Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-719: Test methods for interconnection structures (printed boards) - Monitoring of single plated-through hole (PTH) resistance change during temperature cycling

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Hardcopy , PDF 1 User , PDF 3 Users , PDF 5 Users , PDF 9 Users

Language(s)

English - French

Published date

05-01-2016

Publisher

International Electrotechnical Committee

FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 Test specimens
5 Test apparatus
6 Procedure
7 Report
8 Additional information
Bibliography

IEC 61189-3-719:2016 specifies a test method to monitor the resistance of single plated-through holes (PTHs) in printed circuit boards (PCBs) to determine the PTH durability under thermo-mechanical stress induced by temperature cycling.

Committee	TC 91
DevelopmentNote	Stability date: 2020. (01/2016)
DocumentType	Standard
Pages	22
PublisherName	International Electrotechnical Committee
Status	Current

Standards	Relationship
NF EN 61189-3-719 : 2016	Identical
NBN EN 61189-3-719 : 2016	Identical
NEN EN IEC 61189-3-719 : 2016	Identical
PN EN 61189-3-719 : 2016	Identical
SN EN 61189-3-719 : 2016	Identical
BS EN 61189-3-719:2016	Identical
CEI EN 61189-3-719 : 2016	Identical
EN 61189-3-719:2016	Identical
DIN EN 61189-3-719:2014-04 (Draft)	Identical
UNE-EN 61189-3-719:2016	Identical

IEC 60068-2-58:2015+AMD1:2017 CSV	Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
IPC 2221B:2012	GENERIC STANDARD ON PRINTED BOARD DESIGN
IEC 60194:2015	Printed board design, manufacture and assembly - Terms and definitions
IEC 60068-2-14:2009	Environmental testing - Part 2-14: Tests - Test N: Change of temperature

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IEC 61189-3-719:2016

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