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Fibre optic active components and devices - Package and interface standards - Part 21: Design guidelines of electrical interface of PIC packages using silicon fine-pitch ball grid array (S-FBGA) and silicon fine-pitch land grid array (S-FLGA) (IEC 62148-21:2021)

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Hardcopy , PDF

Language(s)

English

Published date

02-07-2021

Publisher

National Standards Authority of Ireland

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FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 Terminal position numbering
5 Code of package nominal dimensions
6 Symbols and drawings
7 Dimensions and tolerances
Bibliography

This part of IEC 62148 covers the design guidelines of the electrical interface for photonic integrated circuit (PIC) packages using silicon fine-pitch ball grid array (S-FBGA) and silicon fine-pitch land grid array (S-FLGA).

Committee	IEC/TC 86
DocumentType	Standard
ISBN	978-2-8322-9723-0
Pages	28
ProductNote	THIS STANDARD IS ALSO REFERES TO IEC TR 61931 The date of any NSAI previous adoption may not match the date of its original CEN/CENELEC document.
PublisherName	National Standards Authority of Ireland
Status	Current
Supersedes	I.S. EN IEC 62148-21:2019

Standards	Relationship
IEC 62148-21:2021	Identical
EN IEC 62148-21:2021	Identical

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I.S. EN IEC 62148-21:2021

Fibre optic active components and devices - Package and interface standards - Part 21: Design guidelines of electrical interface of PIC packages using silicon fine-pitch ball grid array (S-FBGA) and silicon fine-pitch land grid array (S-FLGA) (IEC 62148-21:2021)

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