EN 61340-5-1:2016/AC:2017-05
Current
Current
The latest, up-to-date edition.
ELECTROSTATICS - PART 5-1: PROTECTION OF ELECTRONIC DEVICES FROM ELECTROSTATIC PHENOMENA - GENERAL REQUIREMENTS (IEC 61340-5-1:2016/COR1:2017)
Amendment of
Published date
26-05-2017
FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Terms and definitions
4 Personnel safety
5 ESD control program
Annex A (normative) - Test methods
Bibliography
Annex ZA (normative) - Normative references to
international publications with their
corresponding European publications
Pertains to activities that: manufacture, process, assemble, install, package, label, service, test, inspect, transport or otherwise handle electrical or electronic parts, assemblies and equipment with withstand voltages greater than or equal to 100 V HBM, 200 V CDM and 35 V for isolated conductors.
| Committee |
SR 101
|
| DevelopmentNote |
Supersedes EN 100015-1, EN 100015-2, EN 100015-3 and EN 100015-4. (03/2004) Supersedes UNE EN 61340-5-1. (04/2011)
|
| DocumentType |
Standard
|
| PublisherName |
European Committee for Standards - Electrical
|
| Status |
Current
|
| Supersedes |
| Standards | Relationship |
| NF EN 61340-5-1 : 2016 | Identical |
| IEC 61340-5-1:2016 | Identical |
| NBN EN 61340 5-1 : 2008 | Identical |
| NEN EN IEC 61340-5-1 : 2016 | Identical |
| I.S. EN 61340-5-1:2016 | Identical |
| PN EN 61340-5-1 : 2017 AC 2017 | Identical |
| SN EN 61340-5-1:2016 | Identical |
| VDE 0300-5-1 : 2017 | Identical |
| DIN EN 61340-5-1 : 2017 | Identical |
| BS EN 61340-5-1:2016 | Identical |
| UNE-EN 61340-5-1:2002 | Identical |
| CEI EN 61340-5-1 : 2017 | Identical |
| BS EN 61340-5-2:2001 | Electrostatics. Protection of electronic devices from electrostatic phenomena User guide |
| BS EN 16602-70-08:2015 | Space product assurance. Manual soldering of high-reliability electrical connections |
| BS EN 61760-2:2007 | Surface mounting technology Transportation and storage conditions of surface mounting devices (SMD). Application guide |
| BS EN 61192-1:2003 | Workmanship requirements for soldered electronic assemblies General |
| BS EN 60747-16-5:2013 | Semiconductor devices Microwave integrated circuits. Oscillators |
| BS EN 61340-5-3:2015 | Electrostatics Protection of electronic devices from electrostatic phenomena. Properties and requirements classification for packaging intended for electrostatic discharge sensitive devices |
| BS EN 16602-20:2014 | Space product assurance. Quality assurance |
| CEI EN 61760-2 : 2008 | SURFACE MOUNTING TECHNOLOGY - PART 2: TRANSPORTATION AND STORAGE CONDITIONS OF SURFACE MOUNTING DEVICES (SMD) - APPLICATION GUIDE |
| CEI EN 61760-1 : 2007 | SURFACE MOUNTING TECHNOLOGY - PART 1: STANDARD METHOD FOR THE SPECIFICATION OF SURFACE MOUNTING COMPONENTS (SMDS) |
| BS EN 60747-16-3 : 2002 | SEMICONDUCTOR DEVICES - PART 16-3: MICROWAVE INTEGRATED CIRCUITS - FREQUENCY CONVERTERS |
| I.S. EN 61192-1:2003 | WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - GENERAL |
| BS EN 61191-1:2013 | Printed board assemblies Generic specification. Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies |
| EN 60749-3:2017 | Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual examination |
| CLC/TR 62258-3:2007 | Semiconductor die products - Part 3: Recommendations for good practice in handling, packing and storage |
| EN 62435-5:2017 | Electronic components - Long-term storage of electronic semiconductor devices - Part 5: Die and wafer devices |
| I.S. EN 61191-1:2013 | PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES (IEC 61191-1:2013 (EQV)) |
| PD CLC/TR 62258-3:2007 | Semiconductor die products Recommendations for good practice in handling, packing and storage |
| BS EN 61760-4 : 2015 | SURFACE MOUNTING TECHNOLOGY - PART 4: CLASSIFICATION, PACKAGING, LABELLING AND HANDLING OF MOISTURE SENSITIVE DEVICES |
| I.S. EN 16602-70-08:2015 | SPACE PRODUCT ASSURANCE - MANUAL SOLDERING OF HIGH-RELIABILITY ELECTRICAL CONNECTIONS |
| I.S. EN 16812:2016 | TEXTILES AND TEXTILE PRODUCTS - ELECTRICALLY CONDUCTIVE TEXTILES - DETERMINATION OF THE LINEAR ELECTRICAL RESISTANCE OF CONDUCTIVE TRACKS |
| I.S. EN 60679-1:2017 | PIEZOELECTRIC, DIELECTRIC AND ELECTROSTATIC OSCILLATORS OF ASSESSED QUALITY - PART 1: GENERIC SPECIFICATION |
| CEI EN 60679-1 : 2009 | PIEZOELECTRIC, DIELECTRIC AND ELECTROSTATIC OSCILLATORS OF ASSESSED QUALITY - PART 1: GENERIC SPECIFICATION |
| BS EN 60747-16-1 : 2002 | SEMICONDUCTOR DEVICES - PART 16-1: MICROWAVE INTEGRATED CIRCUITS - AMPLIFIERS |
| CEI EN 61760-4 : 2016 | SURFACE MOUNTING TECHNOLOGY - PART 4: CLASSIFICATION, PACKAGING, LABELLING AND HANDLING OF MOISTURE SENSITIVE DEVICES |
| CEI EN 60749-3 : 2004 | SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 3: EXTERNAL VISUAL EXAMINATION |
| I.S. EN 61760-1:2006 | SURFACE MOUNTING TECHNOLOGY - PART 1: STANDARD METHOD FOR THE SPECIFICATION OF SURFACE MOUNTING COMPONENTS (SMDS) |
| I.S. EN 60747-16-1:2002 | SEMICONDUCTOR DEVICES - PART 16-1: MICROWAVE INTEGRATED CIRCUITS - AMPLIFIERS |
| I.S. EN 60286-3:2013 | PACKAGING OF COMPONENTS FOR AUTOMATIC HANDLING - PART 3: PACKAGING OF SURFACE MOUNT COMPONENTS ON CONTINUOUS TAPES (IEC 60286-3:2013 (EQV)) |
| I.S. EN 14125:2013 | THERMOPLASTIC AND FLEXIBLE METAL PIPEWORK FOR UNDERGROUND INSTALLATION AT PETROL FILLING STATIONS |
| VDI 2083 Blatt 17:2013-06 | Cleanroom technology - Compatibility of materials with the required cleanliness |
| VDI 2083 Blatt 18:2012-01 | Cleanroom technology - Biocontamination control |
| OVE/ONORM EN 61760-1 : 2006 | SURFACE MOUNTING TECHNOLOGY - PART 1: STANDARD METHOD FOR THE SPECIFICATION OF SURFACE MOUNTING COMPONENTS (SMDS) |
| VDI 2083 Blatt 9.1:2006-12 | Clean room technology - Compatibility with required cleanliness and surface cleanliness |
| VDI 2083 Blatt 4.1:2006-10 | Cleanroom technology - Planning, construction and start-up of cleanrooms |
| VDI 2083 Blatt 5.1:2007-09 | Cleanroom technology - Cleanroom operation |
| VDI 2119:2013-06 | Ambient air measurements - Sampling of atmospheric particles > 2,5 ?m on an acceptor surface using the Sigma-2 passive sampler - Characterisation by optical microscopy and calculation of number settling rate and mass concentration |
| CEI CLC/TR 61340-5-2 : 2010 | ELECTROSTATICS - PART 5-2: PROTECTION OF ELECTRONIC DEVICES FROM ELECTROSTATIC PHENOMENA - USER GUIDE |
| 15/30315510 DC : 0 | BS ISO 4586-5 - HIGH-PRESSURE DECORATIVE LAMINATES (HPL, HPDL) - SHEETS BASED ON THERMOSETTING RESINS (USUALLY CALLED LAMINATES) - PART 5: CLASSIFICATION AND SPECIFICATIONS FOR FLOORING GRADE LAMINATES LESS THAN 2 MM THICK INTENDED FOR BONDING TO SUPPORTING SUBSTRATES |
| UNE-EN 16812:2016 | Textiles and textile products - Electrically conductive textiles - Determination of the linear electrical resistance of conductive tracks |
| 08/30190157 DC : DRAFT SEP 2008 | BS EN ISO 14644-9 - CLEANROOMS AND ASSOCIATED CONTROLLED ENVIRONMENTS - PART 9: CLASSIFICATION OF SURFACE PARTICLE CLEANLINESS |
| BS EN 61760-1:2006 | Surface mounting technology Standard method for the specification of surface mounting components (SMDs) |
| EN 60747-16-3:2002/A2:2017 | SEMICONDUCTOR DEVICES - PART 16-3: MICROWAVE INTEGRATED CIRCUITS - FREQUENCY CONVERTERS (IEC 60747-16-3:2002/A2:2017) |
| EN 60747-16-4:2004/A2:2017 | SEMICONDUCTOR DEVICES - PART 16-4: MICROWAVE INTEGRATED CIRCUITS - SWITCHES (IEC 60747-16-4:2004/A2:2017) |
| I.S. EN 60747-16-3:2002 | SEMICONDUCTOR DEVICES - PART 16-3: MICROWAVE INTEGRATED CIRCUITS - FREQUENCY CONVERTERS |
| EN 61760-2:2007 | Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide |
| ISO 4586-3:2015 | High-pressure decorative laminates (HPL, HPDL) Sheets based on thermosetting resins (Usually called Laminates) Part 3: Classification and specifications for laminates less than 2 mm thick and intended for bonding to supporting substrates |
| EN 61760-4:2015/A1:2018 | SURFACE MOUNTING TECHNOLOGY - PART 4: CLASSIFICATION, PACKAGING, LABELLING AND HANDLING OF MOISTURE SENSITIVE DEVICES (IEC 61760-4:2015/A1:2018) |
| EN 61760-1:2006 | SURFACE MOUNTING TECHNOLOGY - PART 1: STANDARD METHOD FOR THE SPECIFICATION OF SURFACE MOUNTING COMPONENTS (SMDS) |
| EN 60747-16-5:2013 | Semiconductor devices - Part 16-5: Microwave integrated circuits - Oscillators |
| OVE/ONORM EN 61760-2 : 2007 | SURFACE MOUNTING TECHNOLOGY - PART 2: TRANSPORTATION AND STORAGE CONDITIONS OF SURFACE MOUNTING DEVICES (SMD) - APPLICATION GUIDE |
| UNI EN 14125 : 2013 | THERMOPLASTIC AND FLEXIBLE METAL PIPEWORK FOR UNDERGROUND INSTALLATION AT PETROL FILLING STATIONS |
| CLC/TR 61340-5-2:2008 | Electrostatics - Part 5-2: Protection of electronic devices from electrostatic phenomena - User guide |
| 11/30231856 DC : 0 | BS EN 14125 - THERMOPLASTIC AND FLEXIBLE METAL PIPEWORK FOR UNDERGROUND INSTALLATION AT PETROL FILLING STATIONS |
| PREN 14125 : DRAFT 2011 | THERMOPLASTIC AND FLEXIBLE METAL PIPEWORK FOR UNDERGROUND INSTALLATION AT PETROL FILLING STATIONS |
| BS EN 60749-3:2017 | Semiconductor devices. Mechanical and climatic test methods External visual examination |
| CEI EN 60747-16-1 : 2009 | SEMICONDUCTOR DEVICES - PART 16-1: MICROWAVE INTEGRATED CIRCUITS - AMPLIFIERS |
| BS EN 60286-3:2013 | Packaging of components for automatic handling Packaging of surface mount components on continuous tapes |
| BS EN 61340-4-6:2015 | Electrostatics Standard test methods for specific applications. Wrist straps |
| BS EN 60679-1:2017 | Piezoelectric, dielectric and electrostatic oscillators of assessed quality Generic specification |
| PD CLC/TR 61340-5-2:2008 | Electrostatics Protection of electronic devices from electrostatic phenomena. User guide |
| I.S. EN 60749-3:2017 | SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 3: EXTERNAL VISUAL EXAMINATION |
| EN 60679-1:2017 | Piezoelectric, dielectric and electrostatic oscillators of assessed quality - Part 1: Generic specification |
| I.S. EN 60747-16-5:2013 | SEMICONDUCTOR DEVICES - PART 16-5: MICROWAVE INTEGRATED CIRCUITS - OSCILLATORS (IEC 60747-16-5:2013 (EQV)) |
| I.S. EN 16602-20:2014 | SPACE PRODUCT ASSURANCE - QUALITY ASSURANCE |
| EN 16602-20:2014 | Space product assurance - Quality assurance |
| UNE-EN 14125:2013 | Thermoplastic and flexible metal pipework for underground installation at petrol filling stations |
| BS EN 14125:2013 | Thermoplastic and flexible metal pipework for underground installation at petrol filling stations |
| BS EN 62435-5:2017 | Electronic components. Long-term storage of electronic semiconductor devices Die and wafer devices |
| EN 16812:2016 | Textiles and textile products - Electrically conductive textiles - Determination of the linear electrical resistance of conductive tracks |
| EN 14125:2013 | Thermoplastic and flexible metal pipework for underground installation at petrol filling stations |
| EN 16602-70-08:2015 | Space product assurance - Manual soldering of high-reliability electrical connections |
| BS EN 16812:2016 | Textiles and textile products. Electrically conductive textiles. Determination of the linear electrical resistance of conductive tracks |
| CEI EN 60747-16-5 : 2014 | SEMICONDUCTOR DEVICES - PART 16-5: MICROWAVE INTEGRATED CIRCUITS - OSCILLATORS |
| CEI EN 60747-16-3 : 2009 | SEMICONDUCTOR DEVICES - PART 16-3: MICROWAVE INTEGRATED CIRCUITS - FREQUENCY CONVERTERS |
| 17/30355242 DC : 0 | BS ISO 4586-5 - HIGH-PRESSURE DECORATIVE LAMINATES (HPL, HPDL) - SHEETS BASED ON THERMOSETTING RESINS (USUALLY CALLED LAMINATES) - PART 5: CLASSIFICATION AND SPECIFICATIONS FOR FLOORING GRADE LAMINATES LESS THAN 2 MM THICK INTENDED FOR BONDING TO SUPPORTING SUBSTRATES |
| BS EN 60747-16-4 : 2004 | SEMICONDUCTOR DEVICES - PART 16-4: MICROWAVE INTEGRATED CIRCUITS - SWITCHES |
| S.R. CLC/TR 61340-5-2:2008 | ELECTROSTATICS - PART 5-2: PROTECTION OF ELECTRONIC DEVICES FROM ELECTROSTATIC PHENOMENA - USER GUIDE |
| I.S. CLC/TR 62258-3:2007 | SEMICONDUCTOR DIE PRODUCTS - PART 3: RECOMMENDATIONS FOR GOOD PRACTICE IN HANDLING, PACKING AND STORAGE |
| CEI CLC/TR 62258-3 : 2007 | SEMICONDUCTOR DIE PRODUCTS - PART 3: RECOMMENDATIONS FOR GOOD PRACTICE IN HANDLING, PACKING AND STORAGE |
| I.S. EN 61760-4:2015 | SURFACE MOUNTING TECHNOLOGY - PART 4: CLASSIFICATION, PACKAGING, LABELLING AND HANDLING OF MOISTURE SENSITIVE DEVICES |
| I.S. EN 61760-2:2007 | SURFACE MOUNTING TECHNOLOGY - PART 2: TRANSPORTATION AND STORAGE CONDITIONS OF SURFACE MOUNTING DEVICES (SMD) - APPLICATION GUIDE |
| I.S. EN 60747-16-4:2004 | SEMICONDUCTOR DEVICES - PART 16-4: MICROWAVE INTEGRATED CIRCUITS - SWITCHES |
| EN 60747-16-1:2002/A2:2017 | SEMICONDUCTOR DEVICES - PART 16-1: MICROWAVE INTEGRATED CIRCUITS - AMPLIFIERS (IEC 60747-16-1:2001/A2:2017) |
| DIN EN 14125:2013-09 | THERMOPLASTIC AND FLEXIBLE METAL PIPEWORK FOR UNDERGROUND INSTALLATION AT PETROL FILLING STATIONS |
| EN 61340-5-3:2015 | Electrostatics - Part 5-3: Protection of electronic devices from electrostatic phenomena - Properties and requirements classification for packaging intended for electrostatic discharge sensitive devices |
| EN 61340-4-6:2015 | Electrostatics - Part 4-6: Standard test methods for specific applications - Wrist straps |
| EN 61191-1:2013 | PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES (IEC 61191-1:2013) |
| EN 61192-1:2003 | Workmanship requirements for soldered electronic assemblies - Part 1: General |
| EN 60286-3:2013/AC:2013 | PACKAGING OF COMPONENTS FOR AUTOMATIC HANDLING - PART 3: PACKAGING OF SURFACE MOUNT COMPONENTS ON CONTINUOUS TAPES (IEC 60286-3:2013) |
| EN 61340-4-5:2004 | Electrostatics - Part 4-5: Standard test methods for specific applications - Methods for characterizing the electrostatic protection of footwear and flooring in combination with a person |
| IEC TS 60479-1:2005+AMD1:2016 CSV | Effects of current on human beings and livestock - Part 1: Generalaspects |
| EN 61340-4-3:2001 | Electrostatics - Part 4-3: Standard test methods for specific applications - Footwear |
| IEC 61340-5-3:2015 | Electrostatics - Part 5-3: Protection of electronic devices from electrostatic phenomena - Properties and requirements classification for packaging intended for electrostatic discharge sensitive devices |
| IEC 61340-4-9:2016 | Electrostatics - Part 4-9: Standard test methods for specific applications - Garments |
| IEC 61340-4-7:2017 | Electrostatics - Part 4-7: Standard test methods for specific applications - Ionization |
| IEC 61340-2-3:2016 | Electrostatics - Part 2-3: Methods of test for determining the resistance and resistivity of solid materials used to avoid electrostatic charge accumulation |
| IEC TR 61340-5-2:2007 | Electrostatics - Part 5-2: Protection of electronic devices from electrostatic phenomena - User guide |
| IEC 60749-27:2006+AMD1:2012 CSV | Semiconductor devices - Mechanical and climatic test methods - Part27: Electrostatic discharge (ESD) sensitivity testing - Machine model (MM) |
| EN 61340-5-3:2015 | Electrostatics - Part 5-3: Protection of electronic devices from electrostatic phenomena - Properties and requirements classification for packaging intended for electrostatic discharge sensitive devices |
| EN 61340-4-6:2015 | Electrostatics - Part 4-6: Standard test methods for specific applications - Wrist straps |
| ESDA/JEDEC JS-002 : 2014 | ELECTROSTATIC DISCHARGE SENSITIVITY TESTING - CHARGED DEVICE MODEL (CDM) - COMPONENT LEVEL |
| IEC 61340-4-3:2001 | Electrostatics - Part 4-3: Standard test methods for specific applications - Footwear |
| EN 60749-27:2006/A1:2012 | SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 27: ELECTROSTATIC DISCHARGE (ESD) SENSITIVITY TESTING - MACHINE MODEL (MM) |
| IEC 61340-4-1:2003+AMD1:2015 CSV | Electrostatics - Part 4-1: Standard test methods for specific applications - Electrical resistance of floor coverings and installed floors |
| IEC 60749-26:2013 | Semiconductor devices - Mechanical and climatic test methods - Part 26: Electrostatic discharge (ESD) sensitivity testing - Human body model (HBM) |
| CLC/TR 61340-5-2:2008 | Electrostatics - Part 5-2: Protection of electronic devices from electrostatic phenomena - User guide |
| EN 61340-4-1:2004/A1:2015 | ELECTROSTATICS - PART 4-1: STANDARD TEST METHODS FOR SPECIFIC APPLICATIONS - ELECTRICAL RESISTANCE OF FLOOR COVERINGS AND INSTALLED FLOORS (IEC 61340-4-1:2003/A1:2015) |
| IEC 61340-4-5:2004 | Electrostatics - Part 4-5: Standard test methods for specific applications - Methods for characterizing the electrostatic protection of footwear and flooring in combination with a person |
| EN 60749-26:2014 | Semiconductor devices - Mechanical and climatic test methods - Part 26: Electrostatic discharge (ESD) sensitivity testing - Human body model (HBM) |
| EN 61140:2016 | Protection against electric shock - Common aspects for installation and equipment |
| EN 61010-1:2010 | Safety requirements for electrical equipment for measurement, control, and laboratory use - Part 1: General requirements |
| EN 61340-2-3:2016 | Electrostatics - Part 2-3: Methods of test for determining the resistance and resistivity of solid materials used to avoid electrostatic charge accumulation |
| EN 61340-4-9:2016 | Electrostatics - Part 4-9: Standard test methods for specific applications - Garments |
| IEC 61140:2016 | Protection against electric shock - Common aspects for installation and equipment |
| IEC 61010-1:2010+AMD1:2016 CSV | Safety requirements for electrical equipment for measurement, control, and laboratory use - Part 1: General requirements |
| IEC TS 60479-2:2007 | Effects of current on human beings and livestock - Part 2: Special aspects |
| IEC 61340-4-6:2015 | Electrostatics - Part 4-6: Standard test methods for specific applications - Wrist straps |
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