IEC 62047-2:2006
Current
Current
The latest, up-to-date edition.
Semiconductor devices - Micro-electromechanical devices - Part 2: Tensile testing method of thin film materials
Available format(s)
Hardcopy , PDF 1 User , PDF 3 Users , PDF 5 Users , PDF 9 Users
Language(s)
English - French
Published date
15-08-2006
Publisher
FOREWORD
1 Scope
2 Normative references
3 Symbols and designations
4 Testing method and test apparatus
4.1 Method of gripping
4.2 Method of loading
4.3 Speed of testing
4.4 Force measurement
4.5 Elongation measurement
4.6 Stress-strain curve
4.7 Environment control
5 Test piece
5.1 General
5.2 Plane shape of test piece
5.3 Test piece thickness
5.4 Gauge mark
6 Test report
Annex A (informative) Test piece grip methods
Annex B (normative) Testing conditions
Annex C (informative) Test piece
Specifies the method for tensile testing of thin film materials with length and width under 1 mm and thickness under 10 m, which are main structural materials for micro-electromechanical systems (MEMS), micromachines and similar devices. The main structural materials for MEMS, micromachines and similar devices have special features such as typical dimensions in the order of a few microns, a material fabrication by deposition, and a test piece fabrication by non-mechanical machining using etching and photolithography. This International Standard specifies the testing method, which enables a guarantee of accuracy corresponding to the special features.
| DevelopmentNote |
Stability Date: 2018. (09/2017)
|
| DocumentType |
Standard
|
| Pages |
25
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Current
|
| Standards | Relationship |
| JIS C 5630-2:2009 | Identical |
| CEI EN 62047-2 : 2007 | Identical |
| EN 62047-2:2006 | Identical |
| DIN EN 62047-2:2007-02 | Identical |
| NF EN 62047-2 : 2006 | Identical |
| NEN EN IEC 62047-2 : 2006 | Identical |
| I.S. EN 62047-2:2006 | Identical |
| PN EN 62047-2 : 2006 | Identical |
| UNE-EN 62047-2:2006 | Identical |
| BS EN 62047-2:2006 | Identical |
| CEI EN 62047-9 : 2012 | SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 9: WAFER TO WAFER BONDING STRENGTH MEASUREMENT FOR MEMS |
| BS EN 62047-22:2014 | Semiconductor devices. Micro-electromechanical devices Electromechanical tensile test method for conductive thin films on flexible substrates |
| NF EN 62047-13 : 2012 | SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 13: BEND- AND SHEAR-TYPE TEST METHODS OF MEASURING ADHESIVE STRENGTH FOR MEMS STRUCTURES |
| I.S. EN 62047-13:2012 | SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 13: BEND- AND SHEAR-TYPE TEST METHODS OF MEASURING ADHESIVE STRENGTH FOR MEMS STRUCTURES (IEC 62047-13:2012 (EQV)) |
| 08/30172398 DC : DRAFT FEB 2008 | BS EN 62047-8 - SEMICONDUCTOR DEVICES - MICRO - ELECTROMECHANICAL DEVICES - PART 8: STRIP BENDING TEST METHOD FOR TENSILE PROPERTY MEASUREMENT OF THIN FILMS |
| 17/30352696 DC : DRAFT SEP 2017 | BS IEC 62047-31 ED1.0 - SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 31: FOUR-POINT BENDING TEST METHOD FOR INTERFACIAL ADHESION ENERGY OF LAYERED MEMS MATERIALS |
| 10/30211442 DC : 0 | BS EN 62047-10 - SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 10: MICROPILLAR COMPRESSION TEST FOR MEMS MATERIALS |
| I.S. EN 62047-3:2006 | SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 3: THIN FILM STANDARD TEST PIECE FOR TENSILE TESTING |
| EN 62047-13:2012 | Semiconductor devices - Micro-electromechanical devices - Part 13: Bend- and shear- type test methods of measuring adhesive strength for MEMS structures |
| EN 62047-8:2011 | Semiconductor devices - Micro-electromechanical devices - Part 8: Strip bending test method for tensile property measurement of thin films |
| EN 62047-12 : 2011 | SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 12: BENDING FATIGUE TESTING METHOD OF THIN FILM MATERIALS USING RESONANT VIBRATION OF MEMS STRUCTURES (IEC 62047-12:2011) |
| 10/30211454 DC : 0 | BS EN 62047-13 - SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 13: BEND- AND SHEAR- TEST METHODS OF MEASURING ADHESIVE STRENGTH FOR MEMS STRUCTURES |
| 11/30230316 DC : 0 | BS EN 62047-18 - SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 18: BENDING TEST METHODS OF THIN FILM MATERIALS |
| NF EN 62047-17 : 2015 | SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 17: BULGE TEST METHOD FOR MEASURING MECHANICAL PROPERTIES OF THIN FILMS |
| BS EN 62047-17:2015 | Semiconductor devices. Micro-electromechanical devices Bulge test method for measuring mechanical properties of thin films |
| 05/30104054 DC : DRAFT APR 2005 | IEC 62047-3 - SEMICONDUCTOR DEVICES - PART 3: MICRO ELECTROMECHANICAL DEVICES - THIN FILM STANDARD TEST PIECE |
| BS EN 62047-9:2011 | Semiconductor devices. Micro-electromechanical devices Wafer to wafer bonding strength measurement for MEMS |
| CEI EN 62047-13 : 2013 | SEMICONDUCTOR DEVICES - MICROELECTROMECHANICAL DEVICES - PART 13: BEND- AND SHEAR- TYPE TEST METHODS OF MEASURING ADHESIVE STRENGTH FOR MEMS STRUCTURES |
| CEI EN 62047-3 : 2007 | SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 3: THIN FILM STANDARD TEST PIECE FOR TENSILE TESTING |
| I.S. EN 62047-22:2014 | SEMICONDUCTOR DEVICES - MICROELECTROMECHANICAL DEVICES - PART 22: ELECTROMECHANICAL TENSILE TEST METHOD FOR CONDUCTIVE THIN FILMS ON FLEXIBLE SUBSTRATES |
| CEI EN 62047-12 : 2012 | SEMICONDUCTOR DEVICES - MICROELECTROMECHANICAL DEVICES - PART 12: BENDING FATIGUE TESTING METHOD OF THIN FILM MATERIALS USING RESONANT VIBRATION OF MEMS STRUCTURES |
| BS EN 62047-6:2010 | Semiconductor devices. Micro-electromechanical devices Axial fatigue testing methods of thin film materials |
| BS EN 62047-13:2012 | Semiconductor devices. Micro-electromechanical devices Bend-and shear-type test methods of measuring adhesive strength for MEMS structures |
| NF EN 62047-6 : 2010 | SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 6: AXIAL FATIGUE TESTING METHODS OF THIN FILM MATERIALS |
| IEC 62047-6:2009 | Semiconductor devices - Micro-electromechanical devices - Part 6: Axial fatigue testing methods of thin film materials |
| IEC 62047-29:2017 | Semiconductor devices - Micro-electromechanical devices - Part 29: Electromechanical relaxation test method for freestanding conductive thin-films under room temperature |
| BS EN 62047-12:2011 | Semiconductor devices. Micro-electromechanical devices Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures |
| 07/30163302 DC : 0 | BS EN 62047-6 - SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 6: AXIAL FATIGUE TESTING METHODS OF THIN FILM MATERIALS |
| I.S. EN 62047-17:2015 | SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 17: BULGE TEST METHOD FOR MEASURING MECHANICAL PROPERTIES OF THIN FILMS |
| BS EN 62047-8:2011 | Semiconductor devices. Micro-electromechanical devices Strip bending test method for tensile property measurement of thin films |
| BS EN 62047-3:2006 | Semiconductor devices. Micro-electromechanical devices Thin film standard test piece for tensile testing |
| I.S. EN 62047-6:2010 | SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 6: AXIAL FATIGUE TESTING METHODS OF THIN FILM MATERIALS |
| CEI EN 62047-6 : 2011 | SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 6: AXIAL FATIGUE TESTING METHODS OF THIN FILM MATERIALS |
| CEI EN 62047-17 : 2016 | SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 17: BULGE TEST METHOD FOR MEASURING MECHANICAL PROPERTIES OF THIN FILMS |
| I.S. EN 62047-9:2011 | SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 9: WAFER TO WAFER BONDING STRENGTH MEASUREMENT FOR MEMS |
| IEC 62047-12:2011 | Semiconductor devices - Micro-electromechanical devices - Part 12: Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures |
| IEC 62047-8:2011 | Semiconductor devices - Micro-electromechanical devices - Part 8: Strip bending test method for tensile property measurement of thin films |
| IEC 62047-17:2015 | Semiconductor devices - Micro-electromechanical devices - Part 17: Bulge test method for measuring mechanical properties of thin films |
| IEC 62047-3:2006 | Semiconductor devices - Micro-electromechanical devices - Part 3: Thin film standard test piece for tensile testing |
| EN 62047-17:2015 | Semiconductor devices - Micro-electromechanical devices - Part 17: Bulge test method for measuring mechanical properties of thin films |
| EN 62047-22:2014 | Semiconductor devices - Micro-electromechanical devices - Part 22: Electromechanical tensile test method for conductive thin films on flexible substrates |
| 10/30205425 DC : 0 | BS IEC 62047-12 - SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 12: A METHOD FOR FATIGUE TESTING THIN FILM MATERIALS USING THE RESONANT VIBRATION OF A MEMS STRUCTURE |
| CEI EN 62047-8 : 2012 | SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 8: STRIP BENDING TEST METHOD FOR TENSILE PROPERTY MEASUREMENT OF THIN FILMS |
| 15/30319018 DC : 0 | BS EN 62951-1 ED 1.0 - SEMICONDUCTOR DEVICES - FLEXIBLE AND STRETCHABLE SEMICONDUCTOR DEVICES - PART 1: BENDING TEST METHOD FOR CONDUCTIVE THIN FILMS ON FLEXIBLE SUBSTRATES |
| 14/30259233 DC : 0 | BS EN 62047-16 ED 1.0 - SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 16: TEST METHODS FOR DETERMINING RESIDUAL STRESSES OF MEMS FILMS; WAFER CURVATURE AND CANTILEVER BEAM DEFLECTION METHODS |
| 11/30231583 DC : 0 | BS EN 62047-17 - SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 17: BULGE TEST METHOD FOR MEASURING MECHANICAL PROPERTIES OF THIN FILMS |
| IEC 62951-1:2017 | Semiconductor devices - Flexible and stretchable semiconductor devices - Part 1: Bending test method for conductive thin films on flexible substrates |
| I.S. EN 62047-8:2011 | SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 8: STRIP BENDING TEST METHOD FOR TENSILE PROPERTY MEASUREMENT OF THIN FILMS |
| I.S. EN 62047-12:2011 | SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 12: BENDING FATIGUE TESTING METHOD OF THIN FILM MATERIALS USING RESONANT VIBRATION OF MEMS STRUCTURES (IEC 62047-12:2011) |
| IEC 62047-13:2012 | Semiconductor devices - Micro-electromechanical devices - Part 13: Bend - and shear - type test methods of measuring adhesive strength for MEMS structures |
| IEC 62047-22:2014 | Semiconductor devices - Micro-electromechanical devices - Part 22: Electromechanical tensile test method for conductive thin films on flexible substrates |
| IEC 62047-9:2011 | Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement for MEMS |
| EN 62047-9:2011 | Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement for MEMS |
| EN 62047-3 : 2006 | SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 3: THIN FILM STANDARD TEST PIECE FOR TENSILE TESTING |
| EN 62047-6:2010 | Semiconductor devices - Micro-electromechanical devices - Part 6: Axial fatigue testing methods of thin film materials |
| ISO 6892:1998 | Metallic materials Tensile testing at ambient temperature |
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Hardcopy - English - French
PDF 1 User - English - French
PDF 3 Users - English - French
PDF 5 Users - English - French
PDF 9 Users - English - French
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