Semiconductor devices - Micro-electromechanical devices - Part 30: Measurement methods of electro-mechanical conversion characteristics of MEMS piezoelectric thin film

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Hardcopy , PDF 1 User , PDF 3 Users , PDF 5 Users , PDF 9 Users

Language(s)

English

Published date

15-09-2017

Publisher

International Electrotechnical Committee

FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 Test bed of MEMS piezoelectric thin film
5 Thin film under testing
6 Test report
Annex A (informative) - Example of measuring method
of MEMS piezoelectric thin film
Bibliography

IEC 62047-30:2017(E) specifies measuring methods of electro-mechanical conversion characteristics of piezoelectric thin film used for micro sensors and micro actuators, and its reporting schema to determine the characteristic parameters for consumer, industry or any other applications of piezoelectric devices. This document applies to piezoelectric thin films fabricated by MEMS process

DevelopmentNote	Stability Date: 2022. (09/2017)
DocumentType	Standard
Pages	20
PublisherName	International Electrotechnical Committee
Status	Current

Standards	Relationship
NEN IEC 62047-30 : 2017	Identical
JIS C 5630-30:2020	Identical
BS IEC 62047-30:2017	Identical

17/30363044 DC : 0

BS EN 62047-36 - SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 36: ENVIRONMENTAL AND DIELECTRIC WITHSTAND TEST METHODS FOR MEMS PIEZOELECTRIC THIN FILMS

EN 50324-2:2002	Piezoelectric properties of ceramic materials and components - Part 2: Methods of measurement - Low power
IEC 60483:1976	Guide to dynamic measurements of piezoelectric ceramics with high electromechanical coupling

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IEC 62047-30:2017

Current

Table of Contents

Abstract

General Product Information

International Equivalents

Standards Referenced By This Book

Standards Referencing This Book

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