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SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 9: WAFER TO WAFER BONDING STRENGTH MEASUREMENT FOR MEMS

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Hardcopy , PDF

Language(s)

English

Published date

01-01-2011

Publisher

National Standards Authority of Ireland

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For Harmonized Standards, check the EU site to confirm that the Standard is cited in the Official Journal.

Only cited Standards give presumption of conformance to New Approach Directives/Regulations.

FOREWORD
1 Scope
2 Normative references
3 Measurement methods
Annex A (informative) - Example of bonding force
Annex B (informative) - An example of the fabrication
        process for three-point bending
        specimens
Bibliography
Annex ZA (normative) - Normative references to international
         publications with their corresponding European
         publications

Specifies bonding strength measurement method of wafer to wafer bonding, type of bonding process such as silicon to silicon fusion bonding, silicon to glass anodic bonding, etc., and applicable structure size during MEMS processing/assembly.

DevelopmentNote	For CENELEC adoptions of IEC publications, please check www.iec.ch to be sure that you have any corrigenda that may apply. (01/2017)
DocumentType	Standard
Pages	31
PublisherName	National Standards Authority of Ireland
Status	Current

Standards	Relationship
EN 62047-9:2011	Identical
IEC 62047-9:2011	Identical

IEC 62047-4:2008	Semiconductor devices - Micro-electromechanical devices - Part 4: Generic specification for MEMS
EN ISO 6892-1:2016	Metallic materials - Tensile testing - Part 1: Method of test at room temperature (ISO 6892-1:2016)
ISO 6892-1:2016	Metallic materials Tensile testing Part 1: Method of test at room temperature
IEC 62047-2:2006	Semiconductor devices - Micro-electromechanical devices - Part 2: Tensile testing method of thin film materials
EN 60749-19:2003/A1:2010	Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength
IEC 60747-14-1:2010	Semiconductor devices - Part 14-1: Semiconductor sensors - Generic specification for sensors
IEC 60749-19:2003+AMD1:2010 CSV	Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength

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I.S. EN 62047-9:2011

SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 9: WAFER TO WAFER BONDING STRENGTH MEASUREMENT FOR MEMS

Table of Contents

Abstract

General Product Information

International Equivalents

Standards Referencing This Book

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