Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength

Amended by

IEC 60749-19:2003/AMD1:2010

Available format(s)

Hardcopy , PDF 1 User , PDF 3 Users , PDF 5 Users , PDF 9 Users

Language(s)

English, English - French

Published date

29-11-2010

Publisher

International Electrotechnical Committee

Foreword
1 Scope
2 Description of the test apparatus
3 Test method
4 Failure criteria
5 Requirements
6 Categories of separation
7 Summary

IEC 60749-19:2003+A1:2010 determines the integrity of materials and procedures used to attach semiconductor die to package headers or other substrates. This test method is generally only applicable to cavity packages or as a process monitor. It is not applicable for die areas greater than 10 mm2. It is also not applicable to flip chip technology or to flexible substrates. This consolidated version consists of the first edition (2003) and its amendment 1 (2010). Therefore, no need to order amendment in addition to this publication.

Committee	TC 47
DevelopmentNote	Supersedes IEC 60749. (03/2008) Stability Date: 2020. (09/2017)
DocumentType	Standard
Pages	18
PublisherName	International Electrotechnical Committee
Status	Current
Supersedes	IEC 60749:1996+AMD1:2000+AMD2:2001 CSV

Standards	Relationship
NF EN 60749-19 : 2003 AMD 1 2011	Identical
NEN EN IEC 60749-19 : 2003 AMD 1 2010	Identical
I.S. EN 60749-19:2003	Identical
PN EN 60749-19 : 2005 AMD 1 2010	Identical
SN EN 60749-19 : 2003	Identical
EN 60749-19:2003/A1:2010	Identical
DIN EN 60749-19:2011-01	Identical
BS EN 60749-19 : 2003	Identical

CEI EN 62047-9 : 2012	SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 9: WAFER TO WAFER BONDING STRENGTH MEASUREMENT FOR MEMS
13/30264596 DC : 0	BS EN 60747-14-7 ED 1.0 - SEMICONDUCTOR DEVICES - PART 14-7: SEMICONDUCTOR SENSORS - FLOW METER
13/30264600 DC : 0	BS EN 60747-14-8 ED 1.0 - SEMICONDUCTOR DEVICES - PART 14-8: SEMICONDUCTOR SENSORS - CAPACITIVE DEGRADATION SENSOR OF LIQUID
BS EN 62047-9:2011	Semiconductor devices. Micro-electromechanical devices Wafer to wafer bonding strength measurement for MEMS
13/30264591 DC : 0	BS EN 60747-14-6 ED 1.0 - SEMICONDUCTOR DEVICES - PART 14-6: SEMICONDUCTOR SENSORS - HUMIDITY SENSOR
IEC TS 62686-1:2015	Process management for avionics - Electronic components for aerospace, defence and high performance (ADHP) applications - Part 1: General requirements for high reliability integrated circuits and discrete semiconductors
I.S. EN 62047-9:2011	SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 9: WAFER TO WAFER BONDING STRENGTH MEASUREMENT FOR MEMS
PD IEC/TS 62686-1:2015	Process management for avionics. Electronic components for aerospace, defence and high performance (ADHP) applications General requirements for high reliability integrated circuits and discrete semiconductors
IEC 62047-9:2011	Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement for MEMS
EN 62047-9:2011	Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement for MEMS

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IEC 60749-19:2003+AMD1:2010 CSV

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