Semiconductor devices - Mechanical and climatic test methods - Part 32: Flammability of plastic-encapsulated devices (externally induced)

Amended by

IEC 60749-32:2002/AMD1:2010

Available format(s)

Hardcopy , PDF 1 User , PDF 3 Users , PDF 5 Users , PDF 9 Users

Language(s)

English, English - French

Published date

29-11-2010

Publisher

International Electrotechnical Committee

FOREWORD
INTRODUCTION
1 Scope and object
2 Normative references
3 Test Procedure

IEC 60749-32:2002+A1:2010 is applicable to semiconductor devices (discrete devices and integrated circuits). The object of this test is to determine whether the device ignites due to external heating. The test uses a needle flame, simulating the effect of small flames which may result from fault conditions within equipment containing the device. This consolidated version consists of the first edition (2002) and its amendment 1 (2010). Therefore, no need to order amendment in addition to this publication.

Committee	TC 47
DevelopmentNote	Supersedes IEC 60749. (03/2008) Stability Date: 2015. (10/2012)
DocumentType	Standard
Pages	14
PublisherName	International Electrotechnical Committee
Status	Current
Supersedes	IEC 60749:1996+AMD1:2000+AMD2:2001 CSV

Standards	Relationship
NF EN 60749-32 : 2003 AMD 1 2011	Identical
NEN EN IEC 60749-32 : 2003 AMD 1 2010	Identical
I.S. EN 60749-32:2003	Identical
PN EN 60749-32 : 2005 AMD 1 2010	Identical
SN EN 60749-32 : 2003	Identical
UNE-EN 60749-32:2004	Identical
BS EN 60749-32 : 2003	Identical
EN 60749-32:2003/A1:2010	Identical
DIN EN 60749-32:2011-01	Identical

13/30264591 DC : 0	BS EN 60747-14-6 ED 1.0 - SEMICONDUCTOR DEVICES - PART 14-6: SEMICONDUCTOR SENSORS - HUMIDITY SENSOR
13/30264600 DC : 0	BS EN 60747-14-8 ED 1.0 - SEMICONDUCTOR DEVICES - PART 14-8: SEMICONDUCTOR SENSORS - CAPACITIVE DEGRADATION SENSOR OF LIQUID
IEC TS 62686-1:2015	Process management for avionics - Electronic components for aerospace, defence and high performance (ADHP) applications - Part 1: General requirements for high reliability integrated circuits and discrete semiconductors
PD IEC/TS 62686-1:2015	Process management for avionics. Electronic components for aerospace, defence and high performance (ADHP) applications General requirements for high reliability integrated circuits and discrete semiconductors
13/30264596 DC : 0	BS EN 60747-14-7 ED 1.0 - SEMICONDUCTOR DEVICES - PART 14-7: SEMICONDUCTOR SENSORS - FLOW METER

IEC 60695-11-5 : 2.0	FIRE HAZARD TESTING - PART 11-5: TEST FLAMES - NEEDLE-FLAME TEST METHOD - APPARATUS, CONFIRMATORY TEST ARRANGEMENT AND GUIDANCE
IEC 60695-11-5:2016	Fire hazard testing - Part 11-5: Test flames - Needle-flame test method - Apparatus, confirmatory test arrangement and guidance

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IEC 60749-32:2002+AMD1:2010 CSV

Semiconductor devices - Mechanical and climatic test methods - Part 32: Flammability of plastic-encapsulated devices (externally induced)

Table of Contents

Abstract

General Product Information

International Equivalents

Standards Referenced By This Book

Standards Referencing This Book

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