

Table of Contents

Abstract

General Product Information

International Equivalents

Standards Referenced By This Book

Standards Referencing This Book

Category

Subcategory