Printed board assemblies - Part 6: Evaluation criteria for voids in soldered joints of BGA and LGA and measurement method

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Hardcopy , PDF 1 User , PDF 3 Users , PDF 5 Users , PDF 9 Users

Language(s)

English - French

Published date

14-01-2010

Publisher

International Electrotechnical Committee

FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Terms and definitions
4 Voids in solder joints
5 Measurement
6 Void occupancy
7 Evaluation
Annex A (informative) - Experimental results and simulation
                        of voids and decrease of life due to
                        thermal stress
Annex B (informative) - X-ray transmission equipment
Annex C (informative) - Voids in BGA solder ball
Annex D (informative) - Measurement using X-ray transmission
                        imaging
Bibliography

IEC 61191-6:2010 specifies the evaluation criteria for voids on the scale of the thermal cycle life, and the measurement method of voids using X-ray observation. This part of IEC 61191 is applicable to the voids generated in the solder joints of BGA and LGA soldered on a board. This part of IEC 61191 is not applicable to the BGA package itself before it is assembled on a board. This standard is applicable also to devices having joints made by melt and re-solidification, such as flip chip devices and multi-chip modules, in addition to BGA and LGA. This standard is not applicable to joints with under-fill between a device and a board, or to solder joints within a device package. This standard is applicable to macrovoids of the sizes of from 10 µm to several hundred micrometres generated in a soldered joint, but is not applicable to smaller voids (typically, planar microvoids) with a size of smaller than 10 µm in diameter. This standard is intended for evaluation purposes and is applicable to research studies, off-line production process control and reliability assessment of assembly.

Committee	TC 91
DevelopmentNote	Stability Date: 2017. (09/2017)
DocumentType	Standard
Pages	76
PublisherName	International Electrotechnical Committee
Status	Current

Standards	Relationship
NF EN 61191-6 : 2010	Identical
NEN EN IEC 61191-6 : 2010	Identical
I.S. EN 61191-6:2010	Identical
PN EN 61191-6 : 2010	Identical
UNE-EN 61191-6:2010	Identical
BS EN 61191-6:2010	Identical
CEI EN 61191-6 : 2011	Identical
EN 61191-6:2010	Identical
DIN EN 61191-6:2011-01	Identical
JIS C 61191-6:2011	Identical

IEC 60068-1:2013	Environmental testing - Part 1: General and guidance
IEC 61191-1:2013	Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
IEC 60194:2015	Printed board design, manufacture and assembly - Terms and definitions
IPC 7095 : C	DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR BGAS
IEC 61190-1-3:2007+AMD1:2010 CSV	Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications

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IEC 61191-6:2010

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