IEC 60749-20:2008
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Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
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IPC T 50 : M
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TERMS AND DEFINITIONS FOR INTERCONNECTING AND PACKAGING ELECTRONIC CIRCUITS
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EN ISO 62:2008
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Plastics - Determination of water absorption (ISO 62:2008)
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IEC 60068-1:2013
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Environmental testing - Part 1: General and guidance
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IEC 60068-2-58:2015+AMD1:2017 CSV
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Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
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EN 60749-20-1 : 2009
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SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 20-1: HANDLING, PACKING, LABELLING AND SHIPPING OF SURFACE-MOUNT DEVICES SENSITIVE TO THE COMBINED EFFECT OF MOISTURE AND SOLDERING HEAT
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EN 61340-5-1:2016/AC:2017-05
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ELECTROSTATICS - PART 5-1: PROTECTION OF ELECTRONIC DEVICES FROM ELECTROSTATIC PHENOMENA - GENERAL REQUIREMENTS (IEC 61340-5-1:2016/COR1:2017)
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IEC 61340-5-1:2016
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Electrostatics - Part 5-1: Protection of electronic devices from electrostatic phenomena - General requirements
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EN 60068-1:2014
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Environmental testing - Part 1: General and guidance
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MIL-PRF-131 Revision K:2005
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BARRIER MATERIALS, WATERVAPORPROOF, GREASEPROOF, FLEXIBLE, HEAT-SEALABLE
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IPC J STD 033C-1:2014
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HANDLING, PACKING, SHIPPING AND USE OF MOISTURE, REFLOW, AND PROCESS SENSITIVE DEVICES
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IEC 61760-2:2007
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Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide
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MIL-PRF-27401 Revision G:2013
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Propellant Pressurizing Agent, Nitrogen
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ISO 62:2008
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Plastics Determination of water absorption
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EN 60068-2-78:2013
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Environmental testing - Part 2-78: Tests - Test Cab: Damp heat, steady state
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EN 61760-2:2007
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Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide
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EN 60749-20:2009
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Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
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IPC J STD 075 : 0
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CLASSIFICATION OF NON-IC ELECTRONIC COMPONENTS FOR ASSEMBLY PROCESSES
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ASTM D 570 : 1998 : R2018
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Standard Test Method for Water Absorption of Plastics
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IEC 60749-20-1:2009
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Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat
|