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IEC 61192-1:2003

Withdrawn
Withdrawn

A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.

Workmanship requirements for soldered electronic assemblies - Part 1: General
Available format(s)

Hardcopy , PDF 1 User , PDF 3 Users , PDF 5 Users , PDF 9 Users

Withdrawn date

31-12-2021

Language(s)

English - French

Published date

20-02-2003

FOREWORD
INTRODUCTION
1 Scope and object
2 Normative references
3 Terms and definitions
4 General requirements
   4.1 Order of precedence
   4.2 Process control
   4.3 Facilities
   4.4 Process identification
5 Pre-process activities
   5.1 Design checks
   5.2 Specification and procurement of components
   5.3 Specification and procurement of printed boards
   5.4 Specification and procurement of process materials
   5.5 Inspection plan, inspection facilities and handling
   5.6 Storage and kitting of components, boards and materials
   5.7 Handling during assembly, packaging and shipping
   5.8 Electrical testing
6 Component preparation
   6.1 Lead and termination solderability
   6.2 Lead forming
   6.3 Lead flattening
   6.4 Lead cropping
   6.5 Lead coplanarity
   6.6 Thermal shock during re-tinning
   6.7 Moisture and gas traps
7 Mounting structure and printed board preparation
   7.1 Surface preparation
   7.2 Temporary masking requirements
   7.3 Gold on printed board surface-mount lands
   7.4 Printed board condition
8 Surface-mount solder paste deposition
   8.1 Description of process
   8.2 Storage and handling of solder paste
   8.3 Screen (off-contact) printing
   8.4 Stencil (in-contact) printing
   8.5 Syringe dispensing
   8.6 Transfer deposition of solder preforms
9 Non-conductive adhesive deposition and curing
   9.1 Stencil printing
   9.2 Syringe dispensing
   9.3 Pin transfer printing
   9.4 Adhesive curing
10 Surface-mounted component placement
   10.1 Leadless discrete components with metallized terminations
   10.2 Leadless circular cylinder components, for example, metal
         electrode leadless faces (MELFs)
   10.3 Leaded discrete small component packages
   10.4 Leaded integrated circuit packages
   10.5 Leaded 'fine-pitch' integrated circuit packages
   10.6 Modified leaded through-hole packages
   10.7 Leadless chip carrier packages
   10.8 Placement equipment
11 Through-hole component insertion
   11.1 General
   11.2 Axial lead components (two leads)
   11.3 Radial lead components (two leads)
   11.4 Radial lead components (three or more leads)
   11.5 Multilead integrated circuit packages
   11.6 Pin grid array (PGA) components
   11.7 Surface-mount packages modified for insertion
   11.8 Large components
   11.9 Insertion methods and equipment
   11.10 Cutting and clinching leads
12 Placement of terminals and press-fit pins
   12.1 Attachment of terminals to printed boards
   12.2 Soldering wires and component leads to terminals
13 Reflow soldering
   13.1 Infrared reflow soldering in pass-through equipment
   13.2 Convection reflow soldering in pass-through equipment
   13.3 Mixed infrared and convection reflow soldering in
         pass-through equipment
   13.4 Vapour phase reflow soldering
   13.5 Laser scan reflow soldering
   13.6 Thermode (hot bar) reflow soldering
   13.7 Hot gas multijet reflow soldering
   13.8 Focused infrared multi-point reflow soldering
14 Immersion soldering
   14.1 General requirements
   14.2 Wave soldering
   14.3 Drag soldering
   14.4 Hot dip soldering
15 Individual point soldering
   15.1 Manual soldering with an iron
   15.2 Hot gas pencil reflow soldering
16 Cleanliness/cleaning
   16.1 Use of 'no clean' fluxes
   16.2 Cleaning materials
   16.3 Cleaning processes
   16.4 Cleanliness assessment
17 Electrical test
   17.1 In-circuit test
   17.2 Functional test
   17.3 Test probes and probe lands
18 Rework and repair
   18.1 General
   18.2 Unmarked components
   18.3 Pre-heating printed boards and sensitive components
   18.4 Re-use of removed components
   18.5 Selection of rework tools and equipment
   18.6 Surface-mounted component realignment
   18.7 Adding solder to existing joints
   18.8 Removing excess solder
   18.9 Component removal
   18.10 Component replacement
   18.11 Repair of assemblies returned from the field
19 Conformal coatings, including solder resist
   19.1 General
   19.2 Conformal protective coating
   19.3 Solder mask coating
20 Packaging and shipping
   20.1 Materials
   20.2 Mechanical protection
   20.3 Marking/labelling
   20.4 Handling
21 Training
   21.1 Training of designers, engineers and senior line management
   21.2 Training production line personnel
Figures
Tables

Specifies general requirements for workmanship in soldered electronic assemblies on printed boards and on similar laminates attached to the surface(s) of organic substrates. Defines requirements and guidelines for good workmanship and practice in the preparation, soldering, inspection and testing of electronic and electrical assemblies. Enables achievement of high yields and high product quality through process control in production.

DevelopmentNote
To be used in conjunction with IEC 61192-2, IEC 61192-3 and IEC 61192-4. (02/2003) Stability Date: 2017. (09/2017)
DocumentType
Standard
Pages
147
PublisherName
International Electrotechnical Committee
Status
Withdrawn

BS EN 61188-5-1:2002 Printed boards and assemblies. Design and use. Attachment (land/joint) considerations Attachment (land/joint) considerations. Generic requirements
I.S. EN 61192-3:2003 WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - PART 3: THROUGH-HOLE MOUNT ASSEMBLIES
I.S. EN 61193-1:2002 QUALITY ASSESSMENT SYSTEMS - PART 1: REGISTRATION AND ANALYSIS OF DEFECTS ON PRINTED BOARD ASSEMBLIES
IEC 61193-1:2001 Quality assessment systems - Part 1: Registration and analysis of defects on printed board assemblies
EN 61188-5-1:2002 Printed boards and printed board assemblies - Design and use - Part 5-1: Attachment (land/joint) considerations - Generic requirements
EN 61192-3:2003 Workmanship requirements for soldered electronic assemblies - Part 3: Through-hole mount assemblies
EN 62137-1-3:2009 Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-3: Cyclic drop test
12/30254697 DC : 0 BS ISO 16525-9 - ADHESIVES - TEST METHODS FOR ISOTROPICALLY ELECTRICALLY CONDUCTING ADHESIVES - PART 9: DETERMINATION OF HIGH-SPEED SIGNAL-TRANSMISSION CHARACTERISTICS
BS ISO 16525-9:2014 Adhesives. Test methods for isotropic electrically conductive adhesives Determination of high-speed signal-transmission characteristics
IEC 61188-5-1:2002 Printed boards and printed board assemblies - Design and use - Part 5-1: Attachment (land/joint) considerations - Generic requirements
IEC 62137-1-3:2008 Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-3: Cyclic drop test
KTA 3505 : 2015(R2017) TYPE TESTING OF MEASURING SENSORS AND TRANSDUCERS OF THE INSTRUMENTATION AND CONTROL SYSTEM IMPORTANT TO SAFETY
BS EN 61192-4:2003 Workmanship requirements for soldered electronic assemblies Terminal assemblies
97/206324 DC : DRAFT MAY 1997
CEI EN 62137-1-3 : 2009 SURFACE MOUNTING TECHNOLOGY - ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SURFACE MOUNT SOLDER JOINT - PART 1-3: CYCLIC DROP TEST
UTEC 90 720-1 : 2000 ELECTRONIC ASSEMBLY TECHNOLOGY - MANUFACTURING LINE CERTIFICATION FOR ELECTRONIC BOARDS (QML) - PART 1: GUIDE FOR DESIGN AND MANUFACTURING OF ELECTRONIC ASSEMBLIES
BS EN 61192-3:2003 Workmanship requirements for soldered electronic assemblies Through-hole mount assemblies
BS 6221-25:2000 Printed wiring boards Guide to the rework and repair of soldered surface mounted printed board assemblies
NF EN 62137-1-3 : 2009 SURFACE MOUNTING TECHNOLOGY - ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SURFACE MOUNT SOLDER JOINT - PART 1-3: CYCLIC DROP TEST
I.S. EN 61192-2:2003 WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - SURFACE-MOUNT ASSEMBLIES
I.S. EN 61192-4:2003 WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - TERMINAL ASSEMBLIES
I.S. EN 62137-1-3:2009 SURFACE MOUNTING TECHNOLOGY - ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SURFACE MOUNT SOLDER JOINT - PART 1-3: CYCLIC DROP TEST
I.S. EN 61188-5-1:2002 PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-1: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - GENERIC REQUIREMENTS
ISO 16525-9:2014 Adhesives Test methods for isotropic electrically conductive adhesives Part 9: Determination of high-speed signal-transmission characteristics
IEC 61192-5:2007 Workmanship requirements for soldered electronic assemblies - Part 5: Rework, modification and repair of soldered electronic assemblies
IEC 61192-4:2002 Workmanship requirements for soldered electronic assemblies - Part 4: Terminal assemblies
IEC 61192-2:2003 Workmanship requirements for soldered electronic assemblies - Part 2: Surface-mount assemblies
BS EN 62137-1-3:2009 Surface mounting technology. Environmental and endurance test methods for surface mount solder joint Cyclic drop test
97/230541 DC : DRAFT AUG 1997
IEC 61192-3:2002 Workmanship requirements for soldered electronic assemblies - Part 3: Through-hole mount assemblies
BS EN 61193-1:2002 Quality assessment systems Registration and analysis of defects on printed board assemblies
BS EN 61192-5:2007 Workmanship requirements for soldered electric assemblies Rework, modification and repair of soldered electronic assemblies
BS EN 61192-2:2003 Workmanship requirements for soldered electronic assemblies Surface-mount assemblies
I.S. EN 61192-5:2007 WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - PART 5: REWORK, MODIFICATION AND REPAIR OF SOLDERED ELECTRONIC ASSEMBLIES
EN 61193-1:2002 Quality assessment systems - Part 1: Registration and analysis of defects on printed board assemblies
EN 61192-5 : 2007 WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - PART 5: REWORK, MODIFICATION AND REPAIR OF SOLDERED ELECTRONIC ASSEMBLIES
EN 61192-2:2003 Workmanship requirements for soldered electronic assemblies - Part 2: Surface-mount assemblies
EN 61192-4:2003 Workmanship requirements for soldered electronic assemblies - Part 4: Terminal assemblies
NF EN 61188-5-1 : 2003 PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-1: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - GENERIC REQUIREMENTS

IEC 61188-5-2:2003 Printed boards and printed board assemblies - Design and use - Part 5-2: Attachment (land/joint) considerations - Discrete components
IEC 60068-2-58:2015+AMD1:2017 CSV Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
IEC 61190-1-2:2014 Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
IEC TS 61340-5-2:1999 Electrostatics - Part 5-2: Protection of electronic devices from electrostatic phenomena - User guide
IEC 61192-3:2002 Workmanship requirements for soldered electronic assemblies - Part 3: Through-hole mount assemblies
IEC 61188-1-1:1997 Printed boards and printed board assemblies - Design and use - Part 1-1: Generic requirements - Flatness considerations for electronic assemblies
IEC 61192-4:2002 Workmanship requirements for soldered electronic assemblies - Part 4: Terminal assemblies
IEC 60326-9:1991 Printed boards - Part 9: Specification for flexible multilayer printed boards with through connections
ISO 9002:1994 Quality systems — Model for quality assurance in production, installation and servicing
IEC 61189-5:2006 Test methods for electrical materials, interconnection structures and assemblies - Part 5: Test methods for printed board assemblies
IEC 61760-2:2007 Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide
IEC 61190-1-1:2002 Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly
IEC 61189-3:2007 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)
IEC 61191-1:2013 Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
IEC 61188-5-1:2002 Printed boards and printed board assemblies - Design and use - Part 5-1: Attachment (land/joint) considerations - Generic requirements
IEC 60194:2015 Printed board design, manufacture and assembly - Terms and definitions
IEC 60326-11:1991 Printed boards - Part 11: Specification for flex-rigid multilayer printed boards with through connections
ISO 9001:2015 Quality management systems — Requirements
IEC 61191-2:2017 Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
ISO 9453:2014 Soft solder alloys Chemical compositions and forms
IEC 61191-4:2017 Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies
IEC 61192-2:2003 Workmanship requirements for soldered electronic assemblies - Part 2: Surface-mount assemblies
IEC 61189-2:2006 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures
IEC 60326-10:1991 Printed boards - Part 10: Specification for flex-rigid double-sided printed boards with through connections
IEC 61190-1-3:2007+AMD1:2010 CSV Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications
IEC 61191-3:2017 Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies

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