Semiconductor devices - Mechanical and climatic test methods - Part 31: Flammability of plastic-encapsulated devices (internally induced)

Amended by

IEC 60749-31:2002/COR1:2003

Available format(s)

Hardcopy , PDF 1 User , PDF 3 Users , PDF 5 Users , PDF 9 Users

Published date

30-08-2002

Publisher

International Electrotechnical Committee

FOREWORD
INTRODUCTION
1 Scope and object
2 Normative references
3 Test Procedure

Applicable to semiconductor devices (discrete devices and integrated circuits), this test determines whether the device ignites due to internal heating caused by excessive overloads.The contents of the corrigendum of August 2003 have been included in this copy.

Committee	TC 47
DevelopmentNote	Supersedes IEC 60749. (03/2008) Stability Date: 2021. (11/2017)
DocumentType	Standard
Pages	9
PublisherName	International Electrotechnical Committee
Status	Current
Supersedes	IEC 60749:1996+AMD1:2000+AMD2:2001 CSV

Standards	Relationship
NF EN 60749-31 : 2003	Identical
NEN EN IEC 60749-31 : 2003	Identical
I.S. EN 60749-31:2003	Identical
PN EN 60749-31 : 2005	Identical
SN EN 60749-31 : 2003	Identical
BS EN 60749-31:2003	Identical
CEI EN 60749-31 : 2004	Identical
EN 60749-31:2003	Identical
DIN EN 60749-31:2003-12	Identical
UNE-EN 60749-31:2004	Identical

13/30264591 DC : 0	BS EN 60747-14-6 ED 1.0 - SEMICONDUCTOR DEVICES - PART 14-6: SEMICONDUCTOR SENSORS - HUMIDITY SENSOR
13/30264600 DC : 0	BS EN 60747-14-8 ED 1.0 - SEMICONDUCTOR DEVICES - PART 14-8: SEMICONDUCTOR SENSORS - CAPACITIVE DEGRADATION SENSOR OF LIQUID
13/30264596 DC : 0	BS EN 60747-14-7 ED 1.0 - SEMICONDUCTOR DEVICES - PART 14-7: SEMICONDUCTOR SENSORS - FLOW METER

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IEC 60749-31:2002

Semiconductor devices - Mechanical and climatic test methods - Part 31: Flammability of plastic-encapsulated devices (internally induced)

Table of Contents

Abstract

General Product Information

International Equivalents

Standards Referenced By This Book

Category

Subcategory