Environmental testing - Part 2-83: Tests - Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste

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Hardcopy , PDF 1 User , PDF 3 Users , PDF 5 Users , PDF 9 Users

Language(s)

English - French

Published date

07-09-2011

Publisher

International Electrotechnical Committee

FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Terms and definitions
4 Test
5 Preconditioning
6 Preparation
7 Quick heating method
8 Synchronous method
9 Temperature profile method
Annex A (normative) - Equipment for the quick heating
        and synchronous method
Annex B (informative) - Reading of the output data and
        correction of the result in the quick heating test
Annex C (normative) - Test equipment for the temperature
        profile method
Annex D (informative) - Reading of the output data and
        correction of the result in the temperature
        profile test
Annex E (informative) - Caveats/Notes
Bibliography

IEC 60068-2-83:2011 provides methods for comparative investigation of the wettability of the metallic terminations or metallized terminations of SMDs with solder pastes. Data obtained by these methods are not intended to be used as absolute quantitative data for pass - fail purposes.
NOTE: Different solderability test methods for SMD are described in IEC 60068-2-58 and IEC 60068-2-69. IEC 60068-2-58 prescribes visual evaluation using solder bath and reflow method, IEC 60068-2-69 prescribes wetting balance evaluation using solder bath and solder globule method.

Committee	TC 91
DevelopmentNote	Stability date: 2020. (09/2017)
DocumentType	Standard
Pages	76
PublisherName	International Electrotechnical Committee
Status	Current

Standards	Relationship
JIS C 60068-2-83:2014	Identical
GOST R IEC 60068-2-83 : 2017	Identical
NF EN 60068-2-83 : 2012	Identical
NEN EN IEC 60068-2-83 : 2011	Identical
I.S. EN 60068-2-83:2011	Identical
PN EN 60068-2-83 : 2011	Identical
UNE-EN 60068-2-83:2011	Identical
BS EN 60068-2-83:2011	Identical
CEI EN 60068-2-83 : 2012	Identical
EN 60068-2-83 : 2011	Identical
DIN EN 60068-2-83:2012-07	Identical

EN 60068-3-13:2016	Environmental testing - Part 3-13: Supporting documentation and guidance on Test T - Soldering
CEI EN 60068-3-13 : 1ED 2017	ENVIRONMENTAL TESTING - PART 3-13: SUPPORTING DOCUMENTATION AND GUIDANCE ON TEST T - SOLDERING
11/30252855 DC : 0	BS EN 60068-3-13 - ENVIRONMENTAL TESTING - PART 3-13: SUPPORTING DOCUMENTATION AND GUIDANCE ON TEST T: SOLDERING
BS EN 60068-3-13:2016	Environmental testing Supporting documentation and guidance on Test T. Soldering
I.S. EN 60068-3-13:2016	ENVIRONMENTAL TESTING - PART 3-13: SUPPORTING DOCUMENTATION AND GUIDANCE ON TEST T - SOLDERING
IEC 60068-3-13:2016	Environmental testing - Part 3-13: Supporting documentation and guidance on Test T - Soldering

IEC 60068-1:2013	Environmental testing - Part 1: General and guidance
IEC 60068-2-58:2015+AMD1:2017 CSV	Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
IEC 60068-2-20:2008	Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
IEC 61189-5:2006	Test methods for electrical materials, interconnection structures and assemblies - Part 5: Test methods for printed board assemblies
IEC 60194:2015	Printed board design, manufacture and assembly - Terms and definitions
IEC 60068-2-69:2017	Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method
IEC 61190-1-3:2007+AMD1:2010 CSV	Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications

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IEC 60068-2-83:2011

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Abstract

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