Customer Support: 131 242

  • There are no items in your cart
We noticed you’re not on the correct regional site. Switch to our AMERICAS site for the best experience.
Dismiss alert

I.S. EN 61193-1:2002

Current

Current

The latest, up-to-date edition.

QUALITY ASSESSMENT SYSTEMS - PART 1: REGISTRATION AND ANALYSIS OF DEFECTS ON PRINTED BOARD ASSEMBLIES

Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

01-01-2002

Preview

For Harmonized Standards, check the EU site to confirm that the Standard is cited in the Official Journal.

Only cited Standards give presumption of conformance to New Approach Directives/Regulations.

FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Terms and definitions
4 Defect registration
   4.1 Accept criteria
   4.2 Counting of defects
   4.3 Post-soldering defect registration
        4.3.1 Defects found after testing
   4.4 Defect subdivision
        4.4.1 Defect sources
        4.4.2 Defect registration form
   4.5 Rework immediately prior to soldering
   4.6 Defect data categories
5 Processing the data
6 Analysis
Annex A (normative) Subprocesses
Annex B (informative) Examples of product defect qualification
Annex C (informative) Examples of calculations
Annex D (informative) Example of registration of defects and
                      processing of the data
Annex ZA (normative) Normative references to international
                      publications with their corresponding
                      European publications

Defines methods of registration and analysis of defects on soldered printed board assemblies.

DevelopmentNote
For CENELEC adoptions of IEC publications, please check www.iec.ch to be sure that you have any corrigenda that may apply. (01/2017)
DocumentType
Standard
Pages
56
PublisherName
National Standards Authority of Ireland
Status
Current

Standards Relationship
BS EN 61193-1:2002 Identical
EN 61193-1:2002 Identical
DIN EN 61193-1:2002-07 Identical
NF EN 61193-1 : 2002 Identical
IEC 61193-1:2001 Identical
NBN EN 61193-1 : 2002 Identical

IEC 61192-4:2002 Workmanship requirements for soldered electronic assemblies - Part 4: Terminal assemblies
EN 61191-2:2017 Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
EN 61191-3:2017 Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies
IEC 61191-1:2013 Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
IEC 61192-1:2003 Workmanship requirements for soldered electronic assemblies - Part 1: General
IEC 60194:2015 Printed board design, manufacture and assembly - Terms and definitions
IEC 61191-2:2017 Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
IEC 61191-4:2017 Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies
EN 61191-1:2013 PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES (IEC 61191-1:2013)
IEC 61192-2:2003 Workmanship requirements for soldered electronic assemblies - Part 2: Surface-mount assemblies
EN 61191-4:2017 Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies
IEC 61191-3:2017 Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies

View more information
$105.88
Including GST where applicable

Access your standards online with a subscription

Features

  • Simple online access to standards, technical information and regulations.

  • Critical updates of standards and customisable alerts and notifications.

  • Multi-user online standards collection: secure, flexible and cost effective.

Need help?
Call us on 131 242, then click here to start a Screen Sharing session
so we can help right away! Learn more