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IEC 60749-8:2002

Current
Current

The latest, up-to-date edition.

Semiconductor devices - Mechanical and climatic test methods - Part 8: Sealing
Available format(s)

Hardcopy , PDF 1 User , PDF 3 Users , PDF 5 Users , PDF 9 Users

Published date

30-08-2002

FOREWORD
INTRODUCTION
1 Scope and object
2 Normative references
3 General terms
   3.1 Units of pressure
   3.2 Standard leak rate
   3.3 Measured leak rate
   3.4 Equivalent standard leak rate
4 Bomb pressure test
5 Fine leak detection: radioactive krypton method
   5.1 Object
   5.2 General description
   5.3 Personnel precautions
   5.4 Procedure
   5.5 Specified conditions
   5.6 Gross leak detection
6 Fine leak detection: tracer gas (helium) method with mass
   spectrometer
   6.1 General
   6.2 Method 1: specimens not filled with helium during
        manufacture - Fixed method
   6.3 Method 2: specimens not filled with helium during
       manufacture - Flexible method
   6.4 Method 3: specimens filled with helium during manufacture
   6.5 Gross leak detection
7 Gross leaks, perfluorocarbon vapour method using electronic
   detection apparatus
   7.1 Object
   7.2 General description
   7.3 Test apparatus
   7.4 Test method
   7.5 Reject criterion
8 Gross leak - Perfluorocarbon - bubble detection method
9 Test condition E, weight-gain gross-leak detection
   9.1 Object
   9.2 Equipment
   9.3 Procedure
   9.4 Failure criteria
10 Penetrant dye gross leak detection
11 Gross leak re-test

Applicable to semiconductor devices (discrete devices and integrated circuits), it determines the leak rate of semiconductor devices.The contents of the corrigenda of April 2003 and August 2003 have been included in this copy.

Committee
TC 47
DevelopmentNote
Supersedes IEC 60749. (03/2008) Stability Date: 2021. (11/2017)
DocumentType
Standard
Pages
31
PublisherName
International Electrotechnical Committee
Status
Current
Supersedes

Standards Relationship
NF EN 60749-8 : 2003 Identical
UNE-EN 60749-8:2004 Identical
NEN EN IEC 60749-8 : 2003 Identical
I.S. EN 60749-8:2003 Identical
PN EN 60749-8 : 2005 Identical
SN EN 60749-8 : 2003 Identical
BS EN 60749-8:2003 Identical
CEI EN 60749-8 : 2004 Identical
EN 60749-8:2003 Identical
DIN EN 60749-8:2003-12 Identical

13/30264591 DC : 0 BS EN 60747-14-6 ED 1.0 - SEMICONDUCTOR DEVICES - PART 14-6: SEMICONDUCTOR SENSORS - HUMIDITY SENSOR
BS EN 60749-14:2003 Semiconductor devices. Mechanical and climatic test methods Robustness of terminations (lead integrity)
I.S. EN 62572-3:2016 FIBRE OPTIC ACTIVE COMPONENTS AND DEVICES - RELIABILITY STANDARDS - PART 3: LASER MODULES USED FOR TELECOMMUNICATION
I.S. EN 60749-7:2011 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 7: INTERNAL MOISTURE CONTENT MEASUREMENT AND THE ANALYSIS OF OTHER RESIDUAL GASES (IEC 60749-7:2011 (EQV))
BS EN 60749-7:2011 Semiconductor devices. Mechanical and climatic test methods Internal moisture content measurement and the analysis of other residual gases
I.S. EN 60749-14:2003 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 14: ROBUSTNESS OF TERMINATIONS (LEAD INTEGRITY)
IEC 60749-14:2003 Semiconductor devices - Mechanical and climatic test methods - Part 14: Robustness of terminations (lead integrity)
15/30323391 DC : 0 BS EN 62572-3 - FIBRE OPTIC ACTIVE COMPONENTS AND DEVICES - RELIABILITY STANDARDS PART 3: LASER MODULES USED FOR TELECOMMUNICATION
13/30277892 DC : 0 BS EN 62572-3 ED 2.0 - FIBRE OPTIC ACTIVE COMPONENTS AND DEVICES - RELIABILITY STANDARDS - PART 3: LASER MODULES USED FOR TELECOMMUNICATION
13/30264600 DC : 0 BS EN 60747-14-8 ED 1.0 - SEMICONDUCTOR DEVICES - PART 14-8: SEMICONDUCTOR SENSORS - CAPACITIVE DEGRADATION SENSOR OF LIQUID
BS EN 62572-3:2016 Fibre optic active components and devices. Reliability standards Laser modules used for telecommunication
IEC TS 62686-1:2015 Process management for avionics - Electronic components for aerospace, defence and high performance (ADHP) applications - Part 1: General requirements for high reliability integrated circuits and discrete semiconductors
CEI EN 60749-7 : 2012 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 7: INTERNAL MOISTURE CONTENT MEASUREMENT AND THE ANALYSIS OF OTHER RESIDUAL GASES
IEC 62572-3:2016 Fibre optic active components and devices - Reliability standards - Part 3: Laser modules used for telecommunication
PD IEC/TS 62686-1:2015 Process management for avionics. Electronic components for aerospace, defence and high performance (ADHP) applications General requirements for high reliability integrated circuits and discrete semiconductors
13/30264596 DC : 0 BS EN 60747-14-7 ED 1.0 - SEMICONDUCTOR DEVICES - PART 14-7: SEMICONDUCTOR SENSORS - FLOW METER
CEI EN 60749-14 : 2004 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 14: ROBUSTNESS OF TERMINATIONS (LEAD INTEGRITY)
IEC 60749-7:2011 Semiconductor devices - Mechanical and climatic test methods - Part 7: Internal moisture content measurement and the analysis of other residual gases
EN 62572-3:2016 Fibre optic active components and devices - Reliability standards - Part 3: Laser modules used for telecommunication
EN 60749-14:2003 Semiconductor devices - Mechanical and climatic test methods - Part 14: Robustness of terminations (lead integrity)
EN 60749-7:2011 Semiconductor devices - Mechanical and climatic test methods - Part 7: Internal moisture content measurement and the analysis of other residual gases

IEC 60068-2-17:1994 Basic environmental testing procedures - Part 2-17: Tests - Test Q: Sealing

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