PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-4: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - COMPONENTS WITH J LEADS ON TWO SIDES

Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

01-01-2007

Publisher

National Standards Authority of Ireland

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For Harmonized Standards, check the EU site to confirm that the Standard is cited in the Official Journal.

Only cited Standards give presumption of conformance to New Approach Directives/Regulations.

FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 General information
  3.1 General component description
  3.2 Marking
  3.3 Packaging
  3.4 Process considerations
4 Small outlined J packages (SOJ)
  4.1 Component description
  4.2 Component dimensions
  4.3 Solder joint fillet design
  4.4 Land pattern dimensions
Annex ZA (normative) - Normative references to international
                       publications with their corresponding
                       European publications
Bibliography

Describes the component and land pattern dimensions for small outline integrated circuits with 'J' leads on two sides (SOJ components) used in the reflow soldering process.

DevelopmentNote	For CENELEC adoptions of IEC publications, please check www.iec.ch to be sure that you have any corrigenda that may apply. (01/2017)
DocumentType	Standard
Pages	26
PublisherName	National Standards Authority of Ireland
Status	Current

Standards	Relationship
BS EN 61188-5-4:2007	Identical
IEC 61188-5-4:2007	Identical
EN 61188-5-4 : 2007	Identical
DIN EN 61188-5-4:2008-07	Identical
NF EN 61188-5-4 : 2016	Identical

EN 60286-5:2004/A1:2009	PACKAGING OF COMPONENTS FOR AUTOMATIC HANDLING - PART 5: MATRIX TRAYS
IEC 60068-2-58:2015+AMD1:2017 CSV	Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
EN 61760-1:2006	SURFACE MOUNTING TECHNOLOGY - PART 1: STANDARD METHOD FOR THE SPECIFICATION OF SURFACE MOUNTING COMPONENTS (SMDS)
IEC 61760-1:2006	Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs)
IEC 60286-5:2003+AMD1:2009 CSV	Packaging of components for automatic handling - Part 5: Matrixtrays
EN 60286-3:2013/AC:2013	PACKAGING OF COMPONENTS FOR AUTOMATIC HANDLING - PART 3: PACKAGING OF SURFACE MOUNT COMPONENTS ON CONTINUOUS TAPES (IEC 60286-3:2013)
IEC 61191-1:2013	Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
IEC 61188-5-1:2002	Printed boards and printed board assemblies - Design and use - Part 5-1: Attachment (land/joint) considerations - Generic requirements
IEC 61191-2:2017	Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
IEC 60286-3:2013	Packaging of components for automatic handling - Part 3: Packaging of surface mount components on continuous tapes
EN 60286-4:2013	Packaging of components for automatic handling - Part 4: Stick magazines for electronic components encapsulated in packages of different forms
IEC 60286-4:2013	Packaging of components for automatic handling - Part 4: Stick magazines for electronic components encapsulated in packages of different forms

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I.S. EN 61188-5-4:2007

Current

Table of Contents

Abstract

General Product Information

International Equivalents

Standards Referencing This Book

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