Semiconductor devices - Mechanical and climatic test methods - Part 9: Permanence of marking

Available format(s)

Hardcopy , PDF 1 User , PDF 3 Users , PDF 5 Users , PDF 9 Users

Language(s)

English - French, English

Published date

03-03-2017

Publisher

International Electrotechnical Committee

FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 Equipment
5 Safety precautions
6 Procedure
7 Failure criteria
8 Summary
Bibliography

IEC 60749-9:2017 is to determine whether the marks on solid state semiconductor devices will remain legible when subjected to the application and removal of labels or the use of solvents and cleaning solutions commonly used during the removal of solder flux residue from the printed circuit board manufacturing process.
This test is applicable for all package types. It is suitable for use in qualification and/or process monitor testing. The test is considered non-destructive. Electrical or mechanical rejects can be used for the purpose of this test.
This edition includes the following significant technical changes with respect to the previous edition:
a) revision to Clause 4 Equipment by a complete rewriting of Clause 3 Terms and definitions;
b) additional variant – ‘adhesive tape pull test’.

Committee	TC 47
DevelopmentNote	Supersedes IEC PAS 62175 (08/2002) Supersedes IEC 60749. (03/2008) Stability Date: 2022. (03/2017)
DocumentType	Standard
ISBN	978-2-8322-7383-8
Pages	17
PublisherName	International Electrotechnical Committee
Status	Current
Supersedes	IEC PAS 62175:2000 IEC 60749-9:2002/COR1:2003 IEC 60749:1996+AMD1:2000+AMD2:2001 CSV IEC 60749-9:2002

Standards	Relationship
NF EN 60749-9:2017	Identical
EN 60749-9:2017	Identical
CEI EN 60749-9 : 2004	Identical
PN EN 60749-9 : 2017	Identical
BS EN 60749-9:2002	Identical
NEN EN IEC 60749-9 : 2017	Identical
DIN EN 60749-9:2016-09 (Draft)	Identical
UNE-EN 60749-9:2017	Identical
NF EN 60749-9 : 2002	Identical
BS EN 60749-9:2017	Identical
UNE-EN 60749-9:2003	Identical

13/30264591 DC : 0	BS EN 60747-14-6 ED 1.0 - SEMICONDUCTOR DEVICES - PART 14-6: SEMICONDUCTOR SENSORS - HUMIDITY SENSOR
EN 60749-3:2017	Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual examination
IEC TS 62686-1:2015	Process management for avionics - Electronic components for aerospace, defence and high performance (ADHP) applications - Part 1: General requirements for high reliability integrated circuits and discrete semiconductors
BS EN 60749-3:2017	Semiconductor devices. Mechanical and climatic test methods External visual examination
13/30264600 DC : 0	BS EN 60747-14-8 ED 1.0 - SEMICONDUCTOR DEVICES - PART 14-8: SEMICONDUCTOR SENSORS - CAPACITIVE DEGRADATION SENSOR OF LIQUID
I.S. EN 60749-3:2017	SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 3: EXTERNAL VISUAL EXAMINATION
IEC 60749-3:2017	Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual examination
PD IEC/TS 62686-1:2015	Process management for avionics. Electronic components for aerospace, defence and high performance (ADHP) applications General requirements for high reliability integrated circuits and discrete semiconductors
13/30264596 DC : 0	BS EN 60747-14-7 ED 1.0 - SEMICONDUCTOR DEVICES - PART 14-7: SEMICONDUCTOR SENSORS - FLOW METER

IEC 61340-2-3:2016	Electrostatics - Part 2-3: Methods of test for determining the resistance and resistivity of solid materials used to avoid electrostatic charge accumulation
FED-STD-101 Revision C:1980	TEST PROCEDURES FOR PACKAGING MATERIALS

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IEC 60749-9:2017

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