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SURFACE MOUNTING TECHNOLOGY - ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SURFACE MOUNT SOLDER JOINT - PART 1-3: CYCLIC DROP TEST

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Hardcopy , PDF

Language(s)

English

Published date

01-01-2009

Publisher

National Standards Authority of Ireland

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For Harmonized Standards, check the EU site to confirm that the Standard is cited in the Official Journal.

Only cited Standards give presumption of conformance to New Approach Directives/Regulations.

FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 General remarks
5 Test equipment and materials
  5.1 Reflow soldering oven
  5.2 Drop impact test equipment
  5.3 Test substrate
  5.4 Solder alloy
  5.5 Solder paste
  5.6 Specimen components
  5.7 Strain gauge
6 Mounting method
7 Test method and procedure, and judgment conditions
  7.1 Test procedure
  7.2 Judgment conditions
8 Items to be included in the test report
9 Items to be given in the product specification
Annex A (normative) - Drop impact test equipment
Annex B (normative) - Test method and procedure
Annex C (informative) - An example of test equipment
        and procedure
Annex D (informative) - An example of strain gauge
        attachment procedure
Bibliography
Annex ZA (normative) - Normative references to international
         publications with their corresponding European
         publications

Pertains to solder joints between terminals of surface mounting devices (SMDs) and land patterns on printed wiring boards (PWBs).

DevelopmentNote	For CENELEC adoptions of IEC publications, please check www.iec.ch to be sure that you have any corrigenda that may apply. (01/2017)
DocumentType	Standard
Pages	56
PublisherName	National Standards Authority of Ireland
Status	Current

Standards	Relationship
EN 62137-1-3:2009	Identical
IEC 62137-1-3:2008	Identical

IEC 60068-1:2013	Environmental testing - Part 1: General and guidance
IEC 60068-2-27:2008	Environmental testing - Part 2-27: Tests - Test Ea and guidance: Shock
IEC 61190-1-2:2014	Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
IEC 61249-2-7:2002	Materials for printed boards and other interconnecting structures - Part 2-7: Reinforced base materials clad and unclad - Epoxide woven E-glass laminated sheet of defined flammability (vertical burning test), copper-clad
EN 60068-1:2014	Environmental testing - Part 1: General and guidance
EN 61760-1:2006	SURFACE MOUNTING TECHNOLOGY - PART 1: STANDARD METHOD FOR THE SPECIFICATION OF SURFACE MOUNTING COMPONENTS (SMDS)
IEC 61760-1:2006	Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs)
IEC 60068-2-31:2008	Environmental testing - Part 2-31: Tests - Test Ec: Rough handling shocks, primarily for equipment-type specimens
EN 61249-2-7:2002/corrigendum:2005	MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-7: REINFORCED BASE MATERIALS CLAD AND UNCLAD - EPOXIDE WOVEN E-GLASS LAMINATED SHEET OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD
EN 60068-2-27:2009	Environmental testing - Part 2-27: Tests - Test Ea and guidance: Shock
IEC 61192-1:2003	Workmanship requirements for soldered electronic assemblies - Part 1: General
IEC 60194:2015	Printed board design, manufacture and assembly - Terms and definitions
EN 61190-1-2:2014	Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
EN 61192-1:2003	Workmanship requirements for soldered electronic assemblies - Part 1: General
EN 60194:2006	Printed board design, manufacture and assembly - Terms and definitions
EN 60068-2-31:2008	ENVIRONMENTAL TESTING - PART 2-31: TESTS - TEST EC: ROUGH HANDLING SHOCKS, PRIMARILY FOR EQUIPMENT-TYPE SPECIMENS

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I.S. EN 62137-1-3:2009

SURFACE MOUNTING TECHNOLOGY - ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SURFACE MOUNT SOLDER JOINT - PART 1-3: CYCLIC DROP TEST

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Abstract

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