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I.S. EN 61192-3:2003

Withdrawn
Withdrawn

A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.

WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - PART 3: THROUGH-HOLE MOUNT ASSEMBLIES
Available format(s)

Hardcopy , PDF

Withdrawn date

29-05-2019

Language(s)

English

Published date

28-03-2003

Publisher

National Standards Authority of Ireland

Preview

For Harmonized Standards, check the EU site to confirm that the Standard is cited in the Official Journal.

Only cited Standards give presumption of conformance to New Approach Directives/Regulations.

FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Terms and definitions
4 General requirements
   4.1 Classification
   4.2 Conflict
   4.3 Inspection techniques
   4.4 Interpretation of requirements
5 Component preparation processes
   5.1 Lead forming
   5.2 Lead protrusion and clinching
   5.3 Lead cutting/cropping
   5.4 Pre-tinning
6 Masking attributes
   6.1 Misalignment
   6.2 Improper adhesion
   6.3 Thermal capability
7 Insertion of through-hole components
   7.1 General requirements
   7.2 Orientation and mounting criteria
   7.3 Missing components
   7.4 Wrong components
   7.5 Damaged components
8 Soldering process attributes
   8.1 General requirements
   8.2 Misalignment
   8.3 Damaged components
   8.4 Solder joint characteristics
9 Cleaning attributes
   9.1 Flux residues
   9.2 Other residues
10 Rework/replacement attributes

Covers general requirements for workmanship in through-hole mount soldered assemblies on organic substrates, on printed boards, and on similar laminates attached to the surface(s) of inorganic substrates.

DevelopmentNote
For CENELEC adoptions of IEC publications, please check www.iec.ch to be sure that you have any corrigenda that may apply. (01/2017)
DocumentType
Standard
Pages
110
PublisherName
National Standards Authority of Ireland
Status
Withdrawn

Standards Relationship
IEC 61192-3:2002 Identical
NF EN 61192-3 : 2003 Identical
BS EN 61192-3:2003 Identical
EN 61192-3:2003 Identical
DIN EN 61192-3:2003-10 Identical
SN EN 61192-3 : 2003 Identical
NBN EN 61192-3 : 2004 Identical

EN 61192-4:2003 Workmanship requirements for soldered electronic assemblies - Part 4: Terminal assemblies
IEC 61192-4:2002 Workmanship requirements for soldered electronic assemblies - Part 4: Terminal assemblies
EN 61191-2:2017 Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
EN 61191-3:2017 Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies
IEC 61191-1:2013 Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
IEC 61192-1:2003 Workmanship requirements for soldered electronic assemblies - Part 1: General
IEC 60194:2015 Printed board design, manufacture and assembly - Terms and definitions
EN 61192-2:2003 Workmanship requirements for soldered electronic assemblies - Part 2: Surface-mount assemblies
IEC 61191-2:2017 Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
IEC 61191-4:2017 Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies
EN 61191-1:2013 PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES (IEC 61191-1:2013)
IEC 61192-2:2003 Workmanship requirements for soldered electronic assemblies - Part 2: Surface-mount assemblies
EN 61192-1:2003 Workmanship requirements for soldered electronic assemblies - Part 1: General
EN 61191-4:2017 Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies
IEC 61191-3:2017 Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies

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