Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-2: Shear strength test

Available format(s)

Hardcopy , PDF 1 User , PDF 3 Users , PDF 5 Users , PDF 9 Users

Language(s)

English, English - French

Published date

25-07-2007

Publisher

International Electrotechnical Committee

FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 General remarks
5 Test equipment and materials
   5.1 Shear test equipment
   5.2 Pushing tool
   5.3 Optical microscope
   5.4 Scanning electron microscope (SEM)
   5.5 Reflow soldering oven
   5.6 Test substrate
   5.7 Solder alloy
   5.8 Solder paste
6 Mounting method
7 Test conditions
   7.1 Test: Rapid change of temperature
   7.2 Shear strength test
8 Test procedure
   8.1 Test sequence
   8.2 Pre-conditioning
   8.3 Initial shear strength
   8.4 Rapid change of temperature
   8.5 Recovery
   8.6 Intermediate/final shear strength
9 Items to be included in the test report
10 Items to be given in the product specification
Annex A (normative) Shear strength test - Details
Bibliography

The test method described in IEC 62137-1-2:2007 is applicable to leadless surface mounting components and surface mounting connectors to which pull test is not applicable. It is not applicable to multi-lead components and gull-wing leads. The method is designed to test and evaluate the endurance of the solder joint between component terminals and lands on a substrate, by means of a shear type mechanical stress. This test is applicable to evaluate the effects of repeated temperature change on the strength of the solder joints between terminals and lands on a substrate.

Committee	TC 91
DevelopmentNote	A Bilingual edition has been published. (05/2008) Stability Date: 2020. (09/2017)
DocumentType	Standard
Pages	17
PublisherName	International Electrotechnical Committee
Status	Current

Standards	Relationship
NF EN 62137-1-2 : 2014	Identical
NEN EN IEC 62137-1-2 : 2007	Identical
I.S. EN 62137-1-2:2007	Identical
PN EN 62137-1-2 : 2008	Identical
UNE-EN 62137-1-2:2007	Identical
BS EN 62137-1-2:2007	Identical
CEI EN 62137-1-2 : 2008	Identical
EN 62137-1-2:2007	Identical
DIN EN 62137-1-2:2008-02	Identical
JIS C 62137-1-2:2010	Identical

BS EN 62137-3:2012	Electronics assembly technology Selection guidance of environmental and endurance test methods for solder joints
EN 62878-1-1:2015	Device embedded substrate - Part 1-1: Generic specification - Test methods
09/30206176 DC : DRAFT JUNE 2009	BS EN 62137-3 ED.1 - ELECTRONICS ASSEMBLY TECHNOLOGY - PART 3: SELECTION GUIDANCE OF ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SOLDER JOINTS
IEC PAS 62137-3:2008	Electronics assembly technology - Selection guidance of environmental and endurance test methods for solder joints
DD IEC PAS 62137-3 : DRAFT 2008	ELECTRONICS ASSEMBLY TECHNOLOGY - SELECTION GUIDANCE OF ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SOLDER JOINTS
BS EN 62321-2:2014	Determination of certain substances in electrotechnical products Disassembly, disjointment and mechanical sample preparation
BS EN 62878-1-1:2015	Device embedded substrate Generic specification. Test methods
I.S. EN 62878-1-1:2015	DEVICE EMBEDDED SUBSTRATE - PART 1-1: GENERIC SPECIFICATION - TEST METHODS
IEC 62137-3:2011	Electronics assembly technology - Part 3: Selection guidance of environmental and endurance test methods for solder joints
CEI EN 62137-3 : 2012	ELECTRONICS ASSEMBLY TECHNOLOGY - PART 3: SELECTION GUIDANCE OF ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SOLDER JOINTS
I.S. EN 62137-3:2012	ELECTRONICS ASSEMBLY TECHNOLOGY - PART 3: SELECTION GUIDANCE OF ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SOLDER JOINTS (IEC 62137-3:2011 (EQV))
I.S. EN 62321-2:2014	DETERMINATION OF CERTAIN SUBSTANCES IN ELECTROTECHNICAL PRODUCTS - PART 2: DISASSEMBLY, DISJOINTMENT AND MECHANICAL SAMPLE PREPARATION
EN 62321-2:2014	Determination of certain substances in electrotechnical products - Part 2: Disassembly, disjointment and mechanical sample preparation
EN 62137-3:2012	Electronics assembly technology - Part 3: Selection guidance of environmental and endurance test methods for solder joints

IEC 61188-5-2:2003	Printed boards and printed board assemblies - Design and use - Part 5-2: Attachment (land/joint) considerations - Discrete components
IEC 60068-1:2013	Environmental testing - Part 1: General and guidance
IEC 61190-1-2:2014	Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
IEC 61249-2-7:2002	Materials for printed boards and other interconnecting structures - Part 2-7: Reinforced base materials clad and unclad - Epoxide woven E-glass laminated sheet of defined flammability (vertical burning test), copper-clad
IEC 60068-2-21:2006	Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices
IEC 61760-1:2006	Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs)
IEC 60194:2015	Printed board design, manufacture and assembly - Terms and definitions
IEC 61188-5-5:2007	Printed boards and printed board assemblies - Design and use - Part 5-5: Attachment (land/joint) considerations - Components with gull-wing leads on four sides
IEC 60068-2-14:2009	Environmental testing - Part 2-14: Tests - Test N: Change of temperature
IEC 61190-1-3:2007+AMD1:2010 CSV	Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications

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IEC 62137-1-2:2007

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