SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 10: MICRO-PILLAR COMPRESSION TEST FOR MEMS MATERIALS (IEC 62047-10:2011 (EQV))

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Hardcopy , PDF

Language(s)

English

Published date

01-01-2011

Publisher

National Standards Authority of Ireland

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FOREWORD
1 Scope
2 Normative references
3 Symbols and designations
4 Test piece
5 Testing method and test apparatus
6 Test report
Annex A (informative) - Error estimation using
        finite element method
Bibliography
Annex ZA (normative) - Normative references to
         international publications with their
         corresponding European publications

Describes micro-pillar compression test method to measure compressive properties of MEMS materials with high accuracy, repeatability, and moderate effort of specimen fabrication.

DevelopmentNote	For CENELEC adoptions of IEC publications, please check www.iec.ch to be sure that you have any corrigenda that may apply. (01/2017)
DocumentType	Standard
Pages	17
PublisherName	National Standards Authority of Ireland
Status	Current

Standards	Relationship
EN 62047-10 : 2011	Identical
IEC 62047-10:2011	Identical

ASTM E 9 : 2009	Standard Test Methods of Compression Testing of Metallic Materials at Room Temperature
IEC 62047-8:2011	Semiconductor devices - Micro-electromechanical devices - Part 8: Strip bending test method for tensile property measurement of thin films
EN 62047-8:2011	Semiconductor devices - Micro-electromechanical devices - Part 8: Strip bending test method for tensile property measurement of thin films

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I.S. EN 62047-10:2011

Current

Table of Contents

Abstract

General Product Information

International Equivalents

Standards Referencing This Book

Category

Subcategory

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