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IEC 61188-1-1:1997

Withdrawn
Withdrawn

A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.

Printed boards and printed board assemblies - Design and use - Part 1-1: Generic requirements - Flatness considerations for electronic assemblies
Available format(s)

Hardcopy , PDF 1 User , PDF 3 Users , PDF 5 Users , PDF 9 Users

Withdrawn date

12-09-2022

Language(s)

English - French

Published date

26-08-1997

FOREWORD
INTRODUCTION
1 Scope
2 Normative reference
3 Basic requirements
    3.1 Design
    3.2 Rigid board manufacture
    3.3 Assembly
    3.4 Use
4 Deviations from flatness - rigid copper-clad base
    material
    4.1 Causes
    4.2 Prevention and correction
    4.3 Test methods and requirements
5 Deviations from flatness - Unassembled rigid
    printed boards
    5.1 Causes
    5.2 Prevention
    5.3 Rectification
    5.4 Requirements for flatness
    5.5 Measurement methods
6 Deviations from flatness - Rigid printed board
    assemblies
    6.1 Causes
    6.2 Prevention
    6.3 Correction
7 Problems associated with placement of surface-mounted
    components
    7.1 Placement of components (assembly)
    7.2 Requirements for 'pick-and-place' machines
8 Deviations from flatness in service
9 Prevention summary
10 Corrective action summary

Describes those factors which control the flatness of rigid printed boards and their assemblies. This standard incorporates advice regarding design, base material, unassembled printed boards, and printed board assemblies.

Committee
TC 91
DevelopmentNote
Also numbered as BS EN 61188-1.1 (11/2005) Stability Date: 2017. (09/2017)
DocumentType
Standard
Pages
23
PublisherName
International Electrotechnical Committee
Status
Withdrawn

BS EN 61192-1:2003 Workmanship requirements for soldered electronic assemblies General
BS EN 61188-5-1:2002 Printed boards and assemblies. Design and use. Attachment (land/joint) considerations Attachment (land/joint) considerations. Generic requirements
I.S. EN 61192-1:2003 WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - GENERAL
BS EN 61191-1:2013 Printed board assemblies Generic specification. Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
EN 61188-5-1:2002 Printed boards and printed board assemblies - Design and use - Part 5-1: Attachment (land/joint) considerations - Generic requirements
I.S. EN 61191-1:2013 PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES (IEC 61191-1:2013 (EQV))
IEC 61188-5-1:2002 Printed boards and printed board assemblies - Design and use - Part 5-1: Attachment (land/joint) considerations - Generic requirements
BS EN 62326-4:1997 Printed boards Rigid multilayer printed boards with interlayer connections. Sectional specification
I.S. EN 61188-5-1:2002 PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-1: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - GENERIC REQUIREMENTS
IEC 61191-1:2013 Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
11/30255124 DC : 0 BS EN 61191-1 - PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES
IEC 61192-1:2003 Workmanship requirements for soldered electronic assemblies - Part 1: General
BS EN 62326-4-1:1997 Printed boards. Rigid multilayer printed boards with interlayer connections. Sectional specification Capability detail specification. Performance levels, A, B and C
EN 61191-1:2013 PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES (IEC 61191-1:2013)
EN 61192-1:2003 Workmanship requirements for soldered electronic assemblies - Part 1: General
NF EN 61188-5-1 : 2003 PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-1: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - GENERIC REQUIREMENTS

IEC 61189-2:2006 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures

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