IEC 61189-3:2007
Current
Current
The latest, up-to-date edition.
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)
Available format(s)
Hardcopy , PDF 1 User , PDF 3 Users , PDF 5 Users , PDF 9 Users
Language(s)
English, English - French
Published date
09-10-2007
Publisher
FOREWORD
INTRODUCTION
1 Scope and object
2 Normative references
3 Accuracy, precision and resolution
4 Catalogue of approved test methods
5 P: Preparation/conditioning test methods
6 V: Visual test methods
7 D: Dimensional test methods
8 C: Chemical test methods
9 M: Mechanical test methods
10 E: Electrical test methods
11 N: Environmental test methods
12 X: Miscellaneous test methods
Annex A (informative) Worked examples
IEC 61189-3:2007 is a catalogue of test methods representing methodologies and procedures that can be applied to test materials used for manufacturing interconnection structures (printed boards) and assemblies. The major technical changes with regard to the previous edition concern the addition of 25 new tests, as follows:
- 6 V: Visual test methods: 3V01, 3V02 and 3V03;
- 7 D: Dimensional test methods: 3D03;
- 8 C: Chemical test methods: 3C02, 3C13 and 3C14;
- 9 M: Mechanical test methods: 3M01, 3M03, 3M04, 3M07 and 3M09;
- 10 E: Electrical test methods: 3E03, 3E04, 3E05, 3E11, 3E12, 3E13, 3E16, 3E17 and 3E18;
- 11 N: Environmental test methods: 3N03, 3N07 and 3N12;
- 12 X: Miscellaneous test methods: 3X01.
| Committee |
TC 91
|
| DevelopmentNote |
To be used in conjunction with IEC 61189-1, IEC 61189-2, IEC 61189-5, IEC 61189-6 and IEC 60068 (all parts). (10/2007) A Bilingual edition has been published. (09/2012) Stability Date: 2020. (09/2017)
|
| DocumentType |
Standard
|
| Pages |
118
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Current
|
| Supersedes |
| Standards | Relationship |
| GOST IEC 61189-3 : 2013 | Identical |
| NF EN 61189-3 : 2013 | Identical |
| NEN EN IEC 61189-3 : 2008 | Identical |
| BS EN 61189-3:2008 | Identical |
| CEI EN 61189-3 : 2008 | Identical |
| I.S. EN 61189-3:2008 | Identical |
| PN EN 61189-3 : 2008 | Identical |
| EN 61189-3:2008 | Identical |
| UNE-EN 61189-3:2008 | Identical |
| DIN EN 61189-3:2008-06 | Identical |
| 11/30253280 DC : 0 | BS EN 62326-20 ED.1 - ELECTRONIC CIRCUIT BOARD FOR HIGH-BRIGHTNESS LEDS |
| BS IEC 61189-5-4 : 2015 | TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-4: GENERAL TEST METHODS FOR MATERIALS AND ASSEMBLIES - SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID WIRE FOR PRINTED BOARD ASSEMBLIES |
| 12/30274796 DC : 0 | BS IEC 61189-5-2 ED.1 - TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-2: TEST METHODS FOR PRINTED BOARD ASSEMBLIES: SOLDERING FLUX |
| 14/30309692 DC : 0 | BS EN 61189-5-1 ED 1.0 - TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-1: TEST METHODS FOR PRINTED BOARD ASSEMBLIES AND MATERIALS USED IN MANUFACTURING ELECTRONIC ASSEMBLIES - GUIDANCE DOCUMENTS AND HANDBOOKS |
| BS EN 61189-11:2013 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies Measurement of melting temperature or melting temperature ranges of solder alloys |
| BS IEC 61189-5-2 : 2015 | TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-2: GENERAL TEST METHODS FOR MATERIALS AND ASSEMBLIES - SOLDERING FLUX FOR PRINTED BOARD ASSEMBLIES |
| BS EN 61192-1:2003 | Workmanship requirements for soldered electronic assemblies General |
| BS EN 61190-1-1:2002 | Attachment materials for electronic assembly Requirements for soldering fluxes for high-quality interconnections in electronics assembly |
| I.S. EN 61192-1:2003 | WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - GENERAL |
| I.S. EN 62326-20:2016 | PRINTED BOARDS - PART 20: PRINTED CIRCUIT BOARDS FOR HIGHBRIGHTNESS LEDS |
| 16/30330036 DC : 0 | BS EN 62788-2 - MEASUREMENT PROCEDURES FOR MATERIALS USED IN PHOTOVOLTAIC MODULES - PART 2: POLYMERIC MATERIALS USED FOR FRONTSHEETS AND BACKSHEETS |
| IEC 62326-1:2002 | Printed boards - Part 1: Generic specification |
| BS EN 61191-1:2013 | Printed board assemblies Generic specification. Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies |
| EN 62326-1:2002 | Printed boards - Part 1: Generic specification |
| EN 61189-11 : 2013 | TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 11: MEASUREMENT OF MELTING TEMPERATURE OR MELTING TEMPERATURE RANGES OF SOLDER ALLOYS |
| EN 61249-8-7:1996 | Materials for interconnection structures - Part 8: Sectional specification set for non-conductive films and coatings - Section 7: Marking legend inks |
| EN 61249-5-4:1996 | Materials for interconnection structures - Part 5: Sectional specification set for conductive foils and films with or without coatings - Section 4: Conductive inks |
| EN 61189-2:2006 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures |
| EN 61189-5-4:2015 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-4: General test methods for materials and assemblies - Solder alloys and fluxed and non-fluxed solid wire for printed board assemblies |
| EN 62137:2004/corrigendum:2005 | ENVIRONMENTAL AND ENDURANCE TESTING - TEST METHODS FOR SURFACE-MOUNT BOARDS OF AREA ARRAY TYPE PACKAGES FBGA, BGA, FLGA, LGA, SON AND QFN |
| EN 62878-1-1:2015 | Device embedded substrate - Part 1-1: Generic specification - Test methods |
| I.S. EN 61191-1:2013 | PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES (IEC 61191-1:2013 (EQV)) |
| EN 61189-5-3:2015 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-3: General test methods for materials and assemblies - Soldering paste for printed board assemblies |
| EN 61193-3:2013 | Quality assessment systems - Part 3: Selection and use of sampling plans for printed board and laminate end-product and in-process auditing |
| BS EN 62326-20:2016 | Printed boards Printed circuit boards for high-brightness LEDs |
| BS EN 61188-1-2:1998 | Printed boards and assemblies. Design and use. Generic requirements Generic requirements. Controlled impedance |
| BS IEC 61189-5-3 : 2015 | TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-3: GENERAL TEST METHODS FOR MATERIALS AND ASSEMBLIES - SOLDERING PASTE FOR PRINTED BOARD ASSEMBLIES |
| BS EN 61189-5:2006 | Test methods for electrical materials, interconnection structures and assemblies Test methods for printed board assemblies |
| BS EN 62326-4:1997 | Printed boards Rigid multilayer printed boards with interlayer connections. Sectional specification |
| BS EN 62878-1-1:2015 | Device embedded substrate Generic specification. Test methods |
| BS EN 61189-5-2:2015 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies General test methods for materials and assemblies. Soldering flux for printed board assemblies |
| 12/30274800 DC : 0 | BS IEC 61189-5-3 ED.1 - TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-3: TEST METHODS FOR PRINTED BOARD ASSEMBLIES: SOLDERING PASTE |
| BS EN 62326-1:2002 | Printed boards Generic specification |
| BS EN 61249-8-7:1997 | Materials for interconnection structures. Sectional specification set for non-conductive films and coatings Marking legend inks |
| NF EN 61189-5-4 : 2015 | TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-4: GENERAL TEST METHODS FOR MATERIALS AND ASSEMBLIES - SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID WIRE FOR PRINTED BOARD ASSEMBLIES |
| NF EN 61249 8-8 : 1998 | MATERIALS FOR INTERCONNECTION STRUCTURES - PART 8: SECTIONAL SPECIFICATION SET FOR NON-CONDUCTIVE FILMS AND COATINGS - SECTION 8: TEMPORARY POLYMER COATINGS |
| CEI EN 62878-1-1 : 2016 | DEVICE EMBEDDED SUBSTRATE - PART 1-1: GENERIC SPECIFICATION - TEST METHODS |
| I.S. EN 61193-3:2013 | QUALITY ASSESSMENT SYSTEMS - PART 3: SELECTION AND USE OF SAMPLING PLANS FOR PRINTED BOARD AND LAMINATE END-PRODUCT AND IN-PROCESS AUDITING (IEC 61193-3:2013 (EQV)) |
| I.S. EN 60664-3:2017 | INSULATION COORDINATION FOR EQUIPMENT WITHIN LOW-VOLTAGE SYSTEMS - PART 3: USE OF COATING, POTTING OR MOULDING FOR PROTECTION AGAINST POLLUTION |
| I.S. EN 61249-5-4:1999 | MATERIALS FOR INTERCONNECTION STRUCTURES - PART 5: SECTIONAL SPECIFICATION SET FOR CONDUCTIVE FOILS AND FILMS WITH OR WITHOUT COATINGS - SECTION 4: CONDUCTIVE INKS |
| I.S. EN 61249-4-1:2008 | MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-1: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD (FOR THE MANUFACTURE OF MULTILAYER BOARDS) - EPOXIDE WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY |
| NF EN 61189-5 : 2008 | TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5: TEST METHODS FOR PRINTED BOARD ASSEMBLIES |
| IEC 62899-201:2016 | Printed electronics - Part 201: Materials - Substrates |
| IEC 60664-3:2016 RLV | Insulation coordination for equipment within low-voltage systems - Part 3: Use of coating, potting or moulding for protection against pollution |
| IEC 61189-5-2:2015 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-2: General test methods for materials and assemblies - Soldering flux for printed board assemblies |
| IEC 61189-5-4:2015 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-4: General test methods for materials and assemblies - Solder alloys and fluxed and non-fluxed solid wire for printed board assemblies |
| IEC 62137:2004 | Environmental and endurance testing - Test methods for surface-mount boards of area array type packages FBGA, BGA, FLGA, LGA, SON and QFN |
| EN 60664-3:2017 | Insulation coordination for equipment within low-voltage systems - Part 3: Use of coating, potting or moulding for protection against pollution |
| BS EN 62137:2004 | Environmental and endurance testing. Test methods for surface-mount boards of area array type packages FBGA, BGA, FLGA, LGA, SON and QFN |
| BS EN 62326-4-1:1997 | Printed boards. Rigid multilayer printed boards with interlayer connections. Sectional specification Capability detail specification. Performance levels, A, B and C |
| BS EN 61249-2-13:1999 | Materials for interconnection structures. Sectional specification set for reinforced base materials, clad and unclad Cyanate ester non-woven aramid laminate of defined flammability, copper-clad |
| BS EN 61192-4:2003 | Workmanship requirements for soldered electronic assemblies Terminal assemblies |
| BS EN 61249-4-1:2008 | Materials for printed boards and other interconnecting structures Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards). Epoxide woven E-glass prepreg of defined flammability |
| 96/205775 DC : 0 | BS CECC 210003 - TECHNOLOGY APPROVAL SCHEDULE FOR PRINTED BOARDS |
| BS EN 61189-5-3:2015 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies General test methods for materials and assemblies. Soldering paste for printed board assemblies |
| 16/30336979 DC : 0 | BS EN 60664-3 - INSULATION COORDINATION FOR EQUIPMENT WITHIN LOW VOLTAGE SYSTEMS - PART 3: USE OF COATING, POTTING OR MOULDING FOR PROTECTION AGAINST POLLUTION |
| BS EN 61193-3:2013 | Quality assessment systems Selection and use of sampling plans for printed board and laminate end-product and in-process auditing |
| 09/30201707 DC : 0 | BS EN 60664-3+A1 ED.2 - INSULATION COORDINATION FOR EQUIPMENT WITHIN LOW-VOLTAGE SYSTEMS - PART 3: USE OF COATING, POTTING OR MOULDING FOR PROTECTION AGAINST POLLUTION |
| I.S. EN 61189-5:2006 | TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5: TEST METHODS FOR PRINTED BOARD ASSEMBLIES |
| CEI EN 62326-1 : 2002 | PRINTED BOARDS - PART 1: GENERIC SPECIFICATION |
| IEC 62326-4-1:1996 | Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections - Sectional specification - Section 1: Capability detail specification - Performance levels A, B and C |
| I.S. EN 61249-8-8:1999 | MATERIALS FOR INTERCONNECTION STRUCTURES - PART 8: SECTIONAL SPECIFICATION SET FOR NON-CONDUCTIVE FILMS AND COATINGS - TEMPORARY POLYMER |
| IEC 61249-8-8:1997 | Materials for interconnection structures - Part 8: Sectional specification set for non-conductive films and coatings - Section 8: Temporary polymer coatings |
| IEC 61189-5:2006 | Test methods for electrical materials, interconnection structures and assemblies - Part 5: Test methods for printed board assemblies |
| PD IEC/TS 62788-2:2017 | Measurement procedures for materials used in photovoltaic modules Polymeric materials. Frontsheets and backsheets |
| IEC 62137-4:2014 | Electronics assembly technology - Part 4: Endurance test methods for solder joint of area array type package surface mount devices |
| UNE-EN 60664-3:2004 | Insulation coordination for equipment within low-voltage systems - Part 3: Use of coating, potting or moulding for protection against pollution |
| 12/30239867 DC : 0 | BS EN 62368-1 - AUDIO/VIDEO, INFORMATION AND COMMUNICATION TECHNOLOGY EQUIPMENT - PART 1: SAFETY REQUIREMENTS |
| IEC 60664-3 REDLINE : 3ED 2016 | INSULATION COORDINATION FOR EQUIPMENT WITHIN LOW-VOLTAGE SYSTEMS - PART 3: USE OF COATING, POTTING OR MOULDING FOR PROTECTION AGAINST POLLUTION |
| 12/30274804 DC : 0 | BS IEC 61189-5-4 ED.1 - TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-4: TEST METHODS FOR PRINTED BOARD ASSEMBLIES: SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID WIRE |
| 14/30304003 DC : 0 | BS EN 62899-1 ED.1 - PRINTED ELECTRONICS - MATERIALS - PART 1: SUBSTRATES |
| BS EN 61249-5-4:1997 | Materials for interconnection structures. Sectional specification set for conductive foils and films with and without coatings Conductive inks |
| NF EN 62326 4-1 : 1998 | PRINTED BOARDS - PART 4: RIGID MULTILAYER PRINTED BOARDS WITH INTERLAYER CONNECTIONS - SECTIONAL SPECIFICATION - SECTION 1: CAPABILITY DETAIL SPECIFICATION PERFORMANCE LEVELS A, B AND C |
| BS EN 61249-8-8:1997 | Materials for interconnection structures. Sectional specification set for non-conductive films and coatings Temporary polymer coatings |
| 12/30258453 DC : 0 | BS EN 62368-1 AMD - AUDIO/VIDEO, INFORMATION AND COMMUNICATION TECHNOLOGY EQUIPMENT - PART 1: SAFETY REQUIREMENTS |
| I.S. EN 61189-5-4:2015 | TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-4: GENERAL TEST METHODS FOR MATERIALS AND ASSEMBLIES - SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID WIRE FOR PRINTED BOARD ASSEMBLIES |
| I.S. EN 61189-2:2006 | TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 2: TEST METHODS FOR MATERIALS FOR INTERCONNECTION STRUCTURES |
| BS IEC 62899-201 : 2016 | PRINTED ELECTRONICS - PART 201: MATERIALS - SUBSTRATES |
| I.S. EN 61249-8-7:1999 | MATERIALS FOR INTERCONNECTION STRUCTURES - PART 8: SECTIONAL SPECIFICATION SET FOR NON-CONDUCTIVE FILMS AND COATINGS - SECTION 7: MARKING LEGEND INKS |
| CEI EN 61249-5-4 : 1997 | MATERIALS FOR INTERCONNECTION STRUCTURES - PART 5: SECTIONAL SPECIFICATION SET FOR CONDUCTIVE FOILS AND FILMS WITH OR WITHOUT COATINGS SECTION 4: CONDUCTIVE INKS |
| I.S. EN 61192-4:2003 | WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - TERMINAL ASSEMBLIES |
| I.S. EN 62137:2005 | ENVIRONMENTAL AND ENDURANCE TESTING - TEST METHODS FOR SURFACE-MOUNT BOARDS OF AREA ARRAY TYPE PACKAGES FBGA, BGA, FLGA, LGA, SON AND QFN |
| I.S. EN 62878-1-1:2015 | DEVICE EMBEDDED SUBSTRATE - PART 1-1: GENERIC SPECIFICATION - TEST METHODS |
| IEC 61191-1:2013 | Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies |
| 15/30327712 DC : 0 | BS EN 61191-1 - PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES |
| 11/30255124 DC : 0 | BS EN 61191-1 - PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES |
| IEC 61188-1-2:1998 | Printed boards and printed board assemblies - Design and use - Part 1-2: Generic requirements - Controlled impedance |
| IEC 61189-5-3:2015 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-3: General test methods for materials and assemblies - Soldering paste for printed board assemblies |
| IEC 61192-1:2003 | Workmanship requirements for soldered electronic assemblies - Part 1: General |
| IEC TS 62788-2:2017 | Measurement procedures for materials used in photovoltaic modules - Part 2: Polymeric materials - Frontsheets and backsheets |
| IEC 61193-3:2013 | Quality assessment systems - Part 3: Selection and use of sampling plans for printed board and laminate end-product and in-process auditing |
| IEC 61189-11:2013 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 11: Measurement of melting temperature or melting temperature ranges of solder alloys |
| IEC 61192-4:2002 | Workmanship requirements for soldered electronic assemblies - Part 4: Terminal assemblies |
| IEC 61189-2:2006 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures |
| IEC 61249-4-1:2008 | Materials for printed boards and other interconnecting structures - Part 4-1: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Epoxide woven E-glass prepreg of defined flammability |
| BS EN 61189-5-4:2015 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies General test methods for materials and assemblies. Solder alloys and fluxed and non-fluxed solid wire for printed board assemblies |
| 12/30271778 DC : 0 | BS EN 62137-4 ED.1 - ELECTRONICS ASSEMBLY TECHNOLOGY - PART 4: ENDURANCE TEST METHODS FOR SOLDER JOINT OF AREA ARRAY TYPE PACKAGE SURFACE MOUNT DEVICES |
| BS EN 62137-4:2014 | Electronics assembly technology Endurance test methods for solder joint of area array type package surface mount devices |
| I.S. EN 62137-4:2014 | ELECTRONICS ASSEMBLY TECHNOLOGY - PART 4: ENDURANCE TEST METHODS FOR SOLDER JOINT OF AREA ARRAY TYPE PACKAGE SURFACE MOUNT DEVICES |
| CEI EN 61249-4-1 : 2010 | MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-1: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD (FOR THE MANUFACTURE OF MULTILAYER BOARDS) - EPOXIDE WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY |
| BS EN 61249-2-12:1999 | Materials for interconnection structures. Sectional specification set for reinforced base materials, clad and unclad Epoxide non-woven aramid laminate of defined flammability, copper-clad |
| I.S. EN 61189-11:2013 | TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 11: MEASUREMENT OF MELTING TEMPERATURE OR MELTING TEMPERATURE RANGES OF SOLDER ALLOYS (IEC 61189-11:2013 (EQV)) |
| CEI EN 61249-8-7 : 1997 | MATERIALS FOR INTERCONNECTION STRUCTURES - PART 8: SECTIONAL SPECIFICATION SET FOR NON-CONDUCTIVE FILMS AND COATINGS - SECTION 7: MARKING LEGEND INKS |
| NF EN 62326-20 : 2016 | PRINTED BOARDS - PART 20: PRINTED CIRCUIT BOARDS FOR HIGH-BRIGHTNESS LEDS |
| NF EN 60664-3 : 2017 | INSULATION COORDINATION FOR EQUIPMENT WITHIN LOW-VOLTAGE SYSTEMS - PART 3: USE OF COATING, POTTING OR MOULDING FOR PROTECTION AGAINST POLLUTION |
| I.S. EN 61189-5-3:2015 | TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-3: GENERAL TEST METHODS FOR MATERIALS AND ASSEMBLIES - SOLDERING PASTE FOR PRINTED BOARD ASSEMBLIES |
| BS EN 60664-3:2017 | Insulation coordination for equipment within low-voltage systems Use of coating, potting or moulding for protection against pollution |
| I.S. EN 61189-5-2:2015 | TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-2: GENERAL TEST METHODS FOR MATERIALS AND ASSEMBLIES - SOLDERING FLUX FOR PRINTED BOARD ASSEMBLIES |
| I.S. EN 62326-1:2002 | PRINTED BOARDS - GENERIC SPECIFICATION |
| IEC 60664-3:2016 | Insulation coordination for equipment within low-voltage systems - Part 3: Use of coating, potting or moulding for protection against pollution |
| I.S. EN 61190-1-1:2002 | ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-1: REQUIREMENTS FOR SOLDERING FLUXES FOR HIGH-QUALITY INTERCONNECTIONS IN ELECTRONICS ASSEMBLY |
| 07/30091745 DC : 0 | BS IEC 62368 - AUDIO/VIDEO, INFORMATION AND COMMUNICATION TECHNOLOGY EQUIPMENT - SAFETY - REQUIREMENTS |
| IEC 62326-20:2016 | Printed boards - Part 20: Printed circuit boards for high-brightness LEDs |
| BS EN 61189-2:2006 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies Test methods for materials for interconnection structures |
| IEC 61190-1-1:2002 | Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly |
| EN 61188-1-2:1998 | Printed boards and printed board assemblies - Design and use - Part 1-2: Generic requirements - Controlled impedance |
| EN 61249-8-8:1997 | Materials for interconnection structures - Part 8: Sectional specification set for non-conductive films and coatings - Section 8: Temporary polymer coatings |
| EN 61191-1:2013 | PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES (IEC 61191-1:2013) |
| EN 61189-5-2:2015 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-2: General test methods for materials and assemblies - Soldering flux for printed board assemblies |
| EN 61249-4-1:2008 | Materials for printed boards and other interconnecting structures - Part 4-1: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Epoxide woven E-glass prepreg of defined flammability |
| EN 62326-20:2016 | Printed boards - Part 20: Printed circuit boards for high-brightness LEDs |
| EN 62137-4:2014/AC:2015 | ELECTRONICS ASSEMBLY TECHNOLOGY - PART 4: ENDURANCE TEST METHODS FOR SOLDER JOINT OF AREA ARRAY TYPE PACKAGE SURFACE MOUNT DEVICES (IEC 62137-4:2014) |
| EN 61192-1:2003 | Workmanship requirements for soldered electronic assemblies - Part 1: General |
| EN 61192-4:2003 | Workmanship requirements for soldered electronic assemblies - Part 4: Terminal assemblies |
| EN 61189-5 : 2006 | TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5: TEST METHODS FOR PRINTED BOARD ASSEMBLIES |
| EN 61190-1-1:2002 | Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly |
| IEC 61188-1-2:1998 | Printed boards and printed board assemblies - Design and use - Part 1-2: Generic requirements - Controlled impedance |
| IEC 60068-1:2013 | Environmental testing - Part 1: General and guidance |
| IEC 60068-2-20:2008 | Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads |
| IEC 61190-1-2:2014 | Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly |
| IEC 60454-1:1992 | Specifications for pressure-sensitive adhesive tapes for electrical purposes - Part 1: General requirements |
| IEC 60454-3-1:1998+AMD1:2001 CSV | Pressure-sensitive adhesive tapes for electrical purposes - Part 3: Specifications for individual materials - Sheet 1: PVC film tapes with pressure-sensitive adhesive |
| IEC 61189-1:1997+AMD1:2001 CSV | Test methods for electrical materials, interconnection structures and assemblies - Part 1: General test methods and methodology |
| IEC 62326-4:1996 | Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections - Sectional specification |
| ISO 9002:1994 | Quality systems — Model for quality assurance in production, installation and servicing |
| IEC 61190-1-1:2002 | Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly |
| ISO 4046:1978 | Paper, board, pulp and related terms — Vocabulary |
| ISO 9453:2014 | Soft solder alloys Chemical compositions and forms |
| IEC 62326-4-1:1996 | Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections - Sectional specification - Section 1: Capability detail specification - Performance levels A, B and C |
| IEC 60695-11-5 : 2.0 | FIRE HAZARD TESTING - PART 11-5: TEST FLAMES - NEEDLE-FLAME TEST METHOD - APPARATUS, CONFIRMATORY TEST ARRANGEMENT AND GUIDANCE |
| IEC 60695-11-5:2016 | Fire hazard testing - Part 11-5: Test flames - Needle-flame test method - Apparatus, confirmatory test arrangement and guidance |
| IEC 60584-1:2013 | Thermocouples - Part 1: EMF specifications and tolerances |
$650.16
Including GST where applicable
AUD
CAD
CHF
CNY
DKK
EUR
GBP
HKD
IDR
INR
JPY
KRW
MXN
NOK
NZD
SEK
SGD
USD
ZAR
Hardcopy - English
PDF 1 User - English
PDF 3 Users - English
PDF 5 Users - English
PDF 9 Users - English
Hardcopy - English - French
PDF 1 User - English - French
PDF 3 Users - English - French
PDF 5 Users - English - French
PDF 9 Users - English - French
01
02
03
04
05
06
07
08
09
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
Please Login or Create an Account so you can add users to your Multi user PDF Later.
Important note : All end users must be registered with an Account prior to user licenses being assigned.
Users cannot be edited or removed once added to your Multi user PDF.
Access your standards online with a subscription
Features
-
Simple online access to standards, technical information and regulations.
-
Critical updates of standards and customisable alerts and notifications.
-
Multi-user online standards collection: secure, flexible and cost effective.