ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-1: REQUIREMENTS FOR SOLDERING FLUXES FOR HIGH-QUALITY INTERCONNECTIONS IN ELECTRONICS ASSEMBLY

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Hardcopy , PDF

Language(s)

English

Published date

01-01-2002

Publisher

National Standards Authority of Ireland

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Only cited Standards give presumption of conformance to New Approach Directives/Regulations.

FOREWORD
INTRODUCTION
1 Scope and object
2 Normative references
3 Terms and definitions
4 Requirements
  4.1 Conflict
  4.2 Flux classification and testing
      4.2.1 Standard classification for products
      4.2.2 Composition
      4.2.3 Activity
      4.2.4 Flux characterization test methods
      4.2.5 Qualification
      4.2.6 Quality conformance
      4.2.7 Performance
      4.2.8 Labelling
5 Quality assurance provisions
  5.1 Responsibility for inspection
      5.1.1 Responsibility for compliance
      5.1.2 Test equipment and inspection facilities
      5.1.3 Inspection conditions
  5.2 Classification of inspections
  5.3 Materials inspection
  5.4 Qualification inspection
      5.4.1 Sample size
      5.4.2 Inspection routine
  5.5 Performance inspection
  5.6 Quality conformance
      5.6.1 Sampling plan
      5.6.2 Rejected lots
  5.7 Preparation of fluxes for testing
      5.7.1 Flux form for test
      5.7.2 Liquid fluxes
      5.7.3 Solid fluxes
      5.7.4 Paste flux
      5.7.5 Solder paste
      5.7.6 Other materials
6 Preparation for delivery
  6.1 Preservation-packing and packaging
7 Additional information
  7.1 Flux activity
  7.2 Flux and cleaning relationship
  7.3 Ordering data
Annex A (normative)
Bibliography

Describes general requirements for the classification and testing of soldering fluxes for high-quality interconnections in electronics assembly.

DevelopmentNote	For CENELEC adoptions of IEC publications, please check www.iec.ch to be sure that you have any corrigenda that may apply. (01/2017)
DocumentType	Standard
Pages	54
PublisherName	National Standards Authority of Ireland
Status	Current

Standards	Relationship
BS EN 61190-1-1:2002	Identical
IEC 61190-1-1:2002	Identical
NF EN 61190-1-1 : 2002	Identical
DIN EN 61190-1-1:2003-01	Identical
EN 61190-1-1:2002	Identical

IEC 61190-1-2:2014	Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
ISO 9454-2:1998	Soft soldering fluxes Classification and requirements Part 2: Performance requirements
ISO 9454-1:2016	Soft soldering fluxes Classification and requirements Part 1: Classification, labelling and packaging
IEC 61189-6:2006	Test methods for electrical materials, interconnection structures and assemblies - Part 6: Test methods for materials used in manufacturing electronic assemblies
IEC 61189-5:2006	Test methods for electrical materials, interconnection structures and assemblies - Part 5: Test methods for printed board assemblies
IEC 61189-3:2007	Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)
IEC 61191-1:2013	Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
ISO 9455-16:2013	Soft soldering fluxes Test methods Part 16: Flux efficacy test, wetting balance method
IEC 60194:2015	Printed board design, manufacture and assembly - Terms and definitions
ISO 9001:2015	Quality management systems — Requirements
IEC 61191-2:2017	Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
ISO 9453:2014	Soft solder alloys Chemical compositions and forms
IEC 61191-4:2017	Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies
ISO 9000:2015	Quality management systems — Fundamentals and vocabulary
IEC 61189-2:2006	Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures
IEC 61190-1-3:2007+AMD1:2010 CSV	Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications
IEC 61191-3:2017	Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies

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I.S. EN 61190-1-1:2002

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