Insulation coordination for equipment within low-voltage systems - Part 3: Use of coating, potting or moulding for protection against pollution

Available format(s)

Hardcopy , PDF 1 User , PDF 3 Users , PDF 5 Users , PDF 9 Users

Language(s)

English

Published date

04-11-2016

Publisher

International Electrotechnical Committee

FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Terms and definitions
4 Design requirements
5 Tests
Annex A (normative) - Test sequences
Annex B (normative) - Decisions to be taken by
the technical committees
Annex C (normative) - Printed wiring board for
testing coatings
Bibliography

IEC 60664-3:2016 RLV contains both the official IEC International Standard and its Redline version. The Redline version is available in English only and provides you with a quick and easy way to compare all the changes between the official IEC Standard and its previous edition.
IEC 60664-3:2016 applies to assemblies protected against pollution by the use of coating, potting or moulding, thus allowing a reduction of clearance and creepage distances as described in IEC 60664-1. This document describes the requirements and test procedures for two methods of protection:
- type 1 protection improves the microenvironment of the parts under the protection;
- type 2 protection is considered to be similar to solid insulation. This edition includes the following significant technical changes with respect to the previous edition:
a) information added concerning interpolation;
b) provided scratch test is only for type 2 protection;
c) renumbered the scratch test to follow the visual examination test, since it makes more sense there;
d) separated the tables under what is now called Annex A, to make them clearer.

Committee	TC 109
DevelopmentNote	Stability Date: 2021. (11/2016)
DocumentType	Redline
Pages	77
PublisherName	International Electrotechnical Committee
Status	Current
Supersedes	IEC 60664-3:2003+AMD1:2010 CSV IEC 60664-3:2003/AMD1:2010/COR1:2010 IEC 60664-3:2003 IEC 60664-3:2003/AMD1:2010

IEC 60454-3-1:1998+AMD1:2001 CSV	Pressure-sensitive adhesive tapes for electrical purposes - Part 3: Specifications for individual materials - Sheet 1: PVC film tapes with pressure-sensitive adhesive
ISO/IEC Guide 51:2014	Safety aspects Guidelines for their inclusion in standards
IEC 61189-3:2007	Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)
IEC GUIDE 104:2010	The preparation of safety publications and the use of basic safety publications and group safety publications
IEC 60068-2-2:2007	Environmental testing - Part 2-2: Tests - Test B: Dry heat
IEC 60194:2015	Printed board design, manufacture and assembly - Terms and definitions
IEC 60068-2-1:2007	Environmental testing - Part 2-1: Tests - Test A: Cold
IEC 60068-2-14:2009	Environmental testing - Part 2-14: Tests - Test N: Change of temperature
IEC 60664-1:2007	Insulation coordination for equipment within low-voltage systems - Part 1: Principles, requirements and tests
IEC 61189-2:2006	Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures