Electronic components - Long-term storage of electronic semiconductor devices - Part 5: Die and wafer devices

Published date

31-03-2017

Publisher

European Committee for Standards - Electrical

FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Terms, definitions and abbreviated terms
4 Storage requirements
5 Long-term storage failure mechanisms
6 LTS concerns, method, verification and limitations
7 Deterioration mechanisms specific to bare die and wafers
8 Specific handling concerns
Annex A (informative) - Audit checklist
Bibliography
Annex ZA (normative) - Normative references to
international publications with their
corresponding European publications

IEC62435-5:2017 is applicable to long-term storage of die and wafer devices and establishes specific storage regimen and conditions for singulated bare die and partial or complete wafers of die including die with added structures such as redistribution layers and solder balls or bumps or other metallisation. This part also provides guidelines for special requirements and primary packaging that contain the die or wafers for handling purposes. Typically, this part is used in conjunction with IEC 62435-1:2017 for long-term storage of devices whose duration can be more than 12 months for products scheduled for long duration storage.

Committee	CLC/SR 47
DocumentType	Standard
PublisherName	European Committee for Standards - Electrical
Status	Current

Standards	Relationship
CEI EN 62435-5 : 1ED 2017	Identical
NF EN 62435-5 : 2017	Identical
IEC 62435-5:2017	Identical
DIN EN 62435-5 : 2013	Identical
PN EN 62435-5 : 2017	Identical
UNE-EN 62435-5:2017	Identical
I.S. EN 62435-5:2017	Identical
BS EN 62435-5:2017	Identical
NEN EN IEC 62435-5 : 2017	Identical
VDE 0884-135-5 : 2017	Identical
SN EN 62435-5 : 2017	Identical
DIN EN 62435-5 : 2017	Identical

EN 60749-22:2003	Semiconductor devices - Mechanical and climatic test methods - Part 22: Bond strength
EN 62435-1:2017	Electronic components - Long-term storage of electronic semiconductor devices - Part 1: General
IEC 60749-21:2011	Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability
EN 60749-20-1 : 2009	SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 20-1: HANDLING, PACKING, LABELLING AND SHIPPING OF SURFACE-MOUNT DEVICES SENSITIVE TO THE COMBINED EFFECT OF MOISTURE AND SOLDERING HEAT
EN 61340-5-1:2016/AC:2017-05	ELECTROSTATICS - PART 5-1: PROTECTION OF ELECTRONIC DEVICES FROM ELECTROSTATIC PHENOMENA - GENERAL REQUIREMENTS (IEC 61340-5-1:2016/COR1:2017)
IEC 60068-2-20:2008	Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
EN 60068-2-20:2008	Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
IEC 61340-5-1:2016	Electrostatics - Part 5-1: Protection of electronic devices from electrostatic phenomena - General requirements
IEC TR 62380:2004	Reliability data handbook - Universal model for reliability prediction of electronics components, PCBs and equipment
EN 61340-2-1:2015	Electrostatics - Part 2-1: Measurement methods - Ability of materials and products to dissipate static electric charge
IPC J STD 033C-1:2014	HANDLING, PACKING, SHIPPING AND USE OF MOISTURE, REFLOW, AND PROCESS SENSITIVE DEVICES
EN 60749-21:2011	SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 21: SOLDERABILITY
IPC J STD 002 : D	SOLDERABILITY TESTS FOR COMPONENT LEADS, TERMINATIONS, LUGS, TERMINALS AND WIRES
CLC/TR 62258-3:2007	Semiconductor die products - Part 3: Recommendations for good practice in handling, packing and storage
EN 62435-2:2017	Electronic components - Long-term storage of electronic semiconductor devices - Part 2: Deterioration mechanisms
EN 60068-2-17:1994	Environmental testing - Part 2: Tests - Test Q: Sealing
IEC 60068-2-17:1994	Basic environmental testing procedures - Part 2-17: Tests - Test Q: Sealing
IEC TR 62258-3:2010	Semiconductor die products - Part 3: Recommendations for good practice in handling, packing and storage
IEC 60749-3:2017	Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual examination
EN 60749-3:2017	Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual examination
IEC 62435-2:2017	Electronic components - Long-term storage of electronic semiconductor devices - Part 2: Deterioration mechanisms
IEC 60749-22:2002	Semiconductor devices - Mechanical and climatic test methods - Part 22: Bond strength
IEC 60749-20-1:2009	Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat