Materials for printed boards and other interconnecting structures - Part 2-22: Reinforced base materials clad and unclad - Modified non-halogenated epoxide woven E-glass laminated sheets of defined flammability (vertical burning test), copper-clad

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Hardcopy , PDF 1 User , PDF 3 Users , PDF 5 Users , PDF 9 Users

Language(s)

English - French

Published date

11-01-2005

Publisher

International Electrotechnical Committee

FOREWORD
1 Scope
2 Normative references
3 Materials and construction
   3.1 Resin system
   3.2 Metal foil
   3.3 Reinforcement
4 Internal marking
5 Electrical properties
6 Non-electrical properties of the copper-clad laminate
   6.1 Appearance of the copper-clad sheet
   6.2 Appearance of the unclad face
   6.3 Laminate thickness
   6.4 Bow and twist
   6.5 Properties related to the copper foil bond.
   6.6 Punching and machining
   6.7 Dimensional stability
   6.8 Sheet sizes
   6.9 Cut panels
7 Non-electrical properties of the base material after complete
   removal of the copper foil
   7.1 Appearance of the dielectric base material
   7.2 Flexural strength
   7.3 Flammability
   7.4 Water absorption
   7.5 Measling
   7.6 Glass transition temperature and cure factor
8 Quality assurance
   8.1 Quality system
   8.2 Responsibility for inspection
   8.3 Qualification inspection
   8.4 Quality conformance inspection
   8.5 Certificate of conformance
   8.6 Safety data sheet
9 Packaging and marking
10 Ordering information
Annex A (informative) Engineering information
Annex B (informative) Common laminate constructions
Annex C (informative) Guideline for qualification and conformance
                      inspection
Bibliography

This part of IEC 61249 gives requirements for properties of modified non-halogenated epoxide woven E-glass laminated sheet 0,05 mm up to 3,2 mm, of defined flammability (vertical burning test), copper-clad. The flammability rating is achieved through the use of phosphorus compounds and/or aluminium hydroxide fire retardants contained as part of the polymeric structure. The glass transition temperature is defined to be between 150 °C to 190 °C.

Committee	TC 91
DevelopmentNote	Stability Date: 2020. (09/2017)
DocumentType	Standard
Pages	49
PublisherName	International Electrotechnical Committee
Status	Current

Standards	Relationship
NF EN 61249-2-22 : 2005	Identical
NEN EN IEC 61249-2-22 : 2005	Identical
I.S. EN 61249-2-22:2005	Identical
PN EN 61249-2-22 : 2005	Identical
UNE-EN 61249-2-22:2005	Identical
BS EN 61249-2-22:2005	Identical
CEI EN 61249-2-22 : 2005	Identical
EN 61249-2-22:2005	Identical
DIN EN 61249-2-22:2005-08	Identical

IEC 60571:2012	Railway applications - Electronic equipment used on rolling stock
IEC PAS 63015:2016	Definition of "Low-Halogen" for electronic products
BS EN 50155:2017	Railway applications. Rolling stock. Electronic equipment
BS EN 60115-1 : 2011	FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION
CEI EN 60068-2-58 : 2016	ENVIRONMENTAL TESTING - PART 2-58: TESTS - TEST TD: TEST METHODS FOR SOLDERABILITY, RESISTANCE TO DISSOLUTION OF METALLIZATION AND TO SOLDERING HEAT OF SURFACE MOUNTING DEVICES (SMD)
I.S. EN 50155:2017-11	RAILWAY APPLICATIONS - ROLLING STOCK - ELECTRONIC EQUIPMENT
BS EN 60068-2-58 : 2015	ENVIRONMENTAL TESTING - PART 2-58: TESTS - TEST TD: TEST METHODS FOR SOLDERABILITY, RESISTANCE TO DISSOLUTION OF METALLIZATION AND TO SOLDERING HEAT OF SURFACE MOUNTING DEVICES (SMD)
IEC 60115-1:2008	Fixed resistors for use in electronic equipment - Part 1: Generic specification
I.S. EN 60115-1:2011	FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION (IEC 60115-1:2008, MODIFIED)
EN 50155:2017	Railway applications - Rolling stock - Electronic equipment
11/30247723 DC : 0	BS IEC 60571 - RAILWAY APPLICATIONS - ELECTRONIC EQUIPMENT USED ON ROLLING STOCK
EN 60115-1:2011/A11:2015	FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION
PD IEC/PAS 63015:2016	Definition of “Low-Halogen?? for electronic products
IEC 60068-2-58:2015+AMD1:2017 CSV	Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
I.S. EN 60068-2-58:2015	ENVIRONMENTAL TESTING - PART 2-58: TESTS - TEST TD: TEST METHODS FOR SOLDERABILITY, RESISTANCE TO DISSOLUTION OF METALLIZATION AND TO SOLDERING HEAT OF SURFACE MOUNTING DEVICES (SMD)
EN 60068-2-58:2015/A1:2018	ENVIRONMENTAL TESTING - PART 2-58: TESTS - TEST TD: TEST METHODS FOR SOLDERABILITY, RESISTANCE TO DISSOLUTION OF METALLIZATION AND TO SOLDERING HEAT OF SURFACE MOUNTING DEVICES (SMD) (IEC 60068-2-58:2015/A1:2017)

ISO 11014-1:1994	Safety data sheet for chemical products Part 1: Content and order of sections
IEC 61249-5-1:1995	Materials for interconnection structures - Part 5: Sectional specification set for conductive foils and films with and without coatings - Section 1: Copper foils (for the manufacture of copper-clad base materials)
ISO 14001:2015	Environmental management systems — Requirements with guidance for use
IEC 60194:2015	Printed board design, manufacture and assembly - Terms and definitions
ISO 9000:2015	Quality management systems — Fundamentals and vocabulary
IEC 61189-2:2006	Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures

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IEC 61249-2-22:2005

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