Connectors for electronic equipment - Tests and measurements - Part 11-5: Climatic tests - Test 11e: Mould growth

Available format(s)

Hardcopy , PDF 1 User , PDF 3 Users , PDF 5 Users , PDF 9 Users

Language(s)

English - French, Spanish, Castilian

Published date

21-02-2002

Publisher

International Electrotechnical Committee

Foreword
1 General
2 Preparation
3 Test method
4 Details to be specified

Defines a standard test method to assess the extent and the effect of mould growth on the functioning of a component (essentially a connector) submitted to a mould culture.

Committee	TC 48/SC 48B
DevelopmentNote	Stability Date: 2017. (10/2012)
DocumentType	Standard
Pages	7
PublisherName	International Electrotechnical Committee
Status	Current

Standards	Relationship
NF EN 60512-11-5 : 2002	Identical
NEN EN IEC 60512-11-5 : 2002	Identical
I.S. EN 60512-11-5:2002	Identical
PN EN 60512-11-5 : 2002	Identical
BS EN 60512-11-5:2002	Identical
CEI EN 60512-11-5 : 2003	Identical
EN 60512-11-5 : 2002	Identical
JIS C 5402-11-5:2005	Identical
DIN EN 60512-11-5:2003-01	Identical
UNE-EN 60512-11-5:2002	Identical

03/100395 DC : DRAFT APR 2003	EN 175101-809 - DETAIL SPECIFICATION - TWO-PART CONNECTORS FOR PRINTED BOARDS HAVING A GRID OF 2,54 MM, SHORT VERSION IN COMPLIANCE WITH CECC 75 101-801, WITH ASSESSED QUALITY
EN 175101-809:2004/corrigendum Jun. 2005	DETAIL SPECIFICATION: TWO-PART CONNECTORS FOR PRINTED BOARDS HAVING A GRID OF 2,54 MM, SHORT VERSION IN COMPLIANCE WITH CECC 75 101-801, WITH ASSESSED QUALITY
BS EN 175101-809:2004	Harmonized system of quality assessment for electronic components. Detail specification Two-part connectors for printed boards having a grid of 2,54 mm, short version in compliance with CECC 75 101-801, with assessed quality
I.S. EN 175101-809:2004	DETAIL SPECIFICATION - TWO-PART CONNECTORS FOR PRINTED BOARDS HAVING A GRID OF 2.54 MM, SHORT VERSION IN COMPLIANCE WITH CECC 75101-801, WITH ASSESSED QUALITY
ISO/IEC 24739-3:2010	Information technology AT Attachment with Packet Interface - 7 Part 3: Serial transport protocols and physical interconnect (ATA/ATAPI-7 V3)

IEC 60512-3-1:2002	Connectors for electronic equipment - Tests and measurements - Part 3-1: Insulation tests - Test 3a: Insulation resistance
IEC 60512-1-1:2002	Connectors for electronic equipment - Tests and measurements - Part 1-1: General examination - Test 1a: Visual examination
IEC 60068-2-10:2005	Environmental testing - Part 2-10: Tests - Test J and guidance: Mould growth
EN 60512-3-1:2002	Connectors for electronic equipment - Tests and measurements - Part 3-1: Insulation tests - Test 3a: Insulation resistance
HD 323.2.10 : 200S3	BASIC ENVIRONMENTAL TESTING PROCEDURES - TESTS - TEST J AND GUIDANCE: MOULD GROWTH
EN 60512-1-1:2002	Connectors for electronic equipment - Tests and measurements - Part 1-1: General examination - Test 1a: Visual examination

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IEC 60512-11-5:2002

Current

Table of Contents

Abstract

General Product Information

International Equivalents

Standards Referenced By This Book

Standards Referencing This Book

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