PACKAGING OF COMPONENTS FOR AUTOMATIC HANDLING - PART 4: STICK MAGAZINES FOR ELECTRONIC COMPONENTS ENCAPSULATED IN PACKAGES OF DIFFERENT FORMS (IEC 60286-4:2013 (EQV))

Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

01-01-2013

Publisher

National Standards Authority of Ireland

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Only cited Standards give presumption of conformance to New Approach Directives/Regulations.

FOREWORD
1 Scope
2 Normative references
3 Terms, definitions and conventions
4 Shape and cross-section of stick magazine
5 Dimensions of stick magazines
6 Mechanical stability
7 End stoppers and spacers
8 Orientation of the components in the stick magazine
9 Marking
Annex A (informative) - DIL packages for through-hole mount
Annex B (informative) - SO packages for surface mounting
Annex C (informative) - Leaded chip carrier packages
        (PLCC) for surface mounting
Annex D (normative) - Rule for the orientation of integrated
        circuit packages in handling and shipping
        carriers such as stick magazines and rails
        (from IEC 60191-3:1999, Annex G)
Bibliography
Annex ZA (normative) - Normative references to international
         Publications with their corresponding
         European publications

Pertains to stick magazines (including end stoppers) intended to be used for storage of electronic components, for transport from the manufacturer to the customer and for in-house use in the manufacturing plant.

DevelopmentNote	For CENELEC adoptions of IEC publications, please check www.iec.ch to be sure that you have any corrigenda that may apply. (01/2017)
DocumentType	Standard
Pages	22
PublisherName	National Standards Authority of Ireland
Status	Current

Standards	Relationship
EN 60286-4:2013	Identical
SN EN 60286-4 : 1997	Identical
DIN EN 60286-4:2014-04	Identical
BS EN 60286-4:2013	Identical
NF EN 60286-4 : 2014	Identical
NBN EN 60286-4 : 2014	Identical
UNE-EN 60286-4:2000	Identical

ISO 11469:2016	Plastics — Generic identification and marking of plastics products
IEC 60191-2:2012 DB	Mechanical standardization of semiconductor devices - Part 2: Dimensions
EN 60191-3:1999	Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits
IEC 60747-1:2006+AMD1:2010 CSV	Semiconductor devices - Part 1: General
IEC 60191-3:1999	Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits

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I.S. EN 60286-4:2013

Current

Table of Contents

Abstract

General Product Information

International Equivalents

Standards Referencing This Book

Category

Subcategory

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