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  • IEC 60068-2-58:2015+AMD1:2017 CSV

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    Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)

    Available format(s):  Hardcopy, PDF 1 User, PDF 3 Users, PDF 5 Users, PDF 9 Users

    Language(s):  English, English - French

    Published date:  28-07-2017

    Publisher:  International Electrotechnical Committee

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    Abstract - (Show below) - (Hide below)

    IEC 60068-2-58:2015+A1:2017 outlines test Td, applicable to surface mounting devices (SMD). This standard provides procedures for determining the solderability and resistance to soldering heat of devices in applications using solder alloys, which are eutectic or near eutectic tin lead (Pb), or lead-free alloys. The procedures use either a solder bath or reflow method and are applicable only to specimens or products designed to withstand short term immersion in molten solder or limited exposure to reflow systems. The solder bath method is applicable to SMDs designed for flow soldering and SMDs designed for reflow soldering when the solder bath (dipping) method is appropriate. The reflow method is applicable to the SMD designed for reflow soldering, to determine the suitability of SMDs for reflow soldering and when the solder bath (dipping) method is not appropriate. This edition includes the following significant technical changes with respect to the previous edition:
    - the addition of Sn-Bi low temperature solder alloy;
    - the addition of several reflow test conditions in Table 7 - Resistance to soldering heat - Test conditions and severity, reflow method;
    - introduction of reflow test method for Test Td3: Dewetting and resistance to dissolution of metallization;
    - implementation of guidance for the choice of a test severity in Clause B.3.
    This consolidated version consists of the fourth edition (2015) and its amendment 1 (2017). Therefore, no need to order amendment in addition to this publication.

    General Product Information - (Show below) - (Hide below)

    Development Note Stability Date: 2022. (08/2017)
    Document Type Standard
    Publisher International Electrotechnical Committee
    Status Current
    Supersedes

    Standards Referenced By This Book - (Show below) - (Hide below)

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    BS CECC 00802:1991 HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS. GUIDANCE DOCUMENT: CECC STANDARD METHOD FOR THE SPECIFICATION OF SURFACE MOUNTING COMPONENTS (SMDs) OF ASSESSED QUALITY
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    BS EN 62137-4:2014 Electronics assembly technology Endurance test methods for solder joint of area array type package surface mount devices
    16/30353588 DC : 0 BS EN 61020-1 ED 3.0 - ELECTROMECHANICAL SWITCHES FOR USE IN ELECTRICAL AND ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION
    BS EN 61188-5-5 : 2007 PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-5: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - COMPONENTS WITH GULL-WING LEADS ON FOUR SIDES
    NF EN 60393-5 : 2016 POTENTIOMETERS FOR USE IN ELECTRONIC EQUIPMENT - PART 5: SECTIONAL SPECIFICATION - SINGLE-TURN ROTARY LOW-POWER WIREWOUND AND NONWIREWOUND POTENTIOMETERS
    02/206181 DC : DRAFT MAY 2002 IEC 61019-1. ED.1 - SURFACE ACOUSTIC WAVE RESONATORS (SAW) OF ASSESSED QUALITY - PART 1: GENERIC SPECIFICATION
    BS EN 170000:1999 Harmonized system of quality assessment for electronic components. Generic specification: waveguide type dielectric resonators
    12/30258507 DC : 0 BS EN 62575-1 - RADIO FREQUENCY (RF) BUK ACOUSTIC WAVE (BAW) FILTERS OF ASSESSED QUALITY - PART 1: GENERIC SPECIFICATION
    05/30138794 DC : DRAFT SEP 2005
    17/30357139 DC : 0 BS EN 61760-4 + A1 - SURFACE MOUNTING TECHNOLOGY - PART 4: CLASSIFICATION, PACKAGING, LABELLING AND HANDLING OF MOISTURE SENSITIVE DEVICES
    NF EN 60512-16-21 : 2012 CONNECTORS FOR ELECTRONIC EQUIPMENT - TESTS AND MEASUREMENTS - PART 16-21: MECHANICAL TESTS ON CONTACTS AND TERMINATIONS - TEST 16U: WHISKER TEST VIA THE APPLICATION OF EXTERNAL MECHANICAL STRESSES
    BS EN 62575-1:2016 Radio frequency (RF) bulk acoustic wave (BAW) filters of assessed quality Generic specification
    I.S. EN 62604-1:2015 SURFACE ACOUSTIC WAVE (SAW) AND BULK ACOUSTIC WAVE (BAW) DUPLEXERS OF ASSESSED QUALITY - PART 1: GENERIC SPECIFICATION
    DSCC 09024 : 0 CAPACITORS, FIXED, CERAMIC, CHIP, TIGHT TOLERANCE, THIN FILM, 0402
    15/30325282 DC : 0 BS EN 62884-1 - MEASUREMENT TECHNIQUES OF PIEZOELECTRIC, DIELETIRIC AND ELECTROSTATIC OSCILLATORS - PART 1: BASIC METHODS FOR THE MEASUREMENT
    BS EN 171000:2001 Harmonized system of quality assessment for electronic components. Generic specification. Filters using waveguide type dielectric resonators
    BS EN 61338-2:2004 Waveguide type dielectric resonators Guidelines for oscillator and filter applications
    I.S. EN 61188-5-2:2003 PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-2: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - DISCRETE COMPONENTS
    10/30240248 DC : 0 BS EN 60862-1 - SURFACE ACOUSTIC WAVE (SAW) FILTERS OF ASSESSED QUALITY - PART 1: GENERIC SPECIFICATION
    BS EN 61248-1:1997 TRANSFORMERS AND INDUCTORS FOR USE IN ELECTRONIC AND TELECOMMUNICATION EQUIPMENT - PART 1: GENERIC SPECIFICATION
    BS EN 61192-1:2003 WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - PART 1: GENERAL
    DSCC 09027 : 0 CAPACITORS, FIXED, CERAMIC, CHIP, TIGHT TOLERANCE, THIN FILM, 1210
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    04/30112662 DC : DRAFT APR 2004 IEC 61810-7 ED.2 - ELECTROMECHANICAL ELEMENTARY RELAYS - PART 7: TEST AND MEASUREMENT PROCEDURES
    14/30315320 DC : 0 BS EN 60384-15 - FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 15: SECTIONAL SPECIFICATION: FIXED TANTALUM CAPACITORS WITH NON-SOLID OR SOLID ELECTROLYTE
    BS EN 60738-1-2:2008 THERMISTORS - DIRECTLY HEATED POSITIVE STEP-FUNCTION TEMPERATURE COEFFICIENT - PART 1-2: BLANK DETAIL SPECIFICATION - HEATING ELEMENT APPLICATION - ASSESSMENT LEVEL EZ
    BS EN 62884-1:2017 Measurement techniques of piezoelectric, dielectric and electrostatic oscillators Basic methods for the measurement
    NF EN 60384-1 : 2016 FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION
    03/104227 DC : DRAFT MAY 2003 IEC 60393-6 ED.1 - POTENTIOMETERS FOR USE IN ELECTRONIC EQUIPMENT - PART 6: SECTIONAL SPECIFICATION - SURFACE MOUNT PRESET POTENTIOMETERS
    06/30155911 DC : DRAFT SEP 2006 BS EN 140401-801 - DETAIL SPECIFICATION - FIXED LOW POWER FILM SMD RESISTORS - RECTANGULAR - STABILITY CLASSES 0,1; 0,25; 0,5; 1
    17/30355848 DC : 0 BS EN 60384-22 ED.3.0 - FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 22: SECTIONAL SPECIFICATION - FIXED SURFACE MOUNT MULTILAYER CAPACITORS OF CERAMIC DIELECTRIC, CLASS 2
    BS EN 60384-1:2016 Fixed capacitors for use in electronic equipment Generic specification
    02/206102 DC : DRAFT MAY 2002 IEC 60384-21, ED.1 - FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 21: SECTIONAL SPECIFICATION - FIXED SURFACE MOUNT MULTILAYER CAPACITORS OF CERAMIC DIELECTRIC - CLASS 1 - ASSESSMENT LEVEL EZ
    05/30132097 DC : DRAFT JUNE 2005 IEC 60679-1 ED 3 - QUARTZ CRYSTAL CONTROLLED OSCILLATORS OF ASSESSED QUALITY - PART 1: GENERIC SPECIFICATION
    BS EN 61051-1:2008 Varistors for use in electronic equipment Generic specification
    I.S. EN 60384-18:2016 FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 18: SECTIONAL SPECIFICATION - FIXED ALUMINIUM ELECTROLYTIC SURFACE MOUNT CAPACITORS WITH SOLID (MNO[2]) AND NON-SOLID ELECTROLYTE
    BS EN 60738-1-1:2008 Thermistors. Directly heated positive step-function temperature coefficient Blank detail specification. Current limiting application. Assessment level EZ
    CEI EN 60068-2-21 : 2006 ENVIRONMENTAL TESTING - PART 2-21: TESTS - TEST U: ROBUSTNESS OF TERMINATIONS AND INTEGRAL MOUNTING DEVICES
    DSCC 11018 : 0 INDUCTORS, SMD, CHIP, THIN FILM, TIGHT TOLERANCE, 0603
    NF EN 62674-1 : 2013 HIGH FREQUENCY INDUCTIVE COMPONENTS - PART 1: FIXED SURFACE MOUNT INDUCTORS FOR USE IN ELECTRONIC AND TELECOMMUNICATION EQUIPMENT
    CEI EN 62211 : 2005 INDUCTIVE COMPONENTS - RELIABILITY MANAGEMENT
    CEI EN 61760-1 : 2007 SURFACE MOUNTING TECHNOLOGY - PART 1: STANDARD METHOD FOR THE SPECIFICATION OF SURFACE MOUNTING COMPONENTS (SMDS)
    I.S. EN 61051-1:2008 VARISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION
    I.S. EN 61810-7:2006 ELECTROMECHANICAL ELEMENTARY RELAYS - PART 7: TEST AND MEASUREMENT PROCEDURES
    I.S. EN 60738-1-4:2008 THERMISTORS - DIRECTLY HEATED POSITIVE STEP-FUNCTION TEMPERATURE COEFFICIENT - PART 1-4: BLANK DETAIL SPECIFICATION - SENSING APPLICATION - ASSESSMENT LEVEL EZ
    OVE/ONORM EN 61051-1 : 2009 VARISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION
    I.S. EN 140402-801:2015 DETAIL SPECIFICATION: FIXED LOW POWER WIREWOUND SURFACE MOUNT (SMD) RESISTORS - RECTANGULAR - STABILITY CLASSES 0,5; 1; 2
    I.S. EN 61192-1:2003 WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - GENERAL
    IEC 62391-1:2015 Fixed electric double-layer capacitors for use in electric and electronic equipment - Part 1: Generic specification
    I.S. EN 62575-1:2016 RADIO FREQUENCY (RF) BULK ACOUSTIC WAVE (BAW) FILTERS OF ASSESSED QUALITY - PART 1: GENERIC SPECIFICATION
    I.S. EN 60539-1:2016 DIRECTLY HEATED NEGATIVE TEMPERATURE COEFFICIENT THERMISTORS - PART 1: GENERIC SPECIFICATION
    I.S. EN 61248-1:1998 TRANSFORMERS AND INDUCTORS FOR USE IN ELECTRONIC AND TELECOMMUNICATION EQUIPMENT - PART 1: GENERIC SPECIFICATION
    EN 60068-2-21:2006 Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices
    I.S. EN 61191-2:2017 PRINTED BOARD ASSEMBLIES - PART 2: SECTIONAL SPECIFICATION - REQUIREMENTS FOR SURFACE MOUNT SOLDERED ASSEMBLIES
    NF EN 62391-1 : 2018 FIXED ELECTRIC DOUBLE-LAYER CAPACITORS FOR USE IN ELECTRIC AND ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION
    PD IEC/TS 62861:2017 GUIDELINES FOR PRINCIPAL COMPONENT RELIABILITY TESTING FOR LED LIGHT SOURCES AND LED LUMINAIRES
    BS EN 61191-3:2017 Printed board assemblies Sectional specification. Requirements for through-hole mount soldered assemblies
    BS EN 61189-5-1:2016 TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-1: GENERAL TEST METHODS FOR MATERIALS AND ASSEMBLIES - GUIDANCE FOR PRINTED BOARD ASSEMBLIES
    IEC 62211:2017 Inductive components - Reliability management
    IEC 61191-4:2017 Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies
    BS EN 61191-1:2013 Printed board assemblies Generic specification. Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
    IEC 61188-5-3:2007 Printed boards and printed board assemblies - Design and use - Part 5-3: Attachment (land/joint) considerations - Components with gull-wing leads on two sides
    EN 60738-1-3:2008 Thermistors - Directly heated positive step-function temperature coefficient - Part 1-3: Blank detail specification - Inrush current application - Assessment level EZ
    EN 60738-1-1:2008 Thermistors - Directly heated positive step-function temperature coefficient - Part 1-1: Blank detail specification - Current limiting application - Assessment level EZ
    IEC 60384-1:2016 RLV Fixed capacitors for use in electronic equipment - Part 1: Generic specification
    EN 60384-22:2012 Fixed capacitors for use in electronic equipment - Part 22: Sectional specification - Fixed surface mount multilayer capacitors of ceramic dielectric, Class 2
    EN 61337-1:2004 Filters using waveguide type dielectric resonators - Part 1: Generic specification
    EN 61189-5-1:2016 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies
    EN 60738-1-2:2008 Thermistors - Directly heated positive step-function temperature coefficient - Part 1-2: Blank detail specification - Heating element application - Assessment level EZ
    EN 61019-1 : 2005 Surface acoustic wave (SAW) resonators - Part 1: Generic specification
    EN 60384-18:2016 Fixed capacitors for use in electronic equipment - Part 18: Sectional specification - Fixed aluminium electrolytic surface mount capacitors with solid (MnO2) and non-solid electrolyte
    EN 140402-801:2015 Detail specification: Fixed low power wirewound surface mount (SMD) resistors - Rectangular - Stability classes 0,5; 1; 2
    EN 60384-3:2016 Fixed capacitors for use in electronic equipment - Part 3: Sectional specification - Surface mount fixed tantalum electrolytic capacitors with solid (MnO2) electrolyte
    EN 60127-4:2005/A2:2013 Miniature fuses - Part 4: Universal modular fuse-links (UMF) - Through-hole and surface mount types
    EN 60068-3-13:2016 Environmental testing - Part 3-13: Supporting documentation and guidance on Test T - Soldering
    EN 60539-2:2004/A1:2010 DIRECTLY HEATED NEGATIVE TEMPERATURE COEFFICIENT THERMISTORS - PART 2: SECTIONAL SPECIFICATION - SURFACE MOUNT NEGATIVE TEMPERATURE COEFFICIENT THERMISTORS
    EN 60738-1-4:2008 Thermistors - Directly heated positive step-function temperature coefficient - Part 1-4: Blank detail specification - Sensing application - Assessment level EZ
    EN 60068-2-44:1995 Environmental testing - Part 2: Tests - Guidance on Test T: Soldering
    EN 61051-1:2008 Varistors for use in electronic equipment - Part 1: Generic specification
    NF EN 62025-2 : 2005 HIGH FREQUENCY INDUCTIVE COMPONENTS - NON-ELECTRICAL CHARACTERISTICS AND MEASURING METHODS - PART 2: TEST METHODS FOR NON-ELECTRICAL CHARACTERISTICS
    EN 60738-1:2006/A1:2009 THERMISTORS - DIRECTLY HEATED POSITIVE TEMPERATURE COEFFICIENT - PART 1: GENERIC SPECIFICATION
    EN 62604-1:2015 Surface acoustic wave (SAW) and bulk acoustic wave (BAW) duplexers of assessed quality - Part 1: Generic specification
    EN 61188-5-6:2003 Printed boards and printed board assemblies - Design and use - Part 5-6: Attachment (land/joint) considerations - Chip carriers with J-leads on four sides
    EN 62137:2004/corrigendum:2005 ENVIRONMENTAL AND ENDURANCE TESTING - TEST METHODS FOR SURFACE-MOUNT BOARDS OF AREA ARRAY TYPE PACKAGES FBGA, BGA, FLGA, LGA, SON AND QFN
    EN 61188-5-2:2003 Printed boards and printed board assemblies - Design and use - Part 5-2: Attachment (land/joint) considerations - Discrete components
    EN 62878-1-1:2015 Device embedded substrate - Part 1-1: Generic specification - Test methods
    EN 140401:2009 Blank Detail Specification: Fixed low power film surface mount (SMD) resistors
    I.S. EN 61191-1:2013 PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES (IEC 61191-1:2013 (EQV))
    EN 140402:2015/A1:2016 BLANK DETAIL SPECIFICATION: FIXED LOW POWER WIREWOUND SURFACE MOUNT (SMD) RESISTORS
    EN 62674-1 : 2012 HIGH FREQUENCY INDUCTIVE COMPONENTS - PART 1: FIXED SURFACE MOUNT INDUCTORS FOR USE IN ELECTRONIC AND TELECOMMUNICATION EQUIPMENT (IEC 62674-1:2012)
    EN 61188-5-5:2007 Printed boards and printed board assemblies - Design and use - Part 5-5: Attachment (land/joint) considerations - Components with gull-wing leads on four sides
    EN 61191-3:2017 Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies
    A-A-59532-1 Revision A:2006 FUSE, INCLOSED LINK, SURFACE MOUNT (SM), 63 VOLTS (V) AC/DC, QUICK ACTING
    A-A-59532-6 Revision A:2006 FUSE, INCLOSED LINK, SURFACE MOUNT (SM), 250 VOLTS (V) AC/DC, TIME DELAY
    A-A-59532-4 Revision A:2006 FUSE, INCLOSED LINK, SURFACE MOUNT (SM), 125 VOLTS (V) AC/DC, QUICK ACTING, HIGH BREAKING CAPACITY, WITH A FUSEHOLDER, BLOCK
    A-A-59532-3 Revision A:2006 FUSE, INCLOSED LINK, SURFACE MOUNT (SM), 125 VOLTS (V) AC/DC, QUICK ACTING, HIGH BREAKING CAPACITY
    A-A-59532-5 Revision A:2006 FUSE, INCLOSED LINK, SURFACE MOUNT (SM), 250 VOLTS (V) AC/DC, QUICK ACTING
    A-A-59532-2 Revision A:2006 FUSE, INCLOSED LINK, SURFACE MOUNT (SM), 63 VOLTS (V) AC/DC, QUICK ACTING WITH FUSEHOLDER, BLOCK
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    CEI EN 60512-12-3 : 2006 CONNECTORS FOR ELECTRONIC EQUIPMENT - TESTS AND MEASUREMENTS - PART 12-3: SOLDERING TESTS - TEST 12C: SOLDERABILITY, DE-WETTING
    10/30237986 DC : 0 BS EN 140401-804 - DETAIL SPECIFICATION: FIXED LOW POWER FILM HIGH STABILITY SMD RESISTORS - RECTANGULAR - STABILITY CLASSES 0,1; 0,25
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    06/30157868 DC : 0 BS EN 60393-1 - POTENTIOMETERS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION
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    12/30252220 DC : DRAFT MAR 2012 BS EN 62604-1 - SURFACE ACOUSTIC WAVE (SAW) AND BULK ACOUSTIC WAVE (BAW) DUPLEXERS - PART 1: GENERIC SPECIFICATION
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    BS EN 62326-20:2016 Printed boards Printed circuit boards for high-brightness LEDs
    BS EN 60115-8:2012 Fixed resistors for use in electronic equipment Sectional specification. Fixed surface mount resistors
    15/30332490 DC : 0 BS EN 62211 - INDUCTIVE COMPONENTS - RELIABILITY MANAGEMENT
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    BS EN 62211:2004 INDUCTIVE COMPONENTS - RELIABILITY MANAGEMENT
    07/30165180 DC : 0 BS EN 60068-2-83 - ENVIRONMENTAL TESTING - PART 2-83: TESTS - TEST TF - SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS FOR SURFACE MOUNTING DEVICES (SMD) BY THE WETTING BALANCE METHOD USING LEAD-FREE SOLDER PASTE
    BS EN 60512-12-1:2006 Connectors for electronic equipment. Tests and measurements Soldering tests - Test 12a. Solderability, wetting, solder bath method
    05/30129049 DC : DRAFT FEB 2005 IEC 62025-2 - HIGH FREQUENCY INDUCTIVE COMPONENTS - NON-ELECTRICAL CHARACTERISTICS AND MEASURING METHODS - PART 2: TEST METHODS FOR NON-ELECTRICAL CHARACTERISTICS
    03/103741 DC : DRAFT FEB 2003 IEC 61338-1 ED.1 - WAVEGUIDE TYPE DIELECTRIC RESONATORS OF ASSESSED QUALITY - PART 1: GENERIC SPECIFICATION
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    CSA E60384.1 : 2014 FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION
    BS EN 60068-2-83:2011 Environmental testing Tests. Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste
    BS EN 60738-1-3:2008 THERMISTORS - DIRECTLY HEATED POSITIVE STEP-FUNCTION TEMPERATURE COEFFICIENT - PART 1-3: BLANK DETAIL SPECIFICATION - INRUSH CURRENT APPLICATION - ASSESSMENT LEVEL EZ
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    02/206104 DC : DRAFT MAY 2002 IEC 60384-22, ED.1 - FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 22: SECTIONAL SPECIFICATION - FIXED SURFACE MOUNT MULTILAYER CAPACITORS OF CERAMIC DIELECTRIC - CLASS 2 - ASSESSMENT LEVEL EZ
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    09/30207307 DC : 0 BS EN 60115-2 - FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 2: SECTIONAL SPECIFICATION: FIXED LOW-POWER NON-WIREWOUND RESISTORS
    I.S. EN 61337-1:2005 FILTERS USING WAVEGUIDE TYPE DIELECTRIC RESONATORS - PART 1: GENERIC SPECIFICATION
    I.S. EN 60384-21:2012 FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 21: SECTIONAL SPECIFICATION - FIXED SURFACE MOUNT MULTILAYER CAPACITORS OF CERAMIC DIELECTRIC, CLASS 1 (IEC 60384-21:2011 (EQV))
    CEI EN 60393-1 : 2010 POTENTIOMETERS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION
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    I.S. EN 60384-1:2016 FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION
    IEC 61188-5-6:2003 Printed boards and printed board assemblies - Design and use - Part 5-6: Attachment (land/joint) considerations - Chip carriers with J-leads on four sides
    IEC 60115-8-1:2014 Fixed resistors for use in electronic equipment - Part 8-1: Blank detail specification: Fixed surface mount (SMD) low power film resistors for general electronic equipment, classification level G
    IEC 60068-2-44:1995 Environmental testing - Part 2-44: Tests - Guidance on test T: Soldering
    IEC 60384-1 REDLINE : 5ED 2016 FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION
    I.S. EN 140402:2015 BLANK DETAIL SPECIFICATION: FIXED LOW POWER WIREWOUND SURFACE MOUNT (SMD) RESISTORS
    IEC TR 60068-3-12:2014 Environmental testing - Part 3-12: Supporting documentation and guidance - Method to evaluate a possible lead-free solder reflow temperature profile
    CEI EN 60384-21 : 2013 FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 21: SECTIONAL SPECIFICATION - FIXED SURFACE MOUNT MULTILAYER CAPACITORS OF CERAMIC DIELECTRIC, CLASS 1
    CEI EN 60512-12-1 : 2007 CONNECTORS FOR ELECTRONIC EQUIPMENT - TESTS AND MEASUREMENTS - PART 12-1: SOLDERING TESTS - TEST 12A: SOLDERABILITY, WETTING, SOLDER BATH METHOD
    I.S. EN 61019-1:2005 SURFACE ACOUSTIC WAVE (SAW) RESONATORS - PART 1: GENERIC SPECIFICATION
    I.S. EN 140401-802:2007 DETAIL SPECIFICATION: FIXED LOW POWER FILM SMD RESISTORS - RECTANGULAR - STABILITY CLASSES 1; 2
    EN 62884-1:2017 Measurement techniques of piezoelectric, dielectric and electrostatic oscillators - Part 1: Basic methods for the measurement
    I.S. EN 60115-8:2012 FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 8: SECTIONAL SPECIFICATION - FIXED SURFACE MOUNT RESISTORS (IEC 60115-8:2009 (MOD))
    I.S. EN 60512-12-1:2006 CONNECTORS FOR ELECTRONIC EQUIPMENT - TESTS AND MEASUREMENTS - PART 12-1: SOLDERING TESTS - TEST 12A: SOLDERABILITY, WETTING,
    I.S. EN 62674-1:2012 HIGH FREQUENCY INDUCTIVE COMPONENTS - PART 1: FIXED SURFACE MOUNT INDUCTORS FOR USE IN ELECTRONIC AND TELECOMMUNICATION EQUIPMENT (IEC 62674-1:2012 (EQV))
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