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IEC 60747-10:1991

Withdrawn
Withdrawn

A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.

Semiconductor devices - Part 10: Generic specification for discrete devices and integrated circuits
Available format(s)

Hardcopy , PDF 1 User , PDF 3 Users , PDF 5 Users , PDF 9 Users

Withdrawn date

31-12-2021

Published date

21-05-1991

Foreword
      Preface
1 Scope
2 General
      2.1 Order of precedence
      2.2 Related documents
      2.3 Units, symbols and terminology
      2.4 Preferred values of voltages, currents and
             temperatures
      2.5 Marking
             2.5.1 Terminal identification
             2.5.2 Type designation
             2.5.3 Manufacturer's name or trade mark
             2.5.4 Inspection lot identification code
      2.6 Categories of assessed quality
      2.7 Screening
      2.8 Handling
3 Quality Assessment Procedures
      3.1 Eligibility for qualification approval
             3.1.1 Primary stage of manufacture
      3.2 Commercially confidential information
      3.3 Formation of inspection lots
      3.4 Structurally similar devices
      3.5 Granting of qualification approval
      3.6 Quality conformance inspectionance testing
             3.6.1 Division into groups and sub-groups
             3.6.2 Inspection requirements
             3.6.3 Supplementary procedure for reduced
                      inspection
             3.6.4 Sampling requirements for small lots
             3.6.5 Certified Records of Released Lots
                      (CRRL)
             3.6.6 Delivery of devices subjected to
                      destructive or non-destructive tests
             3.6.7 Delayed deliveries
             3.6.8 Supplementary procedure for deliveries
      3.7 Statistical sampling procedures
             3.7.1 AQL (Acceptable Quality Level) sampling
                      plans
             3.7.2 Lot Tolerance Per Cent Defective (LTPD)
                      sampling plans
             3.7.3 Correlation between AQL and LTPD
                      sampling plans
      3.8 Endurance tests where LTPD is specified
      3.9 Endurance tests where the failure rate is
             specified
             3.9.1 General
             3.9.2 Selection of samples
             3.9.3 Failures
             3.9.4 Endurance test time and sample size
             3.9.5 Procedure to be used if the number of
                      observed failures exceeds the acceptance
                      number
      3.10 Accelerated test procedures
             3.10.1 Requirements for eligibility in periodic
                      testing
             3.10.2 Procedure for thermally-accelerated
                      electrical endurance testing
             3.10.3 Damp heat (under consideration)
             3.10.4 Voltage (under consideration)
      3.11 Capability approval
             3.11.1 General
             3.11.2 Terms and definitions
             3.11.3 Procedure for granting capability
                      approval
             3.11.4 Capability approval maintenance
                      procedure
             3.11.5 Procedure for reduction, extension or
                      change of capability approval
             3.11.6 Procedure in case of deficiency in
                      maintenance of the capability approval
             3.11.7 Capability manual
             3.11.8 Capability test programme
             3.11.9 Verification of capability approval
                      (quality audit)
             3.11.10 Quality assurance of products delivered
                      under capability approval
             3.11.11 Marking and ordering information
             3.11.12 Capability abstract for publication
                      purposes
             3.11.13 Detail specifications for custom
                      components
             3.11.14 Detail specifications for catalogue
                      products
             3.11.15 Detail specification register
4 Test and measurement procedures
      4.1 Standard atmospheric conditions for electrical
             and optical measurements
      4.2 Physical examination
             4.2.1 Visual examination
             4.2.2 Dimensions
             4.2.3 Permanence of marking
      4.3 Electrical and optical measurements
             4.3.1 General conditions and precautions
      4.4 Environmental tests
Appendix A - Lot Tolerance Per Cent Defective (LTPD)
             Table A-I - LTPD sampling plans
             Table A-II - Hypergeometric sampling plans for
                          small lot sizes of 200 or less
             Table A-III - AQL and LTPD sampling plans
Appendix B - Dimensions to be checked
Appendix C - Directions for applied forces for mechanical
             tests

It is a generic specification for semiconductor devices, discretedevices and integrated circuits, including multichip integratedcircuits, but excluding hybrid circuits.It defines general procedures for quality assessment to be used inthe IECQ System and gives general rules for measuring methods ofelectrical characteristics, climatic and mechanical tests, andendurance tests.

Committee
TC 47/SC 47E
DevelopmentNote
AMD 1 & AMD 2 are withdrawn. (08/2005) Stability Date: 2015. (10/2012)
DocumentType
Standard
Pages
107
PublisherName
International Electrotechnical Committee
Status
Withdrawn
Supersedes

Standards Relationship
PN 92/T-01103 : 1992 Identical
BS IEC 60747-10:1991 Identical
DIN IEC 60747-10:1987-10 Identical
NEN 10747-10 : 1997 AMD 3 1997 Identical
UTEC 96 010 : 1989 Identical

11/30234042 DC : 0 BS EN 62595-1-1 ED.1 - LCD BACKLIGHT UNIT - PART 1-1: GENERIC SPECIFICATION
BS EN 190100:1993 Harmonized system of quality assessment for electronic components: sectional specification: digital monolithic integrated circuits
BS QC 720102:1997 Blank detail specification for laser diode modules with pigtail for fibre optic systems and subsystems
BS IEC 62679-1-1:2014 Electronic paper displays Terminology
BS QC 720106:1997 Harmonized system of quality assessment for electronic components. Semiconductor devices. Optoelectronic devices. Blank detail specification for avalanche photodiodes (APDs) with/without pigtail, for fibre optic systems or subsystems
BS QC 750111:1991 Specification for harmonized system of quality assessment for electronic components. Semiconductor discrete devices. Blank detail specification. Bidirectional triode thyristors (triacs), ambient or case-rated, up to 100 A
BS QC750116(2000) : 2000 SEMICONDUCTOR DEVICES - DISCRETE DEVICES - MICROWAVE DIODES AND TRANSISTORS - INTEGRATED-CIRCUIT MICROWAVE AMPLIFIERS - BLANK DETAIL SPECIFICATION
12/30244653 DC : 0 BS EN 62679-1 - ELECTRONIC PAPER DISPLAY - PART 1:TERMINOLOGY AND GENERIC SPECIFICATION
BS IEC 60747-4.2 : 2000 SEMICONDUCTOR DEVICES - DISCRETE DEVICES - MICROWAVE DIODES AND TRANSISTORS - INTEGRATED-CIRCUIT MICROWAVE AMPLIFIERS - BLANK DETAIL SPECIFICATION
BS IEC 60748-11:2000 Semiconductor devices. Integrated circuits Sectional specification for semiconductor integrated circuits excluding hybrid circuits
CEI EN 61747-1 : 2004 LIQUID CRYSTAL AND SOLID-STATE DISPLAY DEVICES - PART 1: GENERIC SPECIFICATION
IEC 61747-1-1:2014 Liquid crystal display devices - Part 1-1: Generic - Generic specification
IEC 60748-2-12:2001 Semiconductor devices - Integrated circuits - part2-12: Digital integrated circuits - Blank detail specification for programmable logic devices (PLDs)
IEC 60747-4-2:2000 Semiconductor devices - Discrete devices - Part 4-2: Microwave diodes and transistors - Integrated-circuit microwave amplifiers - Blank detail specification
BS CECC 90300:1988 Harmonized system of quality assessment for electronic components. Sectional specification: interface monolithic integrated circuits
12/30268616 DC BS EN 61747-1-1. Liquid crystal display devices. Generic. Generic specification
BS QC 790109:1992 Specification for harmonized system of quality assessment for electronic components. Semiconductor devices. Integrated circuits.Family specification for HCMOS digital integrated circuits series 54/74 HC, 54/74 HCT, 54/74 HCU
BS QC720101(1995) : 1995 DISCRETE SEMICONDUCTOR DEVICES AND INTEGRATED CIRCUITS - BLANK DETAIL SPECIFICATION FOR LIGHT EMITTING/INFRARED EMITTING DIODES WITH/WITHOUT PIGTAIL FOR FIBRE OPTIC SYSTEMS AND SUB-SYSTEMS
BS QC 720105:1997 Harmonized system of quality assessment for electronic components. Semiconductor devices. Optoelectronic devices. Blank detail specification for pin-photodiodes with/without pigtail, for fibre optic systems or subsystems
BS IEC 60748-2.12 : 2001 SEMICONDUCTOR DEVICES - INTEGRATED CIRCUITS - DIGITAL INTEGRATED CIRCUITS - BLANK DETAIL SPECIFICATION FOR PROGRAMMABLE LOGIC DEVICES (PLDS)
BS IEC 60747-12.1 : 1995 DISCRETE SEMICONDUCTOR DEVICES AND INTEGRATED CIRCUITS - BLANK DETAIL SPECIFICATION FOR LIGHT EMITTING/INFRARED EMITTING DIODES WITH/WITHOUT PIGTAIL FOR FIBRE OPTIC SYSTEMS AND SUB-SYSTEMS
BS QC790100(1991) : 1991 AMD 10586 HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS - SEMICONDUCTOR DEVICES - SECTIONAL SPECIFICATION FOR SEMICONDUCTOR INTEGRATED CIRCUITS EXCLUDING HYBRID CIRCUITS
IEC 60747-11:1985 Semiconductor devices. Discrete devices. Part 11: Sectionalspecification for discrete devices
IEC 62679-1-1:2014 Electronic paper displays - Part 1-1: Terminology
IEC 60747-12-2:1995 Semiconductor devices - Part 12: Optoelectronic devices - Section 2: Blank detail specification for laser diode modules with pigtail for fibre optic systems and sub-systems
IEC 60748-2-11:1999 Semiconductor devices - Integrated circuits - Part 2-11: Digital integrated circuits - Blank detail specification for single supply integrated circuit, electrically erasable, and programmable read-only memory
BS EN 62595-1-1:2013 LCD backlight unit Generic specification
BS QC 720104:1997 Harmonized system of quality assessment for electronic components. Semiconductor devices. Optoelectronic devices. Blank detail specification for pin-FET modules with/without pigtail, for fibre optic systems or subsystems
BS EN 61747-1:2000 Liquid crystal and solid-state display devices Generic specification
IEC 60747-12-1:1995 Semiconductor devices - Part 12: Optoelectronic devices - Section 1: Blank detail specification for light emitting/infrared emitting diodes with/without pigtail for fibre optic systems and sub-systems
IEC 60748-11:1990 Semiconductor devices - Integrated circuits - Part 11: Sectional specification for semiconductor integrated circuits excluding hybrid circuits
IEC 60747-12:1991 Semiconductor devices - Part 12: Sectional specification foroptoelectronic devices
IEC 62595-1-1:2013 LCD backlight unit - Part 1-1: Generic specification
IEC 61747-1:1998+AMD1:2003 CSV Liquid crystal and solid-state display devices - Part 1: Generic specification
EN 62595-1-1:2013 LCD backlight unit - Part 1-1: Generic specification
CEI EN 62595-1-1 : 2014 LCD BACKLIGHT UNIT - PART 1-1: GENERIC SPECIFICATION
00/203087 DC : DRAFT AUG 2000 IEC 62147 - INTEGRATED CIRCUITS - UNIFIED QUALIFICATION STANDARD TO MEET IECQ AND END-USER CERTIFICATION
DIN EN 190000:1996-05 GENERIC SPECIFICATION - MONOLITHIC INTEGRATED CIRCUITS
BS QC 750000(1986) : 1986 HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS - DISCRETE SEMICONDUCTOR DEVICES - SECTIONAL SPECIFICATION
IEC 60747-4-1:2000 Semiconductor devices - Discrete devices - Part 4-1: Microwave diodes and transistors - Microwave field effect transistors - Blank detail specification
I.S. EN 62595-1-1:2013 LCD BACKLIGHT UNIT - PART 1-1: GENERIC SPECIFICATION (IEC 62595-1-1:2013 (EQV))
NF EN 62595-1-1 : 2013 LCD BACKLIGHT UNIT - PART 1-1: GENERIC SPECIFICATION
EN 61747-1:1999/A1:2003 LIQUID CRYSTAL AND SOLID-STATE DISPLAY DEVICES - PART 1: GENERIC SPECIFICATION
BS CECC90100(1987) : AMD 7845 HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS: SECTIONAL SPECIFICATION: DIGITAL MONOLITHIC INTEGRATED CIRCUITS

IEC 60068-1:2013 Environmental testing - Part 1: General and guidance
IEC 60191-1:2007 Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devices
ISO 2859:1974 Sampling procedures and tables for inspection by attributes
IEC 60747-5:1992 Semiconductor devices - Discrete devices and integrated circuits -Part 5: Optoelectronic devices
IEC 60027-1:1992 Letters symbols to be used in electrical technology - Part 1: General
IEC 60191-2:2012 DB Mechanical standardization of semiconductor devices - Part 2: Dimensions
IEC 60410:1973 Sampling plans and procedures for inspection by attributes
IEC 60748-11:1990 Semiconductor devices - Integrated circuits - Part 11: Sectional specification for semiconductor integrated circuits excluding hybrid circuits
ISO 8601:2004 Data elements and interchange formats Information interchange Representation of dates and times
IEC 60747-1:2006+AMD1:2010 CSV Semiconductor devices - Part 1: General
IEC 60749:1996+AMD1:2000+AMD2:2001 CSV Semiconductor devices - Mechanical and climatic test methods
IEC 60748-1:2002 Semiconductor devices - Integrated circuits - Part 1: General
IEC 60748-2:1997 Semiconductor devices - Integrated circuits - Part 2: Digital integrated circuits
IEC 60068-2-1:2007 Environmental testing - Part 2-1: Tests - Test A: Cold
IEC 60748-3:1986 Semiconductor devices - Integrated circuits - Part 3: Analogue integrated circuits
IEC 60191-3:1999 Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits
IEC 60747-11:1985 Semiconductor devices. Discrete devices. Part 11: Sectionalspecification for discrete devices

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