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  • EN 62326-20 : 2016

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    PRINTED BOARDS - PART 20: PRINTED CIRCUIT BOARDS FOR HIGHBRIGHTNESS LEDS (IEC 62326-20:2016)

    Available format(s): 

    Language(s): 

    Published date:  13-05-2016

    Publisher:  European Committee for Standards - Electrical

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    Table of Contents - (Show below) - (Hide below)

    FOREWORD
    1 Scope
    2 Normative references
    3 Terms, definitions and abbreviations
    4 Classification and class of the printed circuit board
      for high-brightness LEDs
    5 Design rules and allowance
    6 Quality
    7 Performance and test methods
    8 Marking, packaging and storage
    Annex A (informative) - Classification and class of the PCB
            for high-brightness LEDs
    Bibliography
    Annex ZA (normative) - Normative references to
             international publications with their
             corresponding European publications

    Abstract - (Show below) - (Hide below)

    Describes the properties of the printed circuit board (hereafter described as PCB) for high-brightness LEDs. Many aspects of the PCB for high-brightness LEDs are identical with those of ordinary PCBs, therefore, some aspects of this standard also describe general aspects.

    General Product Information - (Show below) - (Hide below)

    Committee SR 91
    Document Type Standard
    Publisher European Committee for Standards - Electrical
    Status Current

    Standards Referencing This Book - (Show below) - (Hide below)

    IEC 61189-11:2013 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 11: Measurement of melting temperature or melting temperature ranges of solder alloys
    IEC 60068-1:2013 Environmental testing - Part 1: General and guidance
    IEC TR 62866:2014 Electrochemical migration in printed wiring boards and assemblies - Mechanisms and testing
    IEC 60068-2-58:2015+AMD1:2017 CSV Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
    IEC 60068-2-20:2008 Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
    EN 61249-2-6:2003/corrigendum:2005 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-6: REINFORCED BASE MATERIALS, CLAD AND UNCLAD - BROMINATED EPOXIDE NON-WOVEN/WOVEN E-GLASS REINFORCED LAMINATED SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD
    IEC 61190-1-2:2014 Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
    IEC 61249-2-7:2002 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-7: REINFORCED BASE MATERIALS CLAD AND UNCLAD - EPOXIDE WOVEN E-GLASS LAMINATED SHEET OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD
    IEC 60068-2-21:2006 Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices
    IEC 61189-3-913:2016 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-913: Test method for thermal conductivity of electronic circuit boards for high-brightness LEDs
    ISO 3366:1999 Coated abrasives Abrasive rolls
    IEC 62137-1-3:2008 SURFACE MOUNTING TECHNOLOGY - ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SURFACE MOUNT SOLDER JOINT - PART 1-3: CYCLIC DROP TEST
    IEC 60068-2-66:1994 Environmental testing - Part 2: Test methods - Test Cx: Damp heat, steady state (unsaturated pressurized vapour)
    ISO 4957:1999 Tool steels
    IEC 62326-1:2002 Printed boards - Part 1: Generic specification
    IEC 61189-1:1997+AMD1:2001 CSV Test methods for electrical materials, interconnection structures and assemblies - Part 1: General test methods and methodology
    ISO 9454-1:2016 Soft soldering fluxes Classification and requirements Part 1: Classification, labelling and packaging
    IEC 60068-2-64:2008 Environmental testing - Part 2-64: Tests - Test Fh: Vibration, broadband random and guidance
    IEC 60068-2-53:2010 Environmental testing - Part 2-53: Tests and guidance - Combined climatic (temperature/humidity) and dynamic (vibration/shock) tests
    EN 61249-2-7:2002/corrigendum:2005 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-7: REINFORCED BASE MATERIALS CLAD AND UNCLAD - EPOXIDE WOVEN E-GLASS LAMINATED SHEET OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD
    ISO 15184:2012 Paints and varnishes Determination of film hardness by pencil test
    IEC 62326-4:1996 Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections - Sectional specification
    IEC 60068-2-38:2009 ENVIRONMENTAL TESTING - PART 2-38: TESTS - TEST Z/AD: COMPOSITE TEMPERATURE/HUMIDITY CYCLIC TEST
    IEC 62137-1-4:2009 Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-4: Cyclic bending test
    EN 61189-3:2008 TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 3: TEST METHODS FOR INTERCONNECTION STRUCTURES (PRINTED BOARDS)
    ISO 6906:1984 Vernier callipers reading to 0,02 mm
    ISO 29864:2007 Self adhesive tapes Measurement of breaking strength and elongation at break
    ISO 13385-1:2011 Geometrical product specifications (GPS) Dimensional measuring equipment Part 1: Callipers; Design and metrological characteristics
    ISO 9180:1988 Black leads for wood-cased pencils Classification and diameters
    ISO 6353-3:1987 Reagents for chemical analysis Part 3: Specifications Second series
    IEC 61190-1-1:2002 ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-1: REQUIREMENTS FOR SOLDERING FLUXES FOR HIGH-QUALITY INTERCONNECTIONS IN ELECTRONICS ASSEMBLY
    IEC 61189-3:2007 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)
    ISO 29863:2007 Self adhesive tapes Measurement of static shear adhesion
    ISO 29862:2007 Self adhesive tapes Determination of peel adhesion properties
    ISO 3599:1976 Vernier callipers reading to 0,1 and 0,05 mm
    IEC 60068-2-2:2007 Environmental testing - Part 2-2: Tests - Test B: Dry heat
    IEC 60194:2015 Printed board design, manufacture and assembly - Terms and definitions
    ISO 8512-1:1990 Surface plates Part 1: Cast iron
    ISO 291:2008 Plastics Standard atmospheres for conditioning and testing
    IEC 60068-2-80:2005 Environmental testing - Part 2-80: Tests - Test Fi: Vibration - Mixed mode
    ISO 3611:2010 Geometrical product specifications (GPS) Dimensional measuring equipment: Micrometers for external measurements Design and metrological characteristics
    ISO 9453:2014 Soft solder alloys Chemical compositions and forms
    ISO 8512-2:1990 Surface plates Part 2: Granite
    ISO 21948:2001 Coated abrasives Plain sheets
    IEC 60068-2-1:2007 Environmental testing - Part 2-1: Tests - Test A: Cold
    IEC 61249-2-6:2003 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-6: REINFORCED BASE MATERIALS, CLAD AND UNCLAD - BROMINATED EPOXIDE NON-WOVEN/WOVEN E-GLASS REINFORCED LAMINATED SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD
    EN 62878-1-1 : 2015 DEVICE EMBEDDED SUBSTRATE - PART 1-1: GENERIC SPECIFICATION - TEST METHODS (IEC 62878-1-1:2015)
    ISO 2409:2013 Paints and varnishes Cross-cut test
    ISO 9445-1:2009 Continuously cold-rolled stainless steel Tolerances on dimensions and form Part 1: Narrow strip and cut lengths
    IEC 61189-2:2006 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures
    IEC 61249-2-8:2003 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-8: REINFORCED BASE MATERIALS CLAD AND UNCLAD - MODIFIED BROMINATED EPOXIDE WOVEN FIBREGLASS REINFORCED LAMINATED SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD
    EN 60194:2006 PRINTED BOARD DESIGN, MANUFACTURE AND ASSEMBLY - TERMS AND DEFINITIONS
    IEC 61190-1-3:2007+AMD1:2010 CSV Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications
    IEC 60068-2-30:2005 Environmental testing - Part 2-30: Tests - Test Db: Damp heat, cyclic (12 h + 12 h cycle)
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