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IEC 62047-8:2011

Current
Current

The latest, up-to-date edition.

Semiconductor devices - Micro-electromechanical devices - Part 8: Strip bending test method for tensile property measurement of thin films
Available format(s)

Hardcopy , PDF 1 User , PDF 3 Users , PDF 5 Users , PDF 9 Users

Language(s)

English, English - French

Published date

14-03-2011

FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 Test apparatus
5 Test piece
6 Test procedure and analysis
7 Test report
Annex A (informative) - Data analysis: Test results by using
        nanoindentation apparatus
Annex B (informative) - Test piece fabrication: MEMS process
Annex C (informative) - Effect of misalignment and geometry
        on property measurement
Bibliography

IEC 62047-8:2011 specifies the strip bending test method to measure tensile properties of thin films with high accuracy, repeatability, moderate effort of alignment and handling compared to the conventional tensile test. This testing method is valid for test pieces with a thickness between 50 nm and several mum, and with an aspect ratio (ratio of length to thickness) of more than 300. The hanging strip (or bridge) between two fixed supports are widely adopted in MEMS or micro-machines. It is much easier to fabricate these strips than the conventional tensile test pieces. The test procedures are so simple to be readily automated. This international standard can be utilized as a quality control test for MEMS production since its testing throughput is very high compared to the conventional tensile test.

Committee
TC 47/SC 47F
DevelopmentNote
Stability Date: 2018. (09/2017)
DocumentType
Standard
Pages
40
PublisherName
International Electrotechnical Committee
Status
Current

Standards Relationship
NF EN 62047-8 : 2011 Identical
NBN EN 62047-8 : 2011 Identical
NEN EN IEC 62047-8 : 2011 Identical
I.S. EN 62047-8:2011 Identical
PN EN 62047-8 : 2011 Identical
UNE-EN 62047-8:2011 Identical
BS EN 62047-8:2011 Identical
CEI EN 62047-8 : 2012 Identical
EN 62047-8:2011 Identical
DIN EN 62047-8:2011-12 Identical

BS EN 62047-22:2014 Semiconductor devices. Micro-electromechanical devices Electromechanical tensile test method for conductive thin films on flexible substrates
CEI EN 62047-10 : 2012 SEMICONDUCTOR DEVICES - MICROELECTROMECHANICAL DEVICES - PART 10: MICRO-PILLAR COMPRESSION TEST FOR MEMS MATERIALS
17/30352696 DC : DRAFT SEP 2017 BS IEC 62047-31 ED1.0 - SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 31: FOUR-POINT BENDING TEST METHOD FOR INTERFACIAL ADHESION ENERGY OF LAYERED MEMS MATERIALS
10/30211442 DC : 0 BS EN 62047-10 - SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 10: MICROPILLAR COMPRESSION TEST FOR MEMS MATERIALS
CEI EN 62047-21 : 2016 SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 21: TEST METHOD FOR POISSON'S RATIO OF THIN FILM MEMS MATERIALS
EN 62047-21:2014 Semiconductor devices - Micro-electromechanical devices - Part 21: Test method for Poisson's ratio of thin film MEMS materials
I.S. EN 62047-10:2011 SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 10: MICRO-PILLAR COMPRESSION TEST FOR MEMS MATERIALS (IEC 62047-10:2011 (EQV))
I.S. EN 62047-22:2014 SEMICONDUCTOR DEVICES - MICROELECTROMECHANICAL DEVICES - PART 22: ELECTROMECHANICAL TENSILE TEST METHOD FOR CONDUCTIVE THIN FILMS ON FLEXIBLE SUBSTRATES
NF EN 62047-22 : 2014 SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 22: ELECTROMECHANICAL TENSILE TEST METHOD FOR CONDUCTIVE THIN FILMS ON FLEXIBLE SUBSTRATES
BS EN 62047-10:2011 Semiconductor devices. Micro-electromechanical devices Micro-pillar compression test for MEMS materials
IEC 62047-29:2017 Semiconductor devices - Micro-electromechanical devices - Part 29: Electromechanical relaxation test method for freestanding conductive thin-films under room temperature
IEC 62047-21:2014 Semiconductor devices - Micro-electromechanical devices - Part 21: Test method for Poisson's ratio of thin film MEMS materials
IEC 62047-10:2011 Semiconductor devices - Micro-electromechanical devices - Part 10: Micro-pillar compression test for MEMS materials
I.S. EN 62047-21:2014 SEMICONDUCTOR DEVICES - MICROELECTROMECHANICAL DEVICES - PART 21: TEST METHOD FOR POISSON'S RATIO OF THIN FILM MEMS MATERIALS
BS EN 62047-21:2014 Semiconductor devices. Micro-electromechanical devices Test method for Poisson\'s ratio of thin film MEMS materials
EN 62047-22:2014 Semiconductor devices - Micro-electromechanical devices - Part 22: Electromechanical tensile test method for conductive thin films on flexible substrates
NF EN 62047-21 : 2014 SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 21: TEST METHOD FOR POISSON'S RATIO OF THIN FILM MEMS MATERIALS
IEC 62047-22:2014 Semiconductor devices - Micro-electromechanical devices - Part 22: Electromechanical tensile test method for conductive thin films on flexible substrates
EN 62047-10 : 2011 SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 10: MICRO-PILLAR COMPRESSION TEST FOR MEMS MATERIALS (IEC 62047-10:2011)

IEC 62047-2:2006 Semiconductor devices - Micro-electromechanical devices - Part 2: Tensile testing method of thin film materials
IEC 62047-3:2006 Semiconductor devices - Micro-electromechanical devices - Part 3: Thin film standard test piece for tensile testing

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