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IEC 60191-6-16:2007

Current

Current

The latest, up-to-date edition.

Mechanical standardization of semiconductor devices - Part 6-16: Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA

Available format(s)

Hardcopy , PDF 1 User , PDF 3 Users , PDF 5 Users , PDF 9 Users

Language(s)

English, English - French

Published date

26-04-2007

FOREWORD
1 Scope
2 Normative references
3 Terms and definitions

IEC 60191-6-16:2007 gives a glossary of semiconductor sockets for BGA, LGA, FBGA and FLGA. This standard intends to establish definitions and unification of terminology relating to tests and burn-in sockets for BGA, LGA, FBGA and FLGA.

Committee
TC 47/SC 47D
DevelopmentNote
A Bilingual edition has been published. (07/2012) Stability Date: 2020. (09/2017)
DocumentType
Standard
Pages
11
PublisherName
International Electrotechnical Committee
Status
Current

IEC 60191-1:2007 Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devices
IEC 60191-2:2012 DB Mechanical standardization of semiconductor devices - Part 2: Dimensions
IEC 60191-4:2013 Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
IEC 60191-3:1999 Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits

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