Semiconductor devices - Mechanical and climatic test methods - Part 1: General

Amended by

IEC 60749-1:2002/COR1:2003

Available format(s)

Hardcopy , PDF 1 User , PDF 3 Users , PDF 5 Users , PDF 9 Users

Published date

30-08-2002

Publisher

International Electrotechnical Committee

FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Terms, definitions and letter symbols
4 Standard atmospheric conditions
5 Electrical measurements
6 Use of electrically defective devices

Applicable to semiconductor devices (discrete devices and integrated circuits) and establishes provisions common to all the other parts of the series.The contents of the corrigendum of August 2003 have been included in this copy.

Committee	TC 47
DevelopmentNote	Supersedes IEC 60749. (03/2008) Stability Date: 2021. (11/2017)
DocumentType	Standard
Pages	15
PublisherName	International Electrotechnical Committee
Status	Current
Supersedes	IEC 60749:1996+AMD1:2000+AMD2:2001 CSV

Standards	Relationship
BS EN 60749-1:2003	Identical
CEI EN 60749-1 : 2005	Identical
EN 60749-1:2003	Identical
DIN EN 60749-1:2003-12	Identical
NF EN 60749-1 : 2003	Identical
UNE-EN 60749-1:2004	Identical
NEN EN IEC 60749-1 : 2003	Identical
I.S. EN 60749-1:2003	Identical
PN EN 60749-1 : 2005	Identical
SN EN 60749-1 : 2003	Identical

13/30264591 DC : 0	BS EN 60747-14-6 ED 1.0 - SEMICONDUCTOR DEVICES - PART 14-6: SEMICONDUCTOR SENSORS - HUMIDITY SENSOR
BS EN 62137-4:2014	Electronics assembly technology Endurance test methods for solder joint of area array type package surface mount devices
07/30172404 DC : DRAFT DEC 2007	BS EN 62047-9 - SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 9: WAFER TO WAFER BONDING STRENGTH MEASUREMENT FOR MEMS
EN 62137:2004/corrigendum:2005	ENVIRONMENTAL AND ENDURANCE TESTING - TEST METHODS FOR SURFACE-MOUNT BOARDS OF AREA ARRAY TYPE PACKAGES FBGA, BGA, FLGA, LGA, SON AND QFN
IEC 60747-14-4:2011	Semiconductor devices - Discrete devices - Part 14-4: Semiconductor accelerometers
BS IEC 60747-14-5:2010	Semiconductor devices Semiconductor sensors. PN-junction semiconductor temperature sensor
07/30170374 DC : DRAFT AUG 2007	BS EN 61751-2 - LASER MODULES USED FOR TELECOMMUNICATIONS - RELIABILITY ASSESSMENT - PART 2: TECHNICAL REPORT ON LASER MODULE DEGRADATION
IEC 62137:2004	Environmental and endurance testing - Test methods for surface-mount boards of area array type packages FBGA, BGA, FLGA, LGA, SON and QFN
BS EN 62137:2004	Environmental and endurance testing. Test methods for surface-mount boards of area array type packages FBGA, BGA, FLGA, LGA, SON and QFN
07/30162213 DC : 0	BS EN 60747-15 - SEMICONDUCTOR DEVICES - DISCRETE DEVICES - PART 15: ISOLATED POWER SEMICONDUCTOR DEVICES
BS IEC 60747-14-4:2011	Semiconductor devices. Discrete devices Semiconductor accelerometers
07/30172155 DC : DRAFT OCT 2007	BS EN 62047-5 - SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 5: RF MEMS SWITCHES
IEC 60747-14-5:2010	Semiconductor devices - Part 14-5: Semiconductor sensors - PN-junction semiconductor temperature sensor
IEC 62137-4:2014	Electronics assembly technology - Part 4: Endurance test methods for solder joint of area array type package surface mount devices
13/30264600 DC : 0	BS EN 60747-14-8 ED 1.0 - SEMICONDUCTOR DEVICES - PART 14-8: SEMICONDUCTOR SENSORS - CAPACITIVE DEGRADATION SENSOR OF LIQUID
I.S. EN 62137:2005	ENVIRONMENTAL AND ENDURANCE TESTING - TEST METHODS FOR SURFACE-MOUNT BOARDS OF AREA ARRAY TYPE PACKAGES FBGA, BGA, FLGA, LGA, SON AND QFN
07/30164953 DC : 0	IEC 60747-14-5 - SEMICONDUCTOR DEVICES - DISCRETE DEVICES - PART 14-5: SEMICONDUCTOR SENSORS - PN-JUNCTION SEMICONDUCTOR TEMPERATURE SENSOR
12/30271778 DC : 0	BS EN 62137-4 ED.1 - ELECTRONICS ASSEMBLY TECHNOLOGY - PART 4: ENDURANCE TEST METHODS FOR SOLDER JOINT OF AREA ARRAY TYPE PACKAGE SURFACE MOUNT DEVICES
I.S. EN 62137-4:2014	ELECTRONICS ASSEMBLY TECHNOLOGY - PART 4: ENDURANCE TEST METHODS FOR SOLDER JOINT OF AREA ARRAY TYPE PACKAGE SURFACE MOUNT DEVICES
13/30264596 DC : 0	BS EN 60747-14-7 ED 1.0 - SEMICONDUCTOR DEVICES - PART 14-7: SEMICONDUCTOR SENSORS - FLOW METER
PD IEC/TR 62572-2:2008	Fibre optic active components and devices. Reliability standards Laser module degradation
IEC TR 62572-2:2008	Fibre optic active components and devices - Reliability standards - Part 2: Laser module degradation
EN 62137-4:2014/AC:2015	ELECTRONICS ASSEMBLY TECHNOLOGY - PART 4: ENDURANCE TEST METHODS FOR SOLDER JOINT OF AREA ARRAY TYPE PACKAGE SURFACE MOUNT DEVICES (IEC 62137-4:2014)

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IEC 60749-1:2002

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Abstract

General Product Information

International Equivalents

Standards Referenced By This Book

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