IEC 60749-5:2017
Superseded
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
View Superseded by
superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
Semiconductor devices - Mechanical and climatic test methods - Part 5: Steady-state temperature humidity bias life test
Available format(s)
Hardcopy , PDF 1 User , PDF 3 Users , PDF 5 Users , PDF 9 Users
Superseded date
19-12-2023
Language(s)
English - French, English
Published date
10-04-2017
Publisher
FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 General
5 Equipment
6 Test conditions
7 Procedures
8 Failure criteria
9 Safety
10 Summary
IEC 60749-5:2017 provides a steady-state temperature and humidity bias life test for the purpose of evaluating the reliability of non-hermetic packaged solid-state devices in humid environments.
This second edition cancels and replaces the first edition published in 2003. This edition constitutes a technical revision.
This edition includes the following significant technical changes with respect to the previous edition:
a) correction of an error in an equation;
b) inclusion of notes for guidance;
c) clarification of the applicability of test conditions.
| Committee |
TC 47
|
| DevelopmentNote |
Supersedes IEC PAS 62161 (04/2003) Supersedes IEC 60749. (03/2008) Stability Date: 2023. (04/2017)
|
| DocumentType |
Standard
|
| ISBN |
978-2-8322-7379-1
|
| Pages |
18
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Superseded
|
| SupersededBy | |
| Supersedes |
| Standards | Relationship |
| BS EN 60749-5:2017 | Identical |
| EN 60749-5:2017 | Identical |
| CEI EN 60749-5 : 2005 | Identical |
| DIN EN 60749-5:2003-09 | Identical |
| NEN EN IEC 60749-5 : 2017 | Identical |
| UNE-EN 60749-5:2017 | Identical |
| DS EN 60749-5 : 2017 | Identical |
| NF EN 60749-5 : 2003 | Identical |
| PN EN 60749-5 : 2017 | Identical |
| UNE-EN 60749-5:2003 | Identical |
| 14/30296894 DC : 0 | BS EN 62830-1 - SEMICONDUCTOR DEVICES - SEMICONDUCTOR DEVICES FOR ENERGY HARVESTING AND GENERATION - PART 1: VIBRATION BASED PIEZOELECTRIC ENERGY HARVESTING |
| I.S. EN 60749-4:2017 | SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 4: DAMP HEAT, STEADY STATE, HIGHLY ACCELERATED STRESS TEST (HAST) |
| BS EN 60749-43:2017 | Semiconductor devices - Mechanical and climatic test methods Guidelines for IC reliability qualification plans |
| BS IEC 62830-3 : 2017 | SEMICONDUCTOR DEVICES - SEMICONDUCTOR DEVICES FOR ENERGY HARVESTING AND GENERATION - PART 3: VIBRATION BASED ELECTROMAGNETIC ENERGY HARVESTING |
| CEI EN 60747-15 : 2012 | SEMICONDUCTOR DEVICES - DISCRETE DEVICES - PART 15: ISOLATED POWER SEMICONDUCTOR DEVICES |
| BS EN 60749-30 : 2005 | SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 30: PRECONDITIONING OF NON-HERMETIC SURFACE MOUNT DEVICES PRIOR TO RELIABILITY TESTING |
| EN 60747-15:2012 | Semiconductor devices - Discrete devices - Part 15: Isolated power semiconductor devices |
| EN 60749-4:2017 | Semiconductor devices - Mechanical and climatic test methods - Part 4: Damp heat, steady state, highly accelerated stress test (HAST) |
| NF EN 60749-30 : 2005 AMD 1 2011 | SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 30: PRECONDITIONING OF NON-HERMETIC SURFACE MOUNT DEVICES PRIOR TO RELIABILITY TESTING |
| IEC 60747-14-4:2011 | Semiconductor devices - Discrete devices - Part 14-4: Semiconductor accelerometers |
| 16/30341341 DC : 0 | BS EN 60749-4 - SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 4: DAMP HEAT, STEADY STATE, HIGHLY ACCELERATED STRESS TEST (HAST) |
| IEC 62830-3:2017 | Semiconductor devices - Semiconductor devices for energy harvesting and generation - Part 3: Vibration based electromagnetic energy harvesting |
| 17/30336994 DC : 0 | BS IEC 62969-3 ED.1.0 - SEMICONDUCTOR DEVICES - SEMICONDUCTOR INTERFACE FOR AUTOMOTIVE VEHICLES - PART 3: SHOCK DRIVEN PIEZOELECTRIC ENERGY HARVESTING FOR AUTOMOTIVE VEHICLE SENSORS |
| BS IEC 60747-14-5:2010 | Semiconductor devices Semiconductor sensors. PN-junction semiconductor temperature sensor |
| 14/30301992 DC : 0 | BS EN 62830-3 - SEMICONDUCTOR DEVICES - SEMICONDUCTOR DEVICES FOR ENERGY HARVESTING AND GENERATION - PART 3: VIBRATION BASED ELECTROMAGNETIC ENERGY HARVESTING |
| I.S. EN 60747-15:2012 | SEMICONDUCTOR DEVICES - DISCRETE DEVICES - PART 15: ISOLATED POWER SEMICONDUCTOR DEVICES (IEC 60747-15:2010 (EQV)) |
| EN 60749-43:2017 | Semiconductor devices - Mechanical and climatic test methods - Part 43: Guidelines for IC reliability qualification plans |
| I.S. EN 60749-24:2004 | SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 24: ACCELERATED MOISTURE RESISTANCE - UNBIASED HAST |
| IEC 62830-1:2017 | Semiconductor devices - Semiconductor devices for energy harvesting and generation - Part 1: Vibration based piezoelectric energy harvesting |
| IEC 62047-5:2011 | Semiconductor devices - Micro-electromechanical devices - Part 5: RF MEMS switches |
| 07/30162213 DC : 0 | BS EN 60747-15 - SEMICONDUCTOR DEVICES - DISCRETE DEVICES - PART 15: ISOLATED POWER SEMICONDUCTOR DEVICES |
| BS IEC 60747-14-4:2011 | Semiconductor devices. Discrete devices Semiconductor accelerometers |
| CEI EN 60749-24 : 2012 | SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 24: ACCELERATED MOISTURE RESISTANCE - UNBIASED HAST |
| BS EN 60747-15:2012 | Semiconductor devices. Discrete devices Isolated power semiconductor devices |
| BS EN 60749-4:2017 | Semiconductor devices. Mechanical and climatic test methods Damp heat, steady state, highly accelerated stress test (HAST) |
| IEC TS 62686-1:2015 | Process management for avionics - Electronic components for aerospace, defence and high performance (ADHP) applications - Part 1: General requirements for high reliability integrated circuits and discrete semiconductors |
| EN 60749-30 : 2005 AMD 1 2011 | SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 30: PRECONDITIONING OF NON-HERMETIC SURFACE MOUNT DEVICES PRIOR TO RELIABILITY TESTING |
| 13/30264591 DC : 0 | BS EN 60747-14-6 ED 1.0 - SEMICONDUCTOR DEVICES - PART 14-6: SEMICONDUCTOR SENSORS - HUMIDITY SENSOR |
| 15/30269562 DC : 0 | BS EN 60749-43 - SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 43: GUIDELINES FOR LSI RELIABILITY QUALIFICATION PLANS |
| 13/30264600 DC : 0 | BS EN 60747-14-8 ED 1.0 - SEMICONDUCTOR DEVICES - PART 14-8: SEMICONDUCTOR SENSORS - CAPACITIVE DEGRADATION SENSOR OF LIQUID |
| BS EN 62047-5:2011 | Semiconductor devices. Micro-electromechanical devices RF MEMS switches |
| BS EN 60749-24:2004 | Semiconductor devices. Mechanical and climatic test methods Accelerated moisture resistance. Unbiased HAST |
| IEC 60747-14-5:2010 | Semiconductor devices - Part 14-5: Semiconductor sensors - PN-junction semiconductor temperature sensor |
| CEI EN 60749-43 : 1ED 2018 | SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 43: GUIDELINES FOR IC RELIABILITY QUALIFICATION PLANS |
| I.S. EN 62047-5:2011 | SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 5: RF MEMS SWITCHES |
| I.S. EN 60749-30:2005 | SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 30: PRECONDITIONING OF NON-HERMETIC SURFACE MOUNT DEVICES PRIOR TO RELIABILITY TESTING |
| CEI EN 60749-4 : 2004 | SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 4: DAMP HEAT, STEADY STATE, HIGHLY ACCELERATED STRESS TEST (HAST) |
| IEC 60749-24:2004 | Semiconductor devices - Mechanical and climatic test methods - Part 24: Accelerated moisture resistance - Unbiased HAST |
| PD IEC/TS 62686-1:2015 | Process management for avionics. Electronic components for aerospace, defence and high performance (ADHP) applications General requirements for high reliability integrated circuits and discrete semiconductors |
| 13/30264596 DC : 0 | BS EN 60747-14-7 ED 1.0 - SEMICONDUCTOR DEVICES - PART 14-7: SEMICONDUCTOR SENSORS - FLOW METER |
| IEC 60749-4:2017 | Semiconductor devices - Mechanical and climatic test methods - Part 4: Damp heat, steady state, highly accelerated stress test (HAST) |
| IEEE C62.35-2010 | IEEE Standard Test Methods for Avalanche Junction Semiconductor Surge-Protective Device Components |
| I.S. EN 60749-43:2017 | SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 43: GUIDELINES FOR IC RELIABILITY QUALIFICATION PLANS |
| IEC 60749-43:2017 | Semiconductor devices - Mechanical and climatic test methods - Part 43: Guidelines for IC reliability qualification plans |
| IEC 60749-30:2005+AMD1:2011 CSV | Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing |
| IEC 60747-15:2010 | Semiconductor devices - Discrete devices - Part 15: Isolated power semiconductor devices |
| EN 62047-5:2011 | Semiconductor devices - Micro-electromechanical devices - Part 5: RF MEMS switches |
| EN 60749-24:2004 | Semiconductor devices - Mechanical and climatic test methods - Part 24: Accelerated moisture resistance - Unbiased HAST |
| IEC 60749-4:2017 | Semiconductor devices - Mechanical and climatic test methods - Part 4: Damp heat, steady state, highly accelerated stress test (HAST) |
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Hardcopy - English - French
PDF 1 User - English - French
PDF 3 Users - English - French
PDF 5 Users - English - French
PDF 9 Users - English - French
Hardcopy - English
PDF 1 User - English
PDF 3 Users - English
PDF 5 Users - English
PDF 9 Users - English
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