Semiconductor devices - Micro-electromechanical devices - Part 10: Micro-pillar compression test for MEMS materials

Amended by

IEC 62047-10:2011/COR1:2012

Available format(s)

Hardcopy , PDF 1 User , PDF 3 Users , PDF 5 Users , PDF 9 Users

Published date

26-07-2011

Publisher

International Electrotechnical Committee

FOREWORD
1 Scope
2 Normative references
3 Symbols and designations
4 Test piece
5 Testing method and test apparatus
6 Test report
Annex A (informative) - Error estimation using finite
element method
Bibliography

IEC 62047-10:2011 specifies micro-pillar compression test method to measure compressive properties of MEMS materials with high accuracy, repeatability, and moderate effort of specimen fabrication. The uniaxial compressive stress-strain relationship of a specimen is measured, and the compressive modulus of elasticity and yield strength can be obtained. This standard is applicable to metallic, ceramic, and polymeric materials. The contents of the corrigendum of February 2012 have been included in this copy.

DevelopmentNote	Stability Date: 2018. (09/2017)
DocumentType	Standard
Pages	22
PublisherName	International Electrotechnical Committee
Status	Current

Standards	Relationship
NF EN 62047-10 : 2012	Identical
NBN EN 62047-10 : 2011	Identical
NEN IEC 62047-10 : 2011	Identical
NEN EN IEC 62047-10 : 2011	Identical
I.S. EN 62047-10:2011	Identical
PN EN 62047-10 : 2012	Identical
UNE-EN 62047-10:2011	Identical
CEI EN 62047-10 : 2012	Identical
EN 62047-10 : 2011	Identical
DIN EN 62047-10:2012-03	Identical

ASTM E 9 : 2009	Standard Test Methods of Compression Testing of Metallic Materials at Room Temperature
IEC 62047-8:2011	Semiconductor devices - Micro-electromechanical devices - Part 8: Strip bending test method for tensile property measurement of thin films

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IEC 62047-10:2011

Semiconductor devices - Micro-electromechanical devices - Part 10: Micro-pillar compression test for MEMS materials

Table of Contents

Abstract

General Product Information

International Equivalents

Standards Referencing This Book

Category

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