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HD 323.2.54 : 200S1

Superseded
Superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

BASIC ENVIRONMENTAL TESTING PROCEDURES - TESTS - TEST TA: SOLDERING - SOLDERABILITY TESTING BY THE WETTING BALANCE METHOD
Superseded date

01-08-2006

Published date

12-01-2013

Publisher

Harmonization Documents

Committee
SR 104
DocumentType
Standard
PublisherName
Harmonization Documents
Status
Superseded

Standards Relationship
DIN IEC 60068-2-54:1988-01 Corresponds
IEC 60068-2-54:2006 Identical
CEI 50-8/1 : 1ED 1998 Identical
UNE 20501-2-54:1994 Identical
BS 2011-2.1Ta:1989 Identical
NEN 10068-2-54 : 1986 Identical

EN 61076-4-113:2003 Connectors for electronic equipment - Printed board connectors - Part 4-113: Detail specification for two-part connectors having 5 rows with a grid of 2,54 mm for printed boards and backplanes in bus applications
BS EN 61076-4-113:2003 Connectors for electronic equipment Printed board connectors with assessed quality Detail specification for two-part connectors having 5 rows with a grid of 2,54 mm for printed boards and backplanes in bus applications
I.S. EN 61076-4-113:2003 CONNECTORS FOR ELECTRONIC EQUIPMENT - PRINTED BOARD CONNECTORS - PART 4-113: DETAIL SPECIFICATION FOR TWO-PART CONNECTORS HAVING 5 ROWS WITH A GRID OF 2,54 MM FOR PRINTED BOARDS AND BACKPLANES IN BUS APPLICATIONS
BS EN 60512-12-7:2001 Electromechanical components for electronic equipment. Basic testing procedures and measuring methods. Soldering tests Test 12g. Solderability, wetting balance method - Section 7: Test 12g: Solderability, wetting balance method
CEI EN 60512-12-7 : 2002 CONNECTORS FOR ELECTRONIC EQUIPMENT - TESTS AND MEASUREMENTS - PART 12-7: SOLDERING TESTS - TEST 12G: SOLDERABILITY, WETTING BALANCE METHOD

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