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  • IEC 61189-2:2006

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    Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures

    Available format(s):  Hardcopy, PDF 1 User, PDF 3 Users, PDF 5 Users, PDF 9 Users

    Language(s):  English

    Published date:  30-05-2006

    Publisher:  International Electrotechnical Committee

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    Table of Contents - (Show below) - (Hide below)

    FOREWORD
    INTRODUCTION
    1 Scope
    2 Normative references
    3 Accuracy, precision and resolution
       3.1 Accuracy
       3.2 Precision
       3.3 Resolution
       3.4 Report
       3.5 Student's 't' distribution
       3.6 Suggested uncertainty limits
    4 Catalogue of approved test methods
    5 P: Preparation/conditioning test methods
       5.1 Test 2P01: Dry heat (under consideration)
       5.2 Test 2P02: Solder float stress (under consideration)
    6 V: Visual test methods
    7 D: Dimensional test methods
       7.1 Test 2D01: Thickness of base materials and rigid
             boards
    8 C: Chemical test methods
       8.1 Test 2C01: Resistance to sodium hydroxide of base
             materials
       8.2 Test 2C02: Gel time of epoxy based prepreg materials
       8.3 Test 2C03: Resin content of prepreg materials by
             treated weight
       8.4 Test 2C04: Volatile content of prepreg materials
       8.5 Test 2C05: Blistering during heat shock
       8.6 Test 2C06: Flammability, vertical burning test
             for rigid materials
       8.7 Test 2C07: Flammability; horizontal burning test
             for rigid materials
       8.8 Test 2C08: Flammability, flex material
       8.9 Test 2C09: Melting viscosity of prepreg materials
       8.10 Test 2C10: Resin content of prepreg materials by
             sublimation
       8.11 Test 2C11: UV blocking characteristics of laminates
       8.12 Test 2C12: Total halogen content in base materials
    9 M: Mechanical test methods
       9.1 Test 2M01: Test method for bow and twist
       9.2 Test 2M02: Bow/twist after etching and heating
       9.3 Test 2M03: Cure factor of base materials by
             differential scanning calorimetry (DSC) or
             thermomechanical analysis (TMA)
       9.4 Test 2M04: Twist after heating (under consideration)
       9.5 Test 2M05: Pull-off strength
       9.6 Test 2M06: Peel strength after exposure to solvent
             vapour
       9.7 Test 2M07: Peel strength after immersion in solvent
       9.8 Test 2M08: Flexural strength (under consideration)
       9.9 Test 2M09: Resin flow of prepreg material
       9.10 Test 2M10: Glass transition temperature of base
             materials by differential scanning calorimetry (DSC)
       9.11 Test 2M11: Glass transition temperature of base
             materials by thermomechanical analysis (TMA)
       9.12 Test 2M12: Surface waviness
       9.13 Test 2M13: Peel strength as received
       9.14 Test 2M14: Peel strength after heat shock
       9.15 Test 2M15: Peel strength after dry heat
       9.16 Test 2M16: Peel strength after simulated plating
       9.17 Test 2M17: Peel strength at high temperature
       9.18 Test 2M18: Surface quality (under consideration)
       9.19 Test 2M19: Punching (under consideration)
       9.20 Test 2M20: Flexural strength
       9.21 Test 2M21: Rolling fatigue of flexible base materials
       9.22 Test 2M22: Weight of foil after lamination
       9.23 Test method 2M23: Rectangularity of cut panels
       9.24 Test 2M24: Coefficient of thermal expansion (under
             consideration)
       9.25 Test 2M25: Time to delamination by thermomechanical
             analysis (TMA)
       9.26 Test 2M26: Scaled flow test for prepreg materials
       9.27 Test 2M27: The resin flow properties of coverlay
             films, bonding films and adhesive cast films used
             in the fabrication of flexible printed boards
    10 Electrical test methods
       10.1 Test 2E01: Surface tracking, moisture condition
             (under consideration)
       10.2 Test 10.2 2E02: Dielectric breakdown of base
             materials parallel to laminations
       10.3 Test 2E03: Surface resistance after damp heat,
             steady state
       10.4 Test 2E04: Volume resistivity and surface resistivity
       10.5 Test 2E05: Permittivity and dielectric dissipation
             (under consideration)
       10.6 Test 2E06: Volume and surface resistivity, 3
             electrodes (under consideration)
       10.7 Test 2E07: Surface and volume resistivity, elevated
             temperature (under consideration)
       10.8 Test 2E08: Surface corrosion
       10.9 Test 2E09: Comparative tracking index (CTI)
       10.10 Test 2E10: Permittivity and dissipation factor
             (under consideration)
       10.11 Test 2E11: Electric strength (under consideration)
       10.12 Test 2E12: Resistance of foil (under consideration)
       10.13 Test 2E13: Corrosion at edge (under consideration)
       10.14 Test 2E14: Arc resistance
       10.15 Test 2E15: Dielectric break-down (under consideration)
       10.16 Test 2E16: Contact resistance of printed circuit
             keypad cont (under consideration)
       10.17 Test 2E17: Insulation resistance of printed board
             materials
       10.18 Test 2E18: Fungus resistance of printed board
             materials
    11 N: Environmental test methods
       11.1 Test 2N01: Pressure cooker test (under consideration)
       11.2 Test 2N02: Water absorption
    12 X: Miscellaneous test methods
       12.1 Test 2X02: Dimensional stability of thin laminates
    Annex A (informative) Worked examples
    Annex B (informative) Conversion table
    Annex C (informative) Laboratory pro forma (form)
    Annex D (informative) Laboratory pro forma

    Abstract - (Show below) - (Hide below)

    Provides a catalogue of test methods representing methodologies and procedures that can be applied to test materials used for manufacturing interconnection structures (printed boards) and assemblies.

    General Product Information - (Show below) - (Hide below)

    Committee TC 91
    Development Note Supersedes IEC 60249-1. (03/2008) Stability Date: 2020. (09/2017)
    Document Type Standard
    Publisher International Electrotechnical Committee
    Status Current
    Supersedes

    Standards Referenced By This Book - (Show below) - (Hide below)

    NF EN 61249-4-16 : 2014 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-16: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD (FOR THE MANUFACTURE OF MULTILAYER BOARDS) - MULTIFUNCTIONAL NON-HALOGENATED EPOXIDE WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST) FOR LEAD-FREE ASSEMBLY
    NF EN 61249-2-27 : 2013 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-27: REINFORCED BASE MATERIALS CLAD AND UNCLAD - BISMALEIMIDE/TRIAZINE MODIFIED WITH NON-HALOGENATED EPOXIDE WOVEN GLASS LAMINATE SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD
    09/30179135 DC : 0 BS EN 61249-2-42 - MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-42: REINFORCED BASE MATERIALS, CLAD AND UNCLAD - BROAMINATED EPOXIDE NON-WOVEN/WOVEN E-GLASS REINFORCED LAMINATED SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD FOR LEAD-FREE ASSEMBLY
    10/30235537 DC : 0 BS EN 61249-4-18 - MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-18: SECTIONAL SPECIFICATION SET FOR PREPEG MATERIALS, UNCLAD (FOR THE MANUFACTURE OF MULTILAYER BOARDS) - HIGH PERFORMANCE EPOXIDE WOVEN E-GLASS PREPEG OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST) FOR LEAD-FREE ASSEMBLY
    CEI EN 61249-2-37 : 2010 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-37: REINFORCED BASE MATERIALS, CLAD AND UNCLAD - MODIFIED NON-HALOGENATED EPOXIDE WOVEN E-GLASS LAMINATE SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD FOR LEAD-FREE ASSEMBLY
    EN 60664-3:2017 INSULATION COORDINATION FOR EQUIPMENT WITHIN LOW-VOLTAGE SYSTEMS - PART 3: USE OF COATING, POTTING OR MOULDING FOR PROTECTION AGAINST POLLUTION (IEC 60664-3:2016)
    07/30164977 DC : 0 EN 61249-2-32 - MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-32: REINFORCED BASE MATERIALS CLAD AND UNCLAD FOR HIGH FREQUENCY APPLICATION - HALOGENATED MODIFIED OR UNMODIFIED RESIN SYSTEM, WOVEN E-GLASS LAMINATED SHEETS OF DEFINED RELATIVE PERMITTIVITY (EQUAL OR LESS THEN 3.7 AT 1 GHZ) AND FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD
    07/30174325 DC : 0 BS EN 61249-2-41 - MATERIALS FOR PRINTED CIRCUIT BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-41: REINFORCED BASE MATERIALS, CLAD AND UNCLAD - BROMINATED EXPOIDE CELLULOSE PAPER/WOVEN E-GLASS REINFORCED LAMINATED SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD FOR LEAD-FREE ASSEMBLY
    BS EN 61249-2-22 : 2005 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-22: REINFORCED BASE MATERIALS, CLAD AND UNCLAD - MODIFIED NON-HALOGENATED EPOXIDE WOVEN E-GLASS LAMINATED SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD
    EN IEC 61249-2-45 : 2018 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-45: REINFORCED BASE MATERIALS CLAD AND UNCLAD - NON-HALOGENATED EPOXIDE NON-WOVEN/WOVEN E-GLASS REINFORCED LAMINATE SHEETS OF THERMAL CONDUCTIVITY (1.0W/M K) AND DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD FOR LEAD-FREE ASSEMBLY (IEC 61249-2-45:2018)
    07/30164981 DC : 0 EN 61249-2-33 - MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-33: REINFORCED BASE MATERIALS CLAD AND UNCLAD FOR HIGH FREQUENCY APPLICATION - NON-HALOGENATED MODIFIED OR UNMODIFIED RESIN SYSTEM, WOVEN E-GLASS LAMINATED SHEETS OF DEFINED RELATIVE PERMITTIVITY (EQUAL OR LESS THEN 4.1 AT 1 GHZ) AND FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD
    BS EN 61249-4-16 : 2009 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-16: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD (FOR THE MANUFACTURE OF MULTILAYER BOARDS) - MULTIFUNCTIONAL NON-HALOGENATED EPOXIDE WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST) FOR LEAD-FREE ASSEMBLY
    BS EN 61189-5-4 : 2015 TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-4: GENERAL TEST METHODS FOR MATERIALS AND ASSEMBLIES - SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID WIRE FOR PRINTED BOARD ASSEMBLIES
    CEI EN 61249-2-21 : 2005 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-21: REINFORCED BASE MATERIALS, CLAD AND UNCLAD NON-HALOGENATED EPOXIDE WOVEN E-GLASS REINFORCED LAMINATED SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD
    BS EN 61249-8-8 : 1997 MATERIALS FOR INTERCONNECTION STRUCTURES - SECTIONAL SPECIFICATION SET FOR NON-CONDUCTIVE FILMS AND COATINGS - TEMPORARY POLYMER COATINGS
    BS EN 61249-4-18 : 2013 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-18: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD (FOR THE MANUFACTURE OF MULTILAYER BOARDS) - HIGH PERFORMANCE EPOXIDE WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST) FOR LEAD-FREE ASSEMBLY
    NF EN 61188 1-1 : 1998 PRINTED BOARD AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 1-1: GENERIC REQUIREMENTS - FLATNESS CONSIDERATIONS FOR ELECTRONIC ASSEMBLIES
    NF EN 61249-2-44 : 2016 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-44: REINFORCED BASE MATERIALS CLAD AND UNCLAD - NON-HALOGENATED EPOXIDE NON-WOVEN/WOVEN E-GLASS REINFORCED LAMINATE SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD FOR LEAD-FREE ASSEMBLY
    BS EN 61249-2-35 : 2009 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-35: REINFORCED BASE MATERIALS, CLAD AND UNCLAD - MODIFIED EPOXIDE WOVEN E-GLASS LAMINATE SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD FOR LEAD-FREE ASSEMBLY
    NF EN 61249-4-19 : 2014 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-19: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD (FOR THE MANUFACTURE OF MULTILAYER BOARDS) - HIGH PERFORMANCE, NON-HALOGENATED EPOXIDE WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST) FOR LEAD-FREE ASSEMBLY
    BS EN 61249-4-19 : 2013 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-19: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD (FOR THE MANUFACTURE OF MULTILAYER BOARDS) - HIGH PERFORMANCE NON-HALOGENATED EPOXIDE WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST) FOR LEAD-FREE ASSEMBLY
    BS EN 61249-2-38 : 2009 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-38: REINFORCED BASE MATERIALS, CLAD AND UNCLAD - NON-HALOGENATED EPOXIDE WOVEN E-GLASS LAMINATE SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD FOR LEAD-FREE ASSEMBLY
    BS EN 61249-2-1 : 2005 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-1: REINFORCED BASE MATERIALS, CLAD AND UNCLAD - PHENOLIC CELLULOSE PAPER REINFORCED LAMINATED SHEETS, ECONOMIC GRADE, COPPER CLAD
    02/210157 DC : DRAFT OCT 2002 IEC 61249-2-23 ED.1 - MATERIALS FOR INTERCONNECTION STRUCTURES - PART 2-23: SECTIONAL SPECIFICATION SET FOR REINFORCED BASE MATERIALS, CLAD AND UNCLAD - SECTION 23: NON-HALOGENATED PHENOLIC CELLULOSE PAPER REINFORCED LAMINATE SHEET, ECONOMIC GRADE, COPPER CLAD
    BS IEC 61189-5-4 : 2015 TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-4: GENERAL TEST METHODS FOR MATERIALS AND ASSEMBLIES - SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID WIRE FOR PRINTED BOARD ASSEMBLIES
    NF EN 61249-2-43 : 2016 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-43: REINFORCED BASE MATERIALS CLAD AND UNCLAD - NON-HALOGENATED EPOXIDE CELLULOSE PAPER/WOVEN E-GLASS REINFORCED LAMINATE SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD FOR LEAD-FREE ASSEMBLY
    12/30239867 DC : 0 BS EN 62368-1 - AUDIO/VIDEO, INFORMATION AND COMMUNICATION TECHNOLOGY EQUIPMENT - PART 1: SAFETY REQUIREMENTS
    09/30210904 DC : 0 BS EN 61249-2-27 - MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-27: REINFORCED BASE MATERIALS CLAD AND UNCLAD - BISMALEMIDE/TRIAZINE MODIFIED WITH NON-HALOGENATED EPOXIDE WOVEN GLASS LAMINATED SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD
    BS EN 61249-2-36 : 2009 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-36: REINFORCED BASE MATERIALS, CLAD AND UNCLAD - EPOXIDE WOVEN E-GLASS LAMINATE SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD FOR LEAD-FREE ASSEMBLY
    IEC 60664-3 REDLINE : 3ED 2016 INSULATION COORDINATION FOR EQUIPMENT WITHIN LOW-VOLTAGE SYSTEMS - PART 3: USE OF COATING, POTTING OR MOULDING FOR PROTECTION AGAINST POLLUTION
    CEI EN 61249-4-17 : 2010 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-17: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD (FOR THE MANUFACTURE OF MULTILAYER BOARDS) - NON-HALOGENATED EPOXIDE WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST) FOR LEAD-FREE ASSEMBLY
    02/211156 DC : DRAFT DEC 2002 IEC 61249-4-11 ED.1 - MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-11: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD (FOR THE MANUFACTURE OF MULTILAYER BOARDS) - NON-HALOGENATED EPOXIDE WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST)
    BS EN 61249-2-19 : 2002 MATERIALS FOR INTERCONNECTION STRUCTURES - SECTIONAL SPECIFICATION SET FOR REINFORCED BASE MATERIALS, CLAD AND UNCLAD - EPOXIDE CROSS-PLIED LINEAR FIBREGLASS-REINFORCED LAMINATED SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST) COPPER CLAD
    BS EN 61249-4-15 : 2009 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-15: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD (FOR THE MANUFACTURE OF MULTILAYER BOARDS) - MULTIFUNCTIONAL EPOXIDE WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST) FOR LEAD-FREE ASSEMBLY
    IEC 61249-2-32:2009 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-32: REINFORCED BASE MATERIALS, CLAD AND UNCLAD - HALOGENATED MODIFIED OR UNMODIFIED RESIN SYSTEM, WOVEN E-GLASS LAMINATE SHEETS OF DEFINED RELATIVE PERMITTIVITY (EQUAL TO OR LESS THAN 3,7 AT 1 GHZ) AND FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD
    BS EN 61249-2-6 : 2003 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-6: REINFORCED BASE MATERIALS, CLAD AND UNCLAD - BROMINATED EPOXIDE NON-WOVEN/WOVEN E-GLASS REINFORCED LAMINATED SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD
    CEI EN 61249-4-16 : 2010 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-16: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD (FOR THE MANUFACTURE OF MULTILAYER BOARDS) - MULTIFUNCTIONAL NON-HALOGENATED EPOXIDE WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST) FOR LEAD-FREE ASSEMBLY
    CEI EN 61249-4-1 : 2010 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-1: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD (FOR THE MANUFACTURE OF MULTILAYER BOARDS) - EPOXIDE WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY
    CEI EN 61249-2-38 : 2009 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-38: REINFORCED BASE MATERIALS, CLAD AND UNCLAD - NON-HALOGENATED EPOXIDE WOVEN E-GLASS LAMINATE SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD FOR LEAD-FREE ASSEMBLY
    CEI EN 61249-2-6 : 2005 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-6: REINFORCED BASE MATERIALS, CLAD AND UNCLAD BROMINATED EPOXIDE NON-WOVEN/WOVEN E-GLASS REINFORCED LAMINATED SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD
    BS EN 61249-4-14 : 2009 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-14: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD (FOR THE MANUFACTURE OF MULTILAYER BOARDS) - EPOXIDE WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST) FOR LEAD-FREE ASSEMBLY
    BS EN 61249-2-7 : 2002 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-7: REINFORCED BASE MATERIALS CLAD AND UNCLAD - EPOXIDE WOVEN E-GLASS LAMINATED SHEET OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD
    09/30210900 DC : 0 BS EN 61249-2-40 - MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-40: REINFORCED BASE MATERIALS CLAD AND UNCLAD - HIGH PERFORMANCE, MODIFIED, NON-HALOGENATED EPOXIDE WOVEN E-GLASS LAMINATED SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD FOR LEAD-FREE ASSEMBLY
    14/30304003 DC : 0 BS EN 62899-1 ED.1 - PRINTED ELECTRONICS - MATERIALS - PART 1: SUBSTRATES
    BS EN 61249-4-17 : 2009 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-17: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD (FOR THE MANUFACTURE OF MULTILAYER BOARDS) - NON-HALOGENATED EPOXIDE WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST) FOR LEAD-FREE ASSEMBLY
    BS EN 61249-2-13 : 1999 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - SECTIONAL SPECIFICATION SET FOR REINFORCED BASE MATERIALS, CLAD AND UNCLAD - CYANATE ESTER NON-WOVEN ARAMID LAMINATE OF DEFINED FLAMMABILITY, COPPER-CLAD
    BS EN 62326-20 : 2016 PRINTED BOARDS - PRINTED CIRCUIT BOARDS FOR HIGH-BRIGHTNESS LEDS
    BS EN 61249-4-5 : 2005 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-5: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD - POLYIMIDE, MODIFIED OR UNMODIFIED, WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY
    01/205138 DC : 0 IEC 61249-4-1 ED.1 - MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD (FOR THE MANUFACTURE OF MULTILAYER BOARDS) - SECTION 1: EPOXIDE WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY
    BS EN 61249-2-23 : 2005 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-23: REINFORCED BASE MATERIALS, CLAD AND UNCLAD - NON-HALOGENATED PHENOLIC CELLULOSE PAPER REINFORCED LAMINATED SHEETS, ECONOMIC GRADE, COPPER-CLAD
    NF EN 61347-1 : 2015 LAMP CONTROLGEAR - PART 1: GENERAL AND SAFETY REQUIREMENTS
    BS EN 61249-2-26 : 2005 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-26: REINFORCED BASE MATERIALS, CLAD AND UNCLAD - NON-HALOGENATED EPOXIDE NON-WOVEN/WOVEN E-GLASS REINFORCED LAMINATED SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD
    02/211157 DC : DRAFT DEC 2002 IEC 61249-4-12 ED.1 - MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-12: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD (FOR THE MANUFACTURE OF MULTILAYER BOARDS) - NON-HALOGENATED MULTIFUNCTIONAL EPOXIDE WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST)
    07/30164989 DC : 0 EN 61249-2-36 - MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-36: REINFORCED BASE MATERIALS CLAD AND UNCLAD - EPOXIDE WOVEN E-GLASS LAMINATED SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD FOR LEAD-FREE ASSEMBLY
    I.S. EN 61249-4-11:2005 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-11: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD - NON-HALOGENATED EPOXIDE, WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY
    04/30123452 DC : DRAFT OCT 2004 IEC 61249-2-22 ED 1 - MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-22: REINFORCED BASE MATERIALS CLAD AND UNCLAD - MODIFIED NONHALOGENATED EPOXIDE WOVEN E-GLASS LAMINATED SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD
    I.S. EN 61249-4-16:2009 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-16: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD (FOR THE MANUFACTURE OF MULTILAYER BOARDS) - MULTIFUNCTIONAL NON-HALOGENATED EPOXIDE WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST) FOR LEAD-FREE ASSEMBLY
    CEI EN 61249-2-1 : 2005 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-1: REINFORCED BASE MATERIALS, CLAD AND UNCLAD PHENOLIC CELLULOSE PAPER REINFORCED LAMINATED SHEETS,ECONOMIC GRADE, COPPER CLAD
    CEI EN 61249-4-15 : 2010 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-15: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD (FOR THE MANUFACTURE OF MULTILAYER BOARDS) - MULTIFUNCTIONAL EPOXIDE WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST) FOR LEAD-FREE ASSEMBLY
    DIN EN 61249-3-4:1999-11 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 3-4: SECTIONAL SPECIFICATION SET FOR REINFORCED BASE MATERIALS, CLAD AND UNCLAD (INTENDED FOR FLEXIBLE PRINTED BOARDS); ADHESIVE COATED FLEXIBLE POLYIMIDE FILM
    BS EN 61189-5-2 : 2015 TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-2: GENERAL TEST METHODS FOR MATERIALS AND ASSEMBLIES - SOLDERING FLUX FOR PRINTED BOARD ASSEMBLIES
    BS EN 61249-4-1 : 2008 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-1: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD (FOR THE MANUFACTURE OF MULTILAYER BOARDS) - EPOXIDE WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY
    07/30164961 DC : 0 BS EN 61249-4-15 - MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-15: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD (FOR THE MANUFACTURE OF MULTILAYER BOARDS) - EPOXIDE WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST) FOR LEAD-FREE ASSEMBLY
    BS IEC 61189-5-3 : 2015 TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-3: GENERAL TEST METHODS FOR MATERIALS AND ASSEMBLIES - SOLDERING PASTE FOR PRINTED BOARD ASSEMBLIES
    07/30164973 DC : 0 EN 61249-2-31 - MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-31: REINFORCED BASE MATERIALS CLAD AND UNCLAD FOR HIGH FREQUENCY APPLICATION - HALOGENATED MODIFIED OR UNMODIFIED RESIN SYSTEM, WOVEN E-GLASS LAMINATED SHEETS OF DEFINED RELATIVE PERMITTIVITY (EQUAL OR LESS THEN 4.1 AT 1 GHZ) AND FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD
    07/30164993 DC : 0 EN 61249-2-37 - MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-37: REINFORCED BASE MATERIALS CLAD AND UNCLAD - MODIFIED NON-HALOGENATED EPOXIDE WOVEN E-GLASS LAMINATED SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD FOR LEAD-FREE ASSEMBLY
    03/107475 DC : 0 IEC 61249-6-3 ED.1.0 - MATERIALS FOR INTERCONNECTION STRUCTURES - PART 6-3: SECTIONAL SPECIFICATION FOR REINFORCEMENTS - WOVEN FIBREGLASS FABRICS
    07/30164957 DC : 0 BS EN 61249-4-14 - MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-14: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD (FOR THE MANUFACTURE OF MULTILAYER BOARDS) - EPOXIDE WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST) FOR LEAD-FREE ASSEMBLY
    09/30201049 DC : 0 BS EN 61249-2-41 ED.1 - MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-41: REINFORCED BASED MATERIALS CLAD AND UNCLAD - BROMINATED EPOXIDE CELLULOSE PAPER/WOVEN E-GLASS REINFORCED LAMINATE SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD FOR LEAD-FREE ASSEMBLY
    BS EN 61249-5-4 : 1997 MATERIALS FOR INTERCONNECTION STRUCTURES - SECTIONAL SPECIFICATION SET FOR CONDUCTIVE FOILS AND FILMS WITH OR WITHOUT COATINGS - CONDUCTIVE INKS
    I.S. EN 61249-2-13:1999 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-13: SECTIONAL SPECIFICATION SET FOR REINFORCED BASE MATERIALS, CLAD AND UNCLAD - CYANATE ESTER NON-WOVEN ARAMID LAMINATE OF DEFINED FLAMMABILITY, COPPER-CLAD
    NF EN 61249-2-38 : 2009 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-38: REINFORCED BASE MATERIALS, CLAD AND UNCLAD - NON-HALOGENATED EPOXIDE WOVEN E-GLASS LAMINATED SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD FOR LEAD-FREE ASSEMBLY
    BS IEC 61189-5-2 : 2015 TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-2: GENERAL TEST METHODS FOR MATERIALS AND ASSEMBLIES - SOLDERING FLUX FOR PRINTED BOARD ASSEMBLIES
    07/30164969 DC : 0 EN 61249-4-17 - MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-17: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD (FOR THE MANUFACTURE OF MULTILAYER BOARDS) - NON-HALOGENATED EPOXIDE WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST) FOR LEAD-FREE ASSEMBLY
    IEC 61249-2-46:2018 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-46: REINFORCED BASE MATERIALS CLAD AND UNCLAD - NON-HALOGENATED EPOXIDE NON-WOVEN/WOVEN E-GLASS REINFORCED LAMINATE SHEETS OF THERMAL CONDUCTIVITY 1,5 W/(M*K) AND DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD FOR LEAD-FREE ASSEMBLY
    I.S. EN 61249-2-42:2010 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-42: REINFORCED BASE MATERIALS CLAD AND UNCLAD - BROMINATED EPOXIDE NON-WOVEN/WOVEN E-GLASS REINFORCED LAMINATE SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD FOR LEAD-FREE ASSEMBLY
    BS EN 62496-2-2 : 2011 OPTICAL CIRCUIT BOARDS - PART 2-2: MEASUREMENTS - DIMENSIONS OF OPTICAL CIRCUIT BOARDS
    I.S. EN IEC 61249-2-46:2018 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-46: REINFORCED BASE MATERIALS CLAD AND UNCLAD - NON-HALOGENATED EPOXIDE NON-WOVEN/WOVEN E-GLASS REINFORCED LAMINATE SHEETS OF THERMAL CONDUCTIVITY (1.0W/M K) AND DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD FOR LEAD-FREE ASSEMBLY
    BS EN 62878-1-1 : 2015 DEVICE EMBEDDED SUBSTRATE - PART 1-1: GENERIC SPECIFICATION - TEST METHODS
    BS EN 61189-5-3 : 2015 TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-3: GENERAL TEST METHODS FOR MATERIALS AND ASSEMBLIES - SOLDERING PASTE FOR PRINTED BOARD ASSEMBLIES
    I.S. EN 61249-2-43:2016 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-43: REINFORCED BASE MATERIALS CLAD AND UNCLAD - NON-HALOGENATED EPOXIDE CELLULOSE PAPER/WOVEN E-GLASS REINFORCED LAMINATE SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD FOR LEAD-FREE ASSEMBLY
    NF EN 61249-2-40 : 2013 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-40: REINFORCED BASE MATERIALS CLAD AND UNCLAD - HIGH PERFORMANCE, MODIFIED, NON-HALOGENATED EPOXIDE WOVEN E-GLASS LAMINATED SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD FOR LEAD-FREE ASSEMBLY
    BS EN 61249-2-10 : 2003 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-10: REINFORCED BASE MATERIALS CLAD AND UNCLAD - CYANATE ESTER, BROMINATED EPOXIDE, MODIFIED OR UNMODIFIED, WOVEN E-GLASS REINFORCED LAMINATED SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD
    BS EN 61249-2-18 : 2002 MATERIALS FOR INTERCONNECTION STRUCTURES - SECTIONAL SPECIFICATION SET FOR REINFORCED BASE MATERIALS, CLAD AND UNCLAD - POLYESTER NON-WOVEN FIBREGLASS REINFORCED LAMINATED SHEET OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER CLAD
    CEI EN 61249-2-39 : 2014 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-39: REINFORCED BASE MATERIALS CLAD AND UNCLAD - HIGH PERFORMANCE EPOXIDE AND NON-EPOXIDE, WOVEN E-GLASS LAMINATED SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD FOR LEAD-FREE ASSEMBLY
    CEI EN 61249-2-18 : 2002 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-18: REINFORCED BASE MATERIALS, CLAD AND UNCLAD - POLYESTER NON-WOVEN FIBREGLASS REINFORCED LAMINATED SHEET OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD
    BS EN 61192-1 : 2003 WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - PART 1: GENERAL
    I.S. EN 61249-4-14:2009 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-14: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD (FOR THE MANUFACTURE OF MULTILAYER BOARDS) - EPOXIDE WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST) FOR LEAD-FREE ASSEMBLY
    I.S. EN 61249-2-27:2013 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-27: REINFORCED BASE MATERIALS CLAD AND UNCLAD - BISMALEIMIDE/TRIAZINE MODIFIED WITH NON-HALOGENATED EPOXIDE WOVEN GLASS LAMINATE SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD (IEC 61249-2-27:2012 (EQV))
    BS EN 61249-2-12 : 1999 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - SECTIONAL SPECIFICATION SET FOR REINFORCED BASE MATERIALS, CLAD AND UNCLAD - EPOXIDE NON-WOVEN ARAMID LAMINATE OF DEFINED FLAMMABILITY, COPPER-CLAD
    NF EN 61249-2-30 : 2013 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-30: REINFORCED BASE MATERIALS CLAD AND UNCLAD - NON-HALOGENATED EPOXIDE MODIFIED CYANATE ESTER WOVEN GLASS LAMINATE SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD
    13/30284114 DC : 0 BS EN 61249-2-43 ED.1 - MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-43: REINFORCED BASE MATERIALS CLAD AND UNCLAD - NON-HALOGEN EPOXIDE CELLULOSE PAPER/WOVEN E-GLASS REINFORCED LAMINATE SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD FOR LEAD-FREE ASSEMBLY
    BS EN 50557:2011 (published 2012-01) Requirements for automatic reclosing devices (ARDs) for circuit breakers-RCBOs-RCCBs for household and similar uses
    CEI EN 61347-1 : 2016 LAMP CONTROLGEAR - PART 1: GENERAL AND SAFETY REQUIREMENTS
    07/30164997 DC : 0 EN 61249-2-38 - MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-38: REINFORCED BASE MATERIALS CLAD AND UNCLAD - NON-HALOGENATED EPOXIDE WOVEN E-GLASS LAMINATED SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD FOR LEAD-FREE ASSEMBLY
    BS EN 61249-2-11 : 2003 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-11: REINFORCED BASE MATERIALS, CLAD AND UNCLAD - POLYIMIDE, BROMINATED EPOXIDE MODIFIED OR UNMODIFIED, WOVEN E-GLASS REINFORCED LAMINATED SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD
    10/30235541 DC : 0 BS EN 61249-4-19 - MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-19: SECTIONAL SPECIFICATION SET FOR PREPEG MATERIALS, UNCLAD (FOR THE MANUFACTURE OF MULTILAYER BOARDS) - HIGH PERFORMANCE NON-HALOGENATED EPOXIDE WOVEN OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST) FOR LEAD-FREE ASSEMBLY
    07/30164965 DC : 0 BS EN 61249-4-16 - MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-16: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD (FOR THE MANUFACTURE OF MULTILAYER BOARDS) - MULTIFUNCTIONAL NON-HALOGENATED EPOXIDE WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST) FOR LEAD-FREE ASSEMBLY
    13/30284118 DC : 0 BS EN 61249-2-44 ED.1 - MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-44: REINFORCED BASE MATERIALS CLAD AND UNCLAD - NON-HALOGENED EPOXIDE NON-WOVEN/WOVEN E-GLASS REINFORCED LAMINATE SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD FOR LEAD-FREE ASSEMBLY
    I.S. EN 61249-2-37:2009 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-37: REINFORCED BASE MATERIALS, CLAD AND UNCLAD - MODIFIED NON-HALOGENATED EPOXIDE WOVEN E-GLASS LAMINATE SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD FOR LEAD-FREE ASSEMBLY
    DIN EN 61249-3-3:1999-11 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 3-3: SECTIONAL SPECIFICATION SET FOR REINFORCED BASE MATERIALS, CLAD AND UNCLAD (INTENDED FOR FLEXIBLE PRINTED BOARDS); ADHESIVE COATED FLEXIBLE POLYESTER FILM
    NF EN 61249-2-41 : 2010 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-41: REINFORCED BASE MATERIALS CLAD AND UNCLAD - BROMINATED EPOXIDE CELLULOSE PAPER/WOVEN E-GLASS REINFORCED LAMINATE SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD FOR LEAD-FREE ASSEMBLY
    02/207116 DC : DRAFT JUN 2002 IEC 61249-2-2. ED.1 - MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES - PART 2-2: SECTIONAL SPECIFICATION SET FOR REINFORCED BASE MATERIALS, CLAD AND UNCLAD - PHENOLIC CELLULOSE PAPER REINFORCED LAMINATE, HIGH ELECTRICAL GRADE, COPPER CLAD
    BS EN 61249-2-43 : 2016 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-43: REINFORCED BASE MATERIALS CLAD AND UNCLAD - NON-HALOGENATED EPOXIDE CELLULOSE PAPER/WOVEN E-GLASS REINFORCED LAMINATE SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD FOR LEAD-FREE ASSEMBLY