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  • EN 61189-3:2008

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    TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 3: TEST METHODS FOR INTERCONNECTION STRUCTURES (PRINTED BOARDS)

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    Published date:  08-01-2008

    Publisher:  European Committee for Standards - Electrical

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    Table of Contents - (Show below) - (Hide below)

    FOREWORD
    INTRODUCTION
    1 Scope and object
    2 Normative references
    3 Accuracy, precision and resolution
    4 Catalogue of approved test methods
    5 P: Preparation/conditioning test methods
    6 V: Visual test methods
    7 D: Dimensional test methods
    8 C: Chemical test methods
    9 M: Mechanical test methods
    10 E: Electrical test methods
    11 N: Environmental test methods
    12 X: Miscellaneous test methods
    Annex A (informative) - Worked examples
    Annex ZA (normative) - Normative references to
             international publications with their
             corresponding European publications

    Abstract - (Show below) - (Hide below)

    Provides a catalogue of test methods representing methodologies and procedures that can be applied to test materials used for manufacturing interconnection structures (printed boards) and assemblies.

    General Product Information - (Show below) - (Hide below)

    Committee SR 91
    Development Note To be read in conjunction with EN 61189-1, EN 61189-2, EN 61189-5, EN 61189-6 and EN 60068 (series). (03/2008)
    Document Type Test Method
    Publisher European Committee for Standards - Electrical
    Status Current

    Standards Referenced By This Book - (Show below) - (Hide below)

    EN 60664-3:2017 INSULATION COORDINATION FOR EQUIPMENT WITHIN LOW-VOLTAGE SYSTEMS - PART 3: USE OF COATING, POTTING OR MOULDING FOR PROTECTION AGAINST POLLUTION (IEC 60664-3:2016)
    BS EN 61249-8-8 : 1997 MATERIALS FOR INTERCONNECTION STRUCTURES - SECTIONAL SPECIFICATION SET FOR NON-CONDUCTIVE FILMS AND COATINGS - TEMPORARY POLYMER COATINGS
    BS EN 62137-4 : 2014 ELECTRONICS ASSEMBLY TECHNOLOGY - PART 4: ENDURANCE TEST METHODS FOR SOLDER JOINT OF AREA ARRAY TYPE PACKAGE SURFACE MOUNT DEVICES
    CEI EN 61249-4-1 : 2010 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-1: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD (FOR THE MANUFACTURE OF MULTILAYER BOARDS) - EPOXIDE WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY
    BS EN 61192-4 : 2003 WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - PART 4: TERMINAL ASSEMBLIES
    BS EN 62326-20 : 2016 PRINTED BOARDS - PRINTED CIRCUIT BOARDS FOR HIGH-BRIGHTNESS LEDS
    BS EN 61189-5 : 2006 TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5: TEST METHODS FOR PRINTED BOARD ASSEMBLIES
    BS EN 61249-4-1 : 2008 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-1: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD (FOR THE MANUFACTURE OF MULTILAYER BOARDS) - EPOXIDE WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY
    BS EN 61188-1-2 : 1998 PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - GENERIC REQUIREMENTS - CONTROLLED IMPEDANCE
    BS EN 61189-11:2013 (published 2013-07) Test methods for electrical materials, printed boards and other interconnection structures and assemblies Measurement of melting temperature or melting temperature ranges of solder alloys
    BS EN 62878-1-1 : 2015 DEVICE EMBEDDED SUBSTRATE - PART 1-1: GENERIC SPECIFICATION - TEST METHODS
    BS EN 61192-1 : 2003 WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - PART 1: GENERAL
    I.S. EN 61189-11:2013 TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 11: MEASUREMENT OF MELTING TEMPERATURE OR MELTING TEMPERATURE RANGES OF SOLDER ALLOYS (IEC 61189-11:2013 (EQV))
    12/30258453 DC : 0 BS EN 62368-1 AMD - AUDIO/VIDEO, INFORMATION AND COMMUNICATION TECHNOLOGY EQUIPMENT - PART 1: SAFETY REQUIREMENTS
    BS EN 62326-1 : 2002 PRINTED BOARDS - PART 1: GENERIC SPECIFICATION
    BS EN 61190-1-1 : 2002 ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - REQUIREMENTS FOR SOLDERING FLUXES FOR HIGH-QUALITY INTERCONNECTIONS IN ELECTRONICS ASSEMBLY
    NF EN 61249 8-8 : 1998 MATERIALS FOR INTERCONNECTION STRUCTURES - PART 8: SECTIONAL SPECIFICATION SET FOR NON-CONDUCTIVE FILMS AND COATINGS - SECTION 8: TEMPORARY POLYMER COATINGS
    I.S. EN 61189-5:2006 TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5: TEST METHODS FOR PRINTED BOARD ASSEMBLIES
    I.S. EN 61189-2:2006 TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 2: TEST METHODS FOR MATERIALS FOR INTERCONNECTION STRUCTURES
    CEI EN 62878-1-1 : 2016 DEVICE EMBEDDED SUBSTRATE - PART 1-1: GENERIC SPECIFICATION - TEST METHODS
    I.S. EN 62326-20:2016 PRINTED BOARDS - PART 20: PRINTED CIRCUIT BOARDS FOR HIGHBRIGHTNESS LEDS
    I.S. EN 61192-1:2003 WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - GENERAL
    BS EN 60664-3:2017 INSULATION COORDINATION FOR EQUIPMENT WITHIN LOW-VOLTAGE SYSTEMS - PART 3: USE OF COATING, POTTING OR MOULDING FOR PROTECTION AGAINST POLLUTION (IEC 60664-3:2016)
    I.S. EN 60664-3:2017 INSULATION COORDINATION FOR EQUIPMENT WITHIN LOW-VOLTAGE SYSTEMS - PART 3: USE OF COATING, POTTING OR MOULDING FOR PROTECTION AGAINST POLLUTION
    CEI EN 62326-1 : 2002 PRINTED BOARDS - PART 1: GENERIC SPECIFICATION
    I.S. EN 62326-1:2002 PRINTED BOARDS - GENERIC SPECIFICATION
    I.S. EN 61249-4-1:2008 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-1: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD (FOR THE MANUFACTURE OF MULTILAYER BOARDS) - EPOXIDE WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY
    I.S. EN 61192-4:2003 WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - TERMINAL ASSEMBLIES
    I.S. EN 62878-1-1:2015 DEVICE EMBEDDED SUBSTRATE - PART 1-1: GENERIC SPECIFICATION - TEST METHODS
    I.S. EN 61249-8-8:1999 MATERIALS FOR INTERCONNECTION STRUCTURES - PART 8: SECTIONAL SPECIFICATION SET FOR NON-CONDUCTIVE FILMS AND COATINGS - TEMPORARY POLYMER
    BS EN 61191-1 : 2013 PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES
    BS EN 61189-2 : 2006 TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 2: TEST METHODS FOR MATERIALS FOR INTERCONNECTION STRUCTURES
    UNE-EN 60664-3:2004 Insulation coordination for equipment within low-voltage systems - Part 3: Use of coating, potting or moulding for protection against pollution
    EN 62326-1 : 2002 PRINTED BOARDS - PART 1: GENERIC SPECIFICATION
    EN 61189-11 : 2013 TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 11: MEASUREMENT OF MELTING TEMPERATURE OR MELTING TEMPERATURE RANGES OF SOLDER ALLOYS
    EN 61189-2:2006 TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 2: TEST METHODS FOR MATERIALS FOR INTERCONNECTION STRUCTURES
    EN 62878-1-1 : 2015 DEVICE EMBEDDED SUBSTRATE - PART 1-1: GENERIC SPECIFICATION - TEST METHODS (IEC 62878-1-1:2015)
    I.S. EN 61191-1:2013 PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES (IEC 61191-1:2013 (EQV))
    EN 61249-8-8 : 1997 Materials for interconnection structures - Part 8: Sectional specification set for non-conductive films and coatings - Section 8: Temporary polymer coatings
    EN 61191-1:2013 PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES (IEC 61191-1:2013)
    EN 61249-4-1 : 2008 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-1: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD (FOR THE MANUFACTURE OF MULTILAYER BOARDS) - EPOXIDE WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY
    EN 62326-20 : 2016 PRINTED BOARDS - PART 20: PRINTED CIRCUIT BOARDS FOR HIGHBRIGHTNESS LEDS (IEC 62326-20:2016)
    EN 62137-4:2014/AC:2015 ELECTRONICS ASSEMBLY TECHNOLOGY - PART 4: ENDURANCE TEST METHODS FOR SOLDER JOINT OF AREA ARRAY TYPE PACKAGE SURFACE MOUNT DEVICES (IEC 62137-4:2014)
    EN 61192-1 : 2003 WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - PART 1: GENERAL
    EN 61192-4:2003 WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - PART 4: TERMINAL ASSEMBLIES
    EN 61189-5 : 2006 TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5: TEST METHODS FOR PRINTED BOARD ASSEMBLIES
    EN 61190-1-1 : 2002 ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - REQUIREMENTS FOR SOLDERING FLUXES FOR HIGH-QUALITY INTERCONNECTIONS IN ELECTRONICS ASSEMBLY

    Standards Referencing This Book - (Show below) - (Hide below)

    HD 323.2.20 : 200S3 BASIC ENVIRONMENTAL TESTING PROCEDURES - TESTS - TEST T - SOLDERING
    IEC 61188-1-2:1998 Printed boards and printed board assemblies - Design and use - Part 1-2: Generic requirements - Controlled impedance
    IEC 60068-1:2013 Environmental testing - Part 1: General and guidance
    EN 60454-3-1:1998/A1:2001 PRESSURE-SENSITIVE ADHESIVE TAPES FOR ELECTRICAL PURPOSES - SPECIFICATIONS FOR INDIVIDUAL MATERIALS - PVC FILM TAPES WITH PRESSURE-SENSITIVE ADHESIVE
    IEC 60068-2-20:2008 Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
    IEC 61190-1-2:2014 Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
    EN 61190-1-1 : 2002 ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - REQUIREMENTS FOR SOLDERING FLUXES FOR HIGH-QUALITY INTERCONNECTIONS IN ELECTRONICS ASSEMBLY
    EN 60068-1:2014 ENVIRONMENTAL TESTING - PART 1: GENERAL AND GUIDANCE (IEC 60068-1:2013)
    EN 62326-4-1 : 1997 PRINTED BOARDS - RIGID MULTILAYER PRINTED BOARDS WITH INTERLAYER CONNECTIONS - SECTIONAL SPECIFICATION: CAPABILITY DETAIL SPECIFICATION PERFORMANCE LEVELS A, B AND C
    EN 61188-1-2 : 1998 PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - GENERIC REQUIREMENTS - CONTROLLED IMPEDANCE
    IEC 60454-1:1992 Specifications for pressure-sensitive adhesive tapes for electrical purposes - Part 1: General requirements
    IEC 60454-3-1:1998+AMD1:2001 CSV Pressure-sensitive adhesive tapes for electrical purposes - Part 3: Specifications for individual materials - Sheet 1: PVC film tapes with pressure-sensitive adhesive
    EN ISO 9002:1994/AC:1997 QUALITY SYSTEMS - SPECIFICATION FOR PRODUCTION AND INSTALLATION
    IEC 61189-1:1997+AMD1:2001 CSV Test methods for electrical materials, interconnection structures and assemblies - Part 1: General test methods and methodology
    IEC 62326-4:1996 Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections - Sectional specification
    EN ISO 9453:2014 SOFT SOLDER ALLOYS - CHEMICAL COMPOSITIONS AND FORMS (ISO 9453:2014)
    IEC 61190-1-1:2002 ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-1: REQUIREMENTS FOR SOLDERING FLUXES FOR HIGH-QUALITY INTERCONNECTIONS IN ELECTRONICS ASSEMBLY
    EN 60584-1:2013 THERMOCOUPLES - PART 1: EMF SPECIFICATIONS AND TOLERANCES (IEC 60584-1:2013)
    EN 60454-1 : 1994 SPECIFICATIONS FOR PRESSURE SENSITIVE ADHESIVE TAPES FOR ELECTRICAL PURPOSES - PART 1: GENERAL REQUIREMENTS
    ISO 4046:1978 Paper, board, pulp and related terms Vocabulary
    ISO 9453:2014 Soft solder alloys Chemical compositions and forms
    EN 60068-2-78:2013 ENVIRONMENTAL TESTING - PART 2-78: TESTS - TEST CAB: DAMP HEAT, STEADY STATE (IEC 60068-2-78:2012)
    IEC 62326-4-1:1996 Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections - Sectional specification - Section 1: Capability detail specification - Performance levels A, B and C
    EN 61189-1 : 97 AMD 1 2001 TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 1: GENERAL TEST METHODS AND METHODOLOGY
    EN 62326-4 : 1997 PRINTED BOARDS - RIGID MULTILAYER PRINTED BOARDS WITH INTERLAYER CONNECTIONS - SECTIONAL SPECIFICATION
    EN 60695-11-5:2017 FIRE HAZARD TESTING - PART 11-5: TEST FLAMES - NEEDLE-FLAME TEST METHOD - APPARATUS, CONFIRMATORY TEST ARRANGEMENT AND GUIDANCE (IEC 60695-11-5:2016)
    IEC 60695-11-5 : 2.0 FIRE HAZARD TESTING - PART 11-5: TEST FLAMES - NEEDLE-FLAME TEST METHOD - APPARATUS, CONFIRMATORY TEST ARRANGEMENT AND GUIDANCE
    EN 61190-1-2:2014 ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-2: REQUIREMENTS FOR SOLDERING PASTES FOR HIGH-QUALITY INTERCONNECTS IN ELECTRONICS ASSEMBLY
    IEC 60584-1:2013 Thermocouples - Part 1: EMF specifications and tolerances
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