MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-13: DESIGN GUIDELINE OF OPEN-TOP-TYPE SOCKETS FOR FINE-PITCH BALL GRID ARRAY (FBGA) AND FINE-PITCH LAND GRID ARRAY (FLGA)

Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

01-01-2016

Publisher

National Standards Authority of Ireland

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National Foreword
FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Terms and definitions
4 Socket code
5 Terminal number
6 Socket nominal dimension
7 Socket length and width
8 Reference symbols and schematics
9 Individual outline drawing standard registration
Annex ZA (normative) - Normative references to international
publications with their corresponding European
publications

Defines a design guideline of open-top-type semiconductor sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA).

DevelopmentNote	For CENELEC adoptions of IEC publications, please check www.iec.ch to be sure that you have any corrigenda that may apply. (01/2017)
DocumentType	Standard
Pages	50
PublisherName	National Standards Authority of Ireland
Status	Current

Standards	Relationship
BS EN 60191-6-13:2016	Identical
EN 60191-6-13:2016	Identical
DIN EN 60191-6-13:2013-07 (Draft)	Identical
NF EN 60191-6-13 : 2017	Identical

IEC 60191-6:2009	Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages
IEC 60191-2:2012 DB	Mechanical standardization of semiconductor devices - Part 2: Dimensions
EN 60191-6:2009	Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages

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I.S. EN 60191-6-13:2016

Current

Table of Contents

Abstract

General Product Information

International Equivalents

Standards Referencing This Book

Category

Subcategory

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