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IEC 60191-2J:1980

Superseded
Superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

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superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

Ninth supplement - Mechanical standardization of semiconductor devices - Part 2: Dimensions
Available format(s)

Hardcopy , PDF 1 User , PDF 3 Users , PDF 5 Users , PDF 9 Users

Superseded date

23-07-2013

Language(s)

English - French, Russian

Published date

01-01-1980

Foreword
Preface
Chapter 00
Philosophy of Mechanical Standardization
Chapter 0
Recommended Values for Certain Dimensions of Drawings
of Semi-Conductor Devices and Integrated Microcircuits
Chapter I
Device Outline Drawings
Types of Semiconductor Devices Generally Mounted in the
Packages of Chapter I
Chapter II
Base Drawings
Chapter III
Case Outline Drawings
Chapter IV
Gauge Drawings
Chapter V
Tables Showing Associations between case Outlines and Bases
Obsolete Drawings
Additions to the Lists of National Codes Appearing on the Standard
Sheets of IEC Publication 60191-2

Incorporated into main document IEC 60191 PT2.

DevelopmentNote
This standard is part of the 1999 Consolidated edition of IEC 60191 PT2 1966 but can be purchased separately.
DocumentType
Standard
Pages
75
PublisherName
International Electrotechnical Committee
Status
Superseded
SupersededBy

Standards Relationship
DIN 41870-6:1984-10 Similar to
DIN 41870-5:1984-10 Similar to
NEN 10191-2 : 1997 Identical

IEC 61747-1:1998+AMD1:2003 CSV Liquid crystal and solid-state display devices - Part 1: Generic specification
IEC 60191-6-6:2001 Mechanical standardization of semiconductor devices - Part 6-6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine pitch land grid array (FLGA)

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$442.86
Including GST where applicable

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