Materials for printed boards and other interconnecting structures - Part 2-12: Sectional specification set for reinforced base materials, clad and unclad - Epoxide non-woven aramid laminate of defined flammability, copper-clad

Available format(s)

Hardcopy , PDF 1 User , PDF 3 Users , PDF 5 Users , PDF 9 Users

Language(s)

English, English - French, Spanish, Castilian

Published date

29-01-1999

Publisher

International Electrotechnical Committee

FOREWORD
1 Scope
2 Normative references
3 Materials and construction
4 Internal marking
5 Electrical properties
6 Non-electrical properties of the copper-clad laminate
7 Non-electrical properties of the base material after
complete removal of the copper foil
8 Packaging and marking
9 Acceptance testing
Annex A (informative) Conversion table for test method
numbers

Gives requirements for properties of epoxide non-woven aramid copper clad laminate of defined flammability, in thicknesses of 0,05 mm up to 6,4 mm.

Committee	TC 91
DevelopmentNote	Also numbered as BS EN 61249-2.12 (08/2004) Stability Date: 2018. (09/2017)
DocumentType	Standard
Pages	16
PublisherName	International Electrotechnical Committee
Status	Current

Standards	Relationship
NF EN 61249-2-12 : 2002	Identical
NFC 93 074 : 1996 PR	Identical
NEN EN IEC 61249-2-12 : 1999	Identical
I.S. EN 61249-2-12:1999	Identical
PN EN 61249-2-12 : 2002	Identical
SN EN 61249-2-12 : 1999	Identical
EN 61249-2-12:1999	Identical
DIN EN 61249-2-12:1999-11	Identical
UNE-EN 61249-2-12:2001	Identical

IEC 62326-1:2002	Printed boards - Part 1: Generic specification
EN 62326-1:2002	Printed boards - Part 1: Generic specification
BS EN 62326-1:2002	Printed boards Generic specification
CEI EN 62326-1 : 2002	PRINTED BOARDS - PART 1: GENERIC SPECIFICATION
I.S. EN 62326-1:2002	PRINTED BOARDS - GENERIC SPECIFICATION

IEC 61249-5-1:1995	Materials for interconnection structures - Part 5: Sectional specification set for conductive foils and films with and without coatings - Section 1: Copper foils (for the manufacture of copper-clad base materials)
IEC 61189-2:2006	Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures

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IEC 61249-2-12:1999

Current

Table of Contents

Abstract

General Product Information

International Equivalents

Standards Referenced By This Book

Standards Referencing This Book

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