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EN 61249-2-40:2013

Current
Current

The latest, up-to-date edition.

Materials for printed boards and other interconnecting structures - Part 2-40: Reinforced base materials clad and unclad - High performance, non-halogenated epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
Published date

22-03-2013

Publisher

European Committee for Standards - Electrical

FOREWORD
1 Scope
2 Normative references
3 Materials and construction
4 Internal marking
5 Electrical properties
6 Non-electrical properties of the copper-clad laminate
7 Non-electrical properties of the base material after
   complete removal of the copper foil
8 Quality assurance
9 Packaging and marking
10 Ordering information
Annex A (informative) - Engineering information
Annex B (informative) - Common laminate constructions
Annex C (informative) - Guideline for qualification and
        conformance inspection
Bibliography
Annex ZA (normative) - Normative references to international
         publications with their corresponding European
         publications

IEC 61249-2-40:2012 specifies requirements for properties of modified non-halogenated epoxide woven E-glass laminated sheet of a thickness of 0,05 mm up to 3,2 mm, of defined flammability (vertical burning test), copper-clad. The glass transition temperature is defined to be 170 °C minimum.

Committee
CLC/SR 91
DocumentType
Standard
PublisherName
European Committee for Standards - Electrical
Status
Current

BS EN 61249-4-19:2013 Materials for printed boards and other interconnecting structures Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards). High performance non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
EN 61249-4-19:2013 Materials for printed boards and other interconnecting structures - Part 4-19: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - High performance non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
CEI EN 61249-4-19 : 2014 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-19: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD (FOR THE MANUFACTURE OF MULTILAYER BOARDS) - HICH PERFORMANCE NON-HALOGENATED EPOXIDE WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST) FOR LEAD-FREE ASSEMBLY
I.S. EN 61249-4-19:2013 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-19: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD (FOR THE MANUFACTURE OF MULTILAYER BOARDS) - HIGH PERFORMANCE NON-HALOGENATED EPOXIDE WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST) FOR LEAD-FREE ASSEMBLY

EN 61249-5-1:1996 Materials for interconnection structures - Part 5: Sectional specification set for conductive foils and films with or without coatings - Section 1: Copper foils (for the manufacture of copper-clad base materials)
IEC 61249-5-1:1995 Materials for interconnection structures - Part 5: Sectional specification set for conductive foils and films with and without coatings - Section 1: Copper foils (for the manufacture of copper-clad base materials)
ISO 14001:2015 Environmental management systems — Requirements with guidance for use
IEC 60194:2015 Printed board design, manufacture and assembly - Terms and definitions
ISO 11014:2009 Safety data sheet for chemical products Content and order of sections
ISO 9000:2015 Quality management systems — Fundamentals and vocabulary
IEC PAS 61249-6-3:2011 Specification for finished fabric woven from "E" glass for printed boards
IEC 61189-2:2006 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures
EN 61189-2:2006 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures

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