IEC 60748-1:2002
Current
The latest, up-to-date edition.
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English - French
08-05-2002
FOREWORD
1 Scope and object
2 Normative references
3 Presentation and requirements of the IEC 60748 series
4 Terminology
4.1 General terms
4.2 Types of devices
4.3 Clamping characteristics of integrated circuits
4.4 Technological concepts
4.5 Particular device types of integrated circuits
5 Letter symbols
5.1 Basic letters
5.2 Subscripts for digital integrated circuits
5.3 Subscripts for analogue integrated circuits
6 Essential ratings and characteristics
6.1 Introduction
6.2 Standard format for the presentation of published
data
6.3 Method for describing essential ratings and
characteristics and function specification of
integrated circuits
6.4 Definitions
6.5 Definitions of cooling conditions
6.6 List of preferred temperatures
6.7 List of preferred voltages
6.8 Mechanical ratings, characteristics and other data
6.9 Production spread and compliance
6.10 Printed wiring and printed circuits
6.11 General scheme for all types of integrated circuits
7 Measuring methods
7.1 Basic requirements
7.2 Specific requirements on the measuring methods
7.3 Numbering system for measuring methods
8 Acceptance and reliability of integrated circuits
8.1 General remarks
8.2 General principles
8.3 Electrical endurance tests
9 Electrostatic sensitive devices
Constitutes the general part of IEC 60748. Together with the relevant material of IEC 60747-1, it gives general information on integrated circuits.
| Committee |
TC 47/SC 47A
|
| DevelopmentNote |
Supersedes IEC 60148 (03/2001) Also numbered as BS 6493-2.1(1985) (08/2002) To be read in conjunction with IEC 60747-1 and IEC 60050-521. (09/2002) Supersedes IEC 60186B. (07/2004) Stability Date: 2020. (09/2017)
|
| DocumentType |
Standard
|
| Pages |
57
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Current
|
| Supersedes |
| Standards | Relationship |
| BS IEC 60748-1:2002 | Identical |
| NEN IEC 60748-1 : 2002 | Identical |
| DIN IEC 60748-1:1988-01 | Identical |
| UTEC 96 041 : 89 AMD 1 91 | Identical |
| BS EN 61747-5:1998 | Liquid crystal and solid-state display devices Environmental, endurance and mechanical test methods |
| BS IEC 60748-23-3:2002 | Semiconductor devices. Integrated circuits. Hybrid integrated circuits and film structures. Manufacturing line certification Manufacturers\' self-audit checklist and report |
| BS EN 190100:1993 | Harmonized system of quality assessment for electronic components: sectional specification: digital monolithic integrated circuits |
| BS QC750116(2000) : 2000 | SEMICONDUCTOR DEVICES - DISCRETE DEVICES - MICROWAVE DIODES AND TRANSISTORS - INTEGRATED-CIRCUIT MICROWAVE AMPLIFIERS - BLANK DETAIL SPECIFICATION |
| BS EN 60749:1999 | Semiconductor devices. Mechanical and climatic test methods |
| BS EN 60747-16-10:2004 | Semiconductor devices Technology Approval Schedule (TAS) for monolithic microwave integrated circuits |
| BS IEC 60748-2:1997 | Semiconductor devices. Integrated circuits Digital integrated circuits |
| BS EN 165000-1:1996 | Film and hybrid integrated circuits Generic specification. Capability approval procedure |
| IEC 61747-5:1998 | Liquid crystal and solid-state display devices - Part 5: Environmental, endurance and mechanical test methods |
| EN 61964:1999 | Integrated circuits - Memory devices pin configurations |
| EN 61747-5:1998 | Liquid crystal and solid-state display devices - Part 5: Environmental, endurance and mechanical test methods |
| OVE/ONORM EN 60027-2 : 2007 | LETTER SYMBOLS TO BE USED IN ELECTRICAL TECHNOLOGY - PART 2: TELECOMMUNICATIONS AND ELECTRONICS |
| 06/30153491 DC : DRAFT JULY 2006 | EN 60748-2-20 - SEMICONDUCTOR DEVICES - INTEGRATED CIRCUITS - PART 2-20: DIGITAL INTEGRATED CIRCUITS - FAMILY SPECIFICATION - LOW VOLTAGE INTEGRATED CIRCUITS |
| BS IEC 60748-5:1997 | Semiconductor devices. Integrated circuits Semicustom integrated circuits |
| BS EN 61964:1999 | Integrated circuits. Memory devices pin configurations |
| CEI EN 60747-16-10 : 2005 | SEMICONDUCTOR DEVICES - PART 16-10: TECHNOLOGY APPROVAL SCHEDULE (TAS) FOR MONOLITHIC MICROWAVE INTEGRATED CIRCUITS |
| BS IEC 60748-11:2000 | Semiconductor devices. Integrated circuits Sectional specification for semiconductor integrated circuits excluding hybrid circuits |
| I.S. EN 60027-2:2007 | LETTER SYMBOLS TO BE USED IN ELECTRICAL TECHNOLOGY - PART 2: TELECOMMUNICATIONS AND ELECTRONICS |
| I.S. EN 60747-16-10:2004 | SEMICONDUCTOR DEVICES - PART 16-10: TECHNOLOGY APPROVAL SCHEDULE (TAS) FOR MONOLITHIC MICROWAVE INTEGRATED CIRCUITS |
| IEC 60748-23-2:2002 | Semiconductor devices - Integrated circuits - Part 23-2: Hybrid integrated circuits and film structures - Manufacturing line certification - Internal visual inspection and special tests |
| IEC 60749:1996+AMD1:2000+AMD2:2001 CSV | Semiconductor devices - Mechanical and climatic test methods |
| BS CECC 90300:1988 | Harmonized system of quality assessment for electronic components. Sectional specification: interface monolithic integrated circuits |
| BS CECC17000(1992) : 1992 AMD 9626 | HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS - GENERIC SPECIFICATION - SOLID STATE ALL OR NOTHING RELAYS - GENERIC DATA AND METHODS OF TEST |
| 11/30252972 DC : 0 | BS EN 61747-10-1 - LIQUID CRYSTAL DISPLAY DEVICES - PART 10-1: ENVIRONMENTAL, ENDURANCE AND MECHANICAL TEST METHODS - MECHANICAL |
| BS IEC 60748-23-1:2002 | Semiconductor devices. Integrated circuits. Hybrid integrated circuits and film structures. Manufacturing line certification Generic specification |
| BS QC 763000(1990) : AMD 6754 | HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS. FILM AND HYBRID FILM INTEGRATED CIRCUITS. GENERIC SPECIFICATION |
| BS QC790100(1991) : 1991 AMD 10586 | HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS - SEMICONDUCTOR DEVICES - SECTIONAL SPECIFICATION FOR SEMICONDUCTOR INTEGRATED CIRCUITS EXCLUDING HYBRID CIRCUITS |
| IEC 60748-11:1990 | Semiconductor devices - Integrated circuits - Part 11: Sectional specification for semiconductor integrated circuits excluding hybrid circuits |
| IEC 60747-10:1991 | Semiconductor devices - Part 10: Generic specification for discrete devices and integrated circuits |
| IEC 60748-23-1:2002 | Semiconductor devices - Integrated circuits - Part 23-1: Hybrid integrated circuits and film structures - Manufacturing line certification - Generic specification |
| I.S. EN 61747-5:1999 | LIQUID CRYSTAL AND SOLID-STATE DISPLAY DEVICES - PART 5: ENVIRONMENTAL, ENDURANCE AND MECHANICAL TEST METHODS |
| IEC 60748-4:1997 | Semiconductor devices - Integrated circuits - Part 4: Interface integrated circuits |
| 01/205674 DC : DRAFT JUL 2001 | IEC 60747-16-10 ED.1 - TECHNOLOGY APPROVAL SCHEDULE FOR MONOLITHIC MICROWAVE INTEGRATED CIRCUITS |
| 11/30252977 DC : 0 | BS EN 61747-10-2 - LIQUID CRYSTAL DISPLAY DEVICES - PART 10-2: ENVIRONMENTAL, ENDURANCE AND MECHANICAL TEST METHODS - ENVIRONMENTAL AND ENDURANCE |
| NF EN 60027-2 : 2007 | LETTER SYMBOLS TO BE USED IN ELECTRICAL TECHNOLOGY - PART 2: TELECOMMUNICATIONS AND ELECTRONICS |
| BS EN 61747-1:2000 | Liquid crystal and solid-state display devices Generic specification |
| I.S. EN 61964:2000 | INTEGRATED CIRCUITS - MEMORY DEVICES PIN CONFIGURATIONS |
| I.S. EN 165000-1:1998 | FILM AND HYBRID INTEGRATED CIRCUITS - PART 1: GENERIC SPECIFICATION CAPABILITY APPROVAL PROCEDURE |
| IEC 61747-10-2:2014 | Liquid crystal display devices - Part 10-2: Environmental, endurance and mechanical test methods - Environmental and endurance |
| IEC 61747-1:1998+AMD1:2003 CSV | Liquid crystal and solid-state display devices - Part 1: Generic specification |
| IEC 61964:1999 | Integrated circuits - Memory devices pin configurations |
| IEC 60747-16-10:2004 | Semiconductor devices - Part 16-10: Technology Approval Schedule (TAS) for monolithic microwave integrated circuits |
| DIN EN 190000:1996-05 | GENERIC SPECIFICATION - MONOLITHIC INTEGRATED CIRCUITS |
| BS IEC 60747-4.2 : 2000 | SEMICONDUCTOR DEVICES - DISCRETE DEVICES - MICROWAVE DIODES AND TRANSISTORS - INTEGRATED-CIRCUIT MICROWAVE AMPLIFIERS - BLANK DETAIL SPECIFICATION |
| BS IEC 60748-23-2:2002 | Semiconductor devices. Integrated circuits. Hybrid integrated circuits and film structures. Manufacturing line certification Internal visual inspection and special tests |
| BIS IS 15934-5 : 2011 | LIQUID CRYSTAL AND SOLID-STATE DISPLAY DEVICES - PART 5: ENVIRONMENTAL, ENDURANCE AND MECHANICAL TEST METHODS |
| IEC 60748-2:1997 | Semiconductor devices - Integrated circuits - Part 2: Digital integrated circuits |
| IEC 60748-23-3:2002 | Semiconductor devices - Integrated circuits - Part 23-3: Hybrid integrated circuits and film structures - Manufacturing line certification - Manufacturers' self-audit checklist and report |
| BS EN 45510-2-2:1999 | Guide for the procurement of power station equipment. Electrical equipment Uninterruptible power supplies - Uninterruptible power supplies for power plants |
| EN 60747-16-10:2004 | Semiconductor devices - Part 16-10: Technology Approval Schedule (TAS) for monolithic microwave integrated circuits |
| EN 165000-1:1996 | Film and hybrid integrated circuits - Part 1: Generic specification - Capability approval procedure |
| EN 60749 : 99 AMD 2 2001 | SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS |
| BS CECC90100(1987) : AMD 7845 | HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS: SECTIONAL SPECIFICATION: DIGITAL MONOLITHIC INTEGRATED CIRCUITS |
| IEC 60319:1999 | Presentation and specification of reliability data for electronic components |
| IEC 60747-1:2006+AMD1:2010 CSV | Semiconductor devices - Part 1: General |
| IEC 60617-13:1993 | Graphical symbols for diagrams - Part 13: Analogue elements |
| IEC 60050-521:2002 | International Electrotechnical Vocabulary (IEV) - Part 521: Semiconductor devices and integrated circuits |
| IEC 60617-12:1997 | Graphical symbols for diagrams - Part 12: Binary logic elements |
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