IEC 60068-2-82:2007
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Environmental testing - Part 2-82: Tests - Test XW1: Whisker test methods for electronic and electric components
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EN 60286-5:2004/A1:2009
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PACKAGING OF COMPONENTS FOR AUTOMATIC HANDLING - PART 5: MATRIX TRAYS
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IEC 60749-20:2008
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Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
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IEC 60068-2-58:2015+AMD1:2017 CSV
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Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
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IEC 60068-2-20:2008
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Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
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EN 60068-2-20:2008
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Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
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IEC 62090:2017
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Product package labels for electronic components using bar code and two-dimensional symbologies
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IEC 60068-2-21:2006
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Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices
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EN 62090:2017
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Product package labels for electronic components using bar code and two- dimensional symbologies
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IEC 60286-5:2003+AMD1:2009 CSV
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Packaging of components for automatic handling - Part 5: Matrixtrays
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IEC 61760-2:2007
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Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide
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EN 60286-3:2013/AC:2013
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PACKAGING OF COMPONENTS FOR AUTOMATIC HANDLING - PART 3: PACKAGING OF SURFACE MOUNT COMPONENTS ON CONTINUOUS TAPES (IEC 60286-3:2013)
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ISO 8601:2004
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Data elements and interchange formats Information interchange Representation of dates and times
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IEC 60068-2-77:1999
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Environmental testing - Part 2-77: Tests - Test 77: Body strength and impact shock
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EN 60068-2-21:2006
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Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices
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IEC 60194:2015
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Printed board design, manufacture and assembly - Terms and definitions
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IEC 60062:2016
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Marking codes for resistors and capacitors
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EN 60062:2016/AC:2016-12
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MARKING CODES FOR RESISTORS AND CAPACITORS (IEC 60062:2016/COR1:2016)
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EN 60068-2-77:1999
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Environmental testing - Part 2-77: Tests - Test 77: Body strength and impact shock
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EN 61760-2:2007
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Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide
|
EN 60068-2-82:2007
|
Environmental testing - Part 2-82: Tests - Test XW1: Whisker test methods for electronic and electric components
|
EN 60749-20:2009
|
Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
|
IEC 60286-3:2013
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Packaging of components for automatic handling - Part 3: Packaging of surface mount components on continuous tapes
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EN 60286-4:2013
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Packaging of components for automatic handling - Part 4: Stick magazines for electronic components encapsulated in packages of different forms
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IEC 60286-4:2013
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Packaging of components for automatic handling - Part 4: Stick magazines for electronic components encapsulated in packages of different forms
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EN 60068-2-45:1992/A1:1993
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Environmental testing - Part 2: Tests - Test Xa and guidance: Immersion in cleaning solvents
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EN 60194:2006
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Printed board design, manufacture and assembly - Terms and definitions
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