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TEST METHOD FOR EROSION OF WAVE SOLDERING EQUIPMENT USING MOLTEN LEAD-FREE SOLDER ALLOY - PART 2: EROSION TEST METHOD FOR METAL MATERIALS WITH SURFACE PROCESSING

Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

01-01-2016

Publisher

National Standards Authority of Ireland

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National Foreword
FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 Test
5 Erosion depth measurement
6 Items to be recorded in test report
Annex A (normative) - Specifications of test equipment
        and measurement equipment
Bibliography
Annex ZA (normative) - Normative references to
         international publications with their corresponding
         European publications

Gives an evaluating test method for the erosion of the metallic materials with surface processing intended to be used for lead-free wave soldering equipment as a solder bath and other components which are in contact with the molten solder. Also aims at prevention of an accident or a fire by predicting a setup and life of a suitable maintenance cycle.

DevelopmentNote	For CENELEC adoptions of IEC publications, please check www.iec.ch to be sure that you have any corrigenda that may apply. (01/2017)
DocumentType	Standard
Pages	46
PublisherName	National Standards Authority of Ireland
Status	Current

Standards	Relationship
EN 62739-2:2016	Identical

IEC 62739-1:2013	Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 1: Erosion test method for metal materials without surface processing
ISO 16143-3:2014	Stainless steels for general purposes Part 3: Wire
ISO 16143-2:2014	Stainless steels for general purposes Part 2: Corrosion-resistant semi-finished products, bars, rods and sections
ISO 16143-1:2014	Stainless steels for general purposes Part 1: Corrosion-resistant flat products
IEC 60194:2015	Printed board design, manufacture and assembly - Terms and definitions
EN 61190-1-3:2007/A1:2010	ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-3: REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDER FOR ELECTRONIC SOLDERING APPLICATIONS
IEC 61190-1-3:2007+AMD1:2010 CSV	Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications

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I.S. EN 62739-2:2016

TEST METHOD FOR EROSION OF WAVE SOLDERING EQUIPMENT USING MOLTEN LEAD-FREE SOLDER ALLOY - PART 2: EROSION TEST METHOD FOR METAL MATERIALS WITH SURFACE PROCESSING

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Abstract

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